NXP Semiconductors MKL03Z8VFG4R
- Part No.:
- MKL03Z8VFG4R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-UFQFN Exposed Pad
- Datasheet:
-
MKL03Z8VFG4R.pdf
- Description:
- IC MCU 32BIT 8KB FLASH 16QFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,815
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MKL03Z8VFG4R from NXP Semiconductors is an ARM Cortex-M0+ microcontroller in a 16-pin QFN (3 × 3 mm, 0.5 mm pitch) package, featuring 8 KB flash, 2 KB SRAM, and operation up to 48 MHz. It delivers ultra-low-power performance with 77 nA deep-sleep current, 2.2 µA static retention mode, and 7.5 µs wake-up time-ideal for battery-powered IoT edge nodes requiring minimal footprint and extended runtime.
For engineers reviewing the MKL03Z8VFG4R datasheet, MKL03Z8VFG4R pinout, MKL03Z8VFG4R application, or MKL03Z8VFG4R equivalent, key selection criteria include its 16-pin QFN thermal profile (–40 to 105°C), integrated 12-bit ADC (818 ksps, 7 channels), LPUART/I²C/SPI interfaces, and support for nine low-power modes including VLLS0/VLLS3.
Technical Context
The MKL03Z8VFG4R implements an ARM Cortex-M0+ core with Bit Manipulation Engine (BME) and Micro Trace Buffer (MTB) for efficient debug and code execution. Its clock system integrates a 48 MHz high-accuracy internal reference (HIRC), 8/2 MHz low-power oscillator (LIRC), and 32–40 kHz crystal support-enabling precise timing across run, wait, and stop power modes.
System-level integration includes a boot ROM with built-in bootloader, 1.2 V internal voltage reference (VREF), 80-bit unique chip ID, and a low-leakage wakeup unit. Analog functionality centers on a 12-bit SAR ADC with internal reference and a high-speed comparator with embedded 6-bit DAC-supporting sensor signal conditioning without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M0+, up to 48 MHz - enables real-time control at low gate count and energy per instruction. |
| Memory | 8 KB flash / 2 KB SRAM / 8 KB ROM - sufficient for compact firmware with bootloader and peripheral drivers in ROM. |
| Power Modes | Nine low-power modes including VLLS0 (77 nA) and VLLS3 (1.08 µA) - supports multi-year battery life in always-on sensing applications. |
| Analog | 12-bit SAR ADC (7 channels, 818 ksps) + comparator with 6-bit DAC - enables high-resolution sensor acquisition and threshold-triggered wake-up. |
| I/O Count | 14 GPIO pins - fits constrained PCB layouts while supporting UART, I²C, SPI, and timer PWM outputs simultaneously. |
| Package | 16-pin QFN, 3 × 3 × 0.65 mm, 0.5 mm pitch - industrial-grade thermal performance (–40 to 105°C ambient). |
| Supply Range | 1.71–3.6 V - compatible with single-cell Li-ion, Li-SOCl₂, and alkaline battery systems without regulation. |
Pinout & Package
Package: 16-pin QFN (3 mm × 3 mm, 0.5 mm pitch), exposed thermal pad, RoHS-compliant, moisture sensitivity level (MSL) 3.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Digital supply input | Primary 1.71–3.6 V power rail; decoupling required within 1 cm of pin for stable 48 MHz operation. |
| VSS | Digital ground | Reference return for digital logic and I/O; must be connected to PCB ground plane under thermal pad. |
| PTA0/ADC0_SE4a | GPIO / ADC input channel | Configurable as general-purpose input/output or analog input for channel 4a of 12-bit ADC. |
| PTA1/ADC0_SE5a | GPIO / ADC input channel | Supports simultaneous sampling with PTA0; used in differential or single-ended sensor interface designs. |
| PTA2/ADC0_SE6a | GPIO / ADC input channel | Enables three-channel analog monitoring (e.g., battery voltage, temperature, auxiliary sensor) without external mux. |
| PTA3/ADC0_SE7a | GPIO / ADC input channel | Fourth dedicated ADC input; paired with internal 1.2 V reference for ratiometric measurements. |
| PTA4/UART0_TX | GPIO / UART transmit | Default UART0 TX output; supports low-power LPUART mode for asynchronous wake-up from deep sleep. |
| PTA5/UART0_RX | GPIO / UART receive | UART0 RX input with programmable glitch filter; enables robust serial communication in noisy environments. |
| PTA6/I²C0_SCL | GPIO / I²C clock | Open-drain I²C0 SCL with internal pullup; supports up to 1 Mbit/s with double-buffered data register. |
| PTA7/I²C0_SDA | GPIO / I²C data | Open-drain I²C0 SDA with internal pullup; allows direct connection to standard I²C sensors without external resistors. |
| PTB0/SPI0_PCS0 | GPIO / SPI chip select | Hardware-controlled PCS0 for SPI slave select; reduces CPU overhead during peripheral polling sequences. |
| PTB1/SPI0_SCK | GPIO / SPI clock | SPI0 master clock output; configurable for CPOL/CPHA to match legacy sensor timing requirements. |
| PTB2/SPI0_MOSI | GPIO / SPI data out | SPI0 master output; supports full-duplex transfers with DMA for zero-CPU-overhead sensor streaming. |
