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NXP Semiconductors MKL03Z32VFG4R

Part No.:
MKL03Z32VFG4R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-UFQFN Exposed Pad
Datasheet:
AetrixMKL03Z32VFG4R.pdf
Description:
IC MCU 32BIT 32KB FLASH 16QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,606

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Product details

Overview

MKL03Z32VFG4R from NXP Semiconductors is an ARM® Cortex-M0+ microcontroller delivering 48 MHz operation with 32 KB flash, 2 KB SRAM, and 8 KB ROM bootloader in a 16-pin QFN (3 × 3 × 0.65 mm, 0.5 mm pitch). It targets ultra-low-power IoT edge nodes requiring compact size, sub-μA deep-sleep current (77 nA), and fast wake-up (7.5 μs) with full register retention.

For engineers reviewing the MKL03Z32VFG4R datasheet, MKL03Z32VFG4R pinout, MKL03Z32VFG4R application, or MKL03Z32VFG4R equivalent, key selection criteria include its 14 GPIO count, integrated 12-bit SAR ADC (818 ksps, 7 channels), LPUART/I²C/SPI interfaces, and support for nine low-power modes across –40 to 105°C ambient range.

Technical Context

The MKL03Z32VFG4R implements a single-core ARM Cortex-M0+ architecture with tightly coupled Micro Trace Buffer (MTB) and Bit Manipulation Engine (BME) for efficient embedded control. Its clock system integrates a factory-trimmed 48 MHz high-accuracy internal reference (HIRC), dual low-power oscillators (8/2 MHz LIRC, 1 kHz LPO), and 32–40 kHz crystal support.

Power management includes five distinct low-leakage stop modes (VLLS0–VLLS3), with VLLS1 achieving 77 nA at 3.0 V and VLLS3 delivering 1.08 μA (RTC enabled) - all featuring configurable wake-up sources via Low-Leakage Wakeup Unit (LLWU) and COP watchdog.

Key Specifications

Parameter Value and Actual Design Meaning
Core ARM Cortex-M0+, up to 48 MHz - enables real-time sensor processing and protocol stack execution in resource-constrained edge devices.
Memory 32 KB flash / 2 KB SRAM / 8 KB ROM bootloader - supports firmware updates over LPUART and secure boot without external memory.
ADC 12-bit SAR, 7 channels, 818 ksps - sufficient for multi-sensor analog acquisition (e.g., temperature, voltage, current) with internal 1.2 V reference.
Low-Power Performance 77 nA in VLLS1 mode, 7.5 μs wake-up time - enables battery-powered operation for years in periodic-sensing applications.
I/O Count 14 GPIO pins - fits compact PCB layouts while supporting UART, I²C, SPI, and analog inputs simultaneously.
Operating Voltage 1.71–3.6 V - compatible with coin cells (e.g., CR2032), Li-ion single-cell, and regulated 3.3 V rails.
Temperature Range –40 to 105°C - qualified for industrial and automotive under-hood environments using QFN package.

Pinout & Package

Package: 16-pin QFN (3 mm × 3 mm × 0.65 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level (MSL) 3.

Pin/Terminal Circuit Role Design Meaning
VDD Digital supply input Primary power rail (1.71–3.6 V); decoupling capacitor required per datasheet layout guidelines.
VSS Digital ground Reference return for digital logic and I/O; must be connected to system ground plane.
VDDA Analog supply input Separate 1.71–3.6 V rail for ADC/comparator; requires dedicated filtering to minimize noise coupling.
VSSA Analog ground Isolated analog return; recommended to tie to digital ground at single point near VDDA/VSSA pins.
PTA0 / ADC0_SE0 GPIO / ADC input channel 0 Configurable as digital I/O or analog input for single-ended ADC conversion.
PTA1 / ADC0_SE1 GPIO / ADC input channel 1 Shared function pin supporting analog sensing or general-purpose control signaling.
PTA2 / LPUART0_RX GPIO / UART receive Enables low-power serial communication; supports wake-up on start bit detection.
PTA3 / LPUART0_TX GPIO / UART transmit Drives UART output with programmable slew rate and drive strength.
PTA4 / I2C0_SCL GPIO / I²C clock Open-drain capable; internal pull-up resistors (20–50 kΩ) configurable via software.
PTA5 / I2C0_SDA GPIO / I²C data Open-drain I²C bus line with glitch filtering and noise suppression features.
PTA6 / SPI0_SCK GPIO / SPI clock Master or slave clock output/input; supports up to 12 MHz operation in standard mode.
PTA7 / SPI0_MOSI GPIO / SPI master-out-slave-in Transmits data from MCU to peripheral; configurable for LSB/MSB first and polarity.
PTB0 / SPI0_MISO GPIO / SPI master-in-slave-out Receives data from peripheral; includes input synchronization for reliable sampling.
PTB1 / SPI0_PCS0 GPIO / SPI chip select 0 Active-low enable for primary SPI slave device; supports automatic deassertion after transfer.
RESET_b Active-low reset input Asynchronous reset pin; also functions as GPIO with active pull-down when not used as RESET.
SWD_DIO / SWD_CLK Debug interface signals Two-pin Serial Wire Debug (SWD) interface for programming and real-time debugging.

Key Features

Feature Design Value
Ultra-small footprint 3 × 3 mm QFN package - reduces PCB area by >50% vs. comparable 24-pin QFN MCUs, enabling wearable and implantable designs.
Multi-tier low-power architecture Nine configurable power modes including VLLS0 (77 nA), VLLS3 (1.08 μA), and VLPS (2.2 μA) - extends battery life in intermittent-sensing applications.
Integrated analog subsystem 12-bit ADC (818 ksps), 6-bit DAC, analog comparator, and 1.2 V internal reference - eliminates need for external signal-conditioning ICs.
Boot ROM with UART loader 8 KB ROM containing factory-programmed bootloader - enables field firmware updates without JTAG/SWD hardware.
Hardware security elements 80-bit unique identification number per chip - supports device authentication and secure provisioning in IoT deployments.

Applications

Smart Sensor Node Wireless Beacon

Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and motion data every 5 minutes.

IC Role / Device Role / Timing Role: Central controller executing sensor polling, ADC conversion, data preprocessing, and LPUART transmission to BLE module.

Use Value: 77 nA VLLS1 sleep current and 7.5 μs wake-up enable >5-year operation on a CR2032 cell with minimal duty cycling overhead.

Use Scenario: Compact indoor location beacon transmitting iBeacon/Eddystone packets via UART-connected BLE SoC.

IC Role / Device Role / Timing Role: Host controller managing packet generation, timing synchronization, and power-gating of BLE radio during idle periods.

Use Value: Integrated 48 MHz HIRC clock ensures precise 100 ms advertising interval timing without external crystal, reducing BOM cost and board space.

Industrial Control Interface Medical Wearable

Use Scenario: DIN-rail mounted I/O module converting 4–20 mA analog inputs to Modbus RTU over RS-485.

IC Role / Device Role / Timing Role: Signal conditioner and protocol translator handling ADC sampling, CRC calculation, and UART-to-RS485 framing.

Use Value: –40 to 105°C operating range and robust ESD rating (±2 kV HBM) ensure reliability in harsh factory environments without thermal derating.

Use Scenario: Disposable patch monitoring heart rate and skin temperature, transmitting alerts via Bluetooth LE.

IC Role / Device Role / Timing Role: Ultra-low-power data acquisition engine acquiring analog biosignals, performing baseline correction, and triggering BLE wake-up on anomaly detection.

Use Value: 14 GPIOs support simultaneous connection of photodiode, thermistor, and battery voltage monitor while maintaining <3 mm² PCB footprint.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MKL03Z32VFK4R 24-pin QFN (4 × 4 mm), 22 GPIOs, same core/peripherals - larger footprint but higher I/O count and extended temperature range (–40 to 105°C). Suitable for designs requiring more analog/digital I/O or board-level routing flexibility where space permits. Select MKL03Z32VFK4R when additional GPIOs or enhanced thermal margin outweigh size constraints.
STM32L011K4T6 ARM Cortex-M0+, 16 KB flash, 2 KB SRAM, 32-pin TSSOP - lower memory density, different peripheral set (no integrated bootloader ROM, no 6-bit DAC). Better suited for cost-sensitive, non-battery-critical applications where external bootloader is acceptable. Choose STM32L011K4T6 only if flash requirement is ≤16 KB and design can accommodate external programming infrastructure.

Compared with MKL03Z32VFK4R, the MKL03Z32VFG4R trades I/O count and package size for minimal PCB area - ideal for space-constrained IoT endpoints. Against STM32L011K4T6, it offers higher flash, integrated ROM bootloader, and superior ultra-low-power stop modes, making it preferable for secure, long-life battery operation.

Availability

MKL03Z32VFG4R is available at Aetrix Electronics and suitable for smart sensor nodes, wireless beacons, and industrial control interfaces requiring stable component supply, long-term lifecycle support, and guaranteed traceability.

Supply support for MKL03Z32VFG4R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with R&D centers across 30+ countries and ISO 9001-certified manufacturing.

The Kinetis KL03 family delivers ultra-low-power ARM Cortex-M0+ MCUs targeting miniaturized, battery-operated edge devices - emphasizing minimal footprint, sub-μA sleep currents, and integrated analog peripherals for rapid sensor-node development.

FAQ

What is the maximum operating frequency of the MKL03Z32VFG4R?

The MKL03Z32VFG4R operates at a maximum core frequency of 48 MHz using its factory-trimmed high-accuracy internal reference clock (HIRC). This frequency is fully supported across the full –40 to 105°C temperature range and 1.71–3.6 V supply voltage, enabling deterministic real-time performance without external crystal dependency.

Does the MKL03Z32VFG4R include a hardware bootloader?

Yes, the MKL03Z32VFG4R contains 8 KB of ROM with a factory-programmed bootloader that supports UART-based firmware updates. This allows field reprogramming of the 32 KB flash memory without requiring JTAG or SWD debug hardware, simplifying production programming and remote maintenance workflows.

What is the lowest achievable power consumption mode for MKL03Z32VFG4R?

The MKL03Z32VFG4R achieves 77 nA in Very-Low-Leakage Stop Mode 1 (VLLS1) at 3.0 V and 25°C with full register retention and RAM retention disabled. This mode supports wake-up via LLWU sources including GPIO, RTC alarm, or LPUART start-bit detection - critical for multi-year battery life in intermittent-sensing applications.

How many analog input channels does the MKL03Z32VFG4R ADC support?

The MKL03Z32VFG4R integrates a 12-bit SAR ADC with 7 single-ended input channels (ADC0_SE0 through ADC0_SE6), mapped to dedicated GPIO pins PTA0–PTA6. All channels share the internal 1.2 V voltage reference and support programmable sample times and hardware averaging for improved noise immunity.

Is the MKL03Z32VFG4R pin-compatible with other Kinetis KL03 variants?

Yes, the MKL03Z32VFG4R shares identical pinout and footprint with all other 16-pin QFN variants in the KL03 family (e.g., MKL03Z8VFG4R, MKL03Z16VFG4R). This enables seamless memory-scaling upgrades within the same PCB layout, provided flash/RAM requirements and peripheral usage remain compatible with the target variant's specifications.

MKL03Z32VFG4R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-UFQFN Exposed Pad
Series:
Kinetis KL03
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O:
14
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 7x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MKL03Z32VFG4R FAQ

1.How can I place an order for MKL03Z32VFG4R through Aetrix?

Please submit a Request for Quotation (RFQ) for MKL03Z32VFG4R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MKL03Z32VFG4R reliable?

The price and inventory of MKL03Z32VFG4R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MKL03Z32VFG4R is usually 5 days.

3.What payment methods are accepted for MKL03Z32VFG4R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MKL03Z32VFG4R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MKL03Z32VFG4R?

MKL03Z32VFG4R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MKL03Z32VFG4R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MKL03Z32VFG4R?

For technical support, including MKL03Z32VFG4R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MKL03Z32VFG4R requirements.

6.How does Aetrix verify that MKL03Z32VFG4R is sourced from the original manufacturer or authorized distributors?

All MKL03Z32VFG4R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MKL03Z32VFG4R meets industry standards.

7.What is the process for return or replacement of MKL03Z32VFG4R?

All MKL03Z32VFG4R units undergo pre-shipment inspection (PSI). If there is an issue with MKL03Z32VFG4R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MKL03Z32VFG4R part is unused and in its original packaging.

Return procedure for MKL03Z32VFG4R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MKL03Z32VFG4R Tags

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