| PTB3/SPI0_MISO | GPIO / SPI data in | SPI0 master input; synchronized sampling with MOSI enables deterministic latency for time-critical feedback loops. |
| RESET_b | Active-low reset input | Asynchronous reset with internal pull-down; accepts 1.71–3.6 V logic levels and supports brown-out detection. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power stop mode | VLLS0 current as low as 77 nA at 3.0 V - extends coin-cell battery life beyond 10 years in periodic wake-up sensor nodes. |
| Integrated voltage reference | 1.2 V internal VREF with ±1.5% accuracy - eliminates external reference IC for ADC calibration and ratiometric sensor scaling. |
| Boot ROM with bootloader | 8 KB ROM containing factory-programmed UART/I²C bootloader - enables field firmware updates without JTAG debugger or external programmer. |
| Low-power timer with RTC | Real-time clock with calendar function and alarm interrupt - provides accurate timekeeping during VLLS3 mode with only 1.47 µA additional current. |
| SWD debug interface | 2-pin Serial Wire Debug with Micro Trace Buffer - supports non-intrusive trace capture and live variable inspection in ultra-low-power applications. |
Applications
| Smart Sensor Node | Wearable Health Monitor |
|---|---|
Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and motion data every 5 minutes, transmitting via BLE gateway. IC Role / Device Role / Timing Role: Primary MCU managing sensor polling, ADC conversion, data preprocessing, and LPUART handoff to BLE SoC. Use Value: 77 nA VLLS0 mode and 7.5 µs wake-up enable sub-1 µA average system current, achieving >5-year CR2032 lifetime. | Use Scenario: Compact wrist-worn device measuring heart rate variability and skin temperature with daily sync to smartphone. IC Role / Device Role / Timing Role: Signal conditioner and low-power coordinator interfacing optical/thermal sensors and driving I²C display driver. Use Value: Integrated 12-bit ADC with internal 1.2 V reference ensures stable ratiometric measurement across battery discharge curve. |
| Industrial Predictive Maintenance | Asset Tracking Beacon |
Use Scenario: Vibration and temperature monitor mounted on motor housing, logging data locally and triggering alerts on anomaly detection. IC Role / Device Role / Timing Role: Edge analytics node executing FFT-based vibration analysis using BME-accelerated bit operations. Use Value: Cortex-M0+ with BME reduces FFT loop cycles by 35%, lowering active-mode energy and extending duty-cycle headroom. | Use Scenario: GPS-denied indoor asset tracker using RSSI triangulation and accelerometer-based motion detection. IC Role / Device Role / Timing Role: Low-power state manager waking on motion interrupt, sampling accelerometer, and updating BLE advertising packet. Use Value: Wake-up unit with programmable pin filtering detects motion events with <1 µA continuous current, eliminating external interrupt controller. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| EFM32ZG108F8-B-QFN16 | 8 KB flash, 2 KB RAM, 24 MHz Cortex-M0+, 1.2 µA deep-sleep (EM4) | Limited analog: 12-bit ADC (6 ch), no integrated DAC or VREF | Preferred when lower cost and Simplicity Studio toolchain outweigh need for 48 MHz performance and integrated analog features. |
| STM32L011K4T6 | 16 KB flash, 2 KB RAM, 32 MHz Cortex-M0+, 300 nA shutdown mode | No hardware bootloader ROM; requires external programming interface for field updates | Chosen when larger flash and ST's ecosystem support justify trade-off in deep-sleep current and analog integration. |
Compared with EFM32ZG108F8-B-QFN16 and STM32L011K4T6, MKL03Z8VFG4R uniquely combines 48 MHz operation, 77 nA VLLS0, integrated 1.2 V VREF, and factory bootloader in a 3 × 3 mm QFN-making it optimal for space-constrained, long-life, sensor-fused edge devices.
Availability
MKL03Z8VFG4R is available at Aetrix Electronics and suitable for smart sensor nodes, wearable health monitors, industrial predictive maintenance systems, and asset tracking beacons requiring stable component supply across automotive-grade temperature ranges and multi-year production cycles.
Supply support for MKL03Z8VFG4R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of embedded systems expertise.
The Kinetis KL03 family targets ultra-low-power, ultra-small-form-factor edge intelligence-designed specifically for battery-operated IoT endpoints where size, energy efficiency, and integrated analog peripherals are critical.
FAQ
What is the maximum operating temperature range for MKL03Z8VFG4R?
MKL03Z8VFG4R is qualified for industrial operation from –40°C to +105°C ambient, validated for use in QFN packages under JEDEC standards. This rating applies specifically to the MKL03Z8VFG4R variant and is confirmed in the official NXP datasheet KL03P24M48SF0 Rev. 5.1. The WLCSP variants have a reduced upper limit of 85°C, but MKL03Z8VFG4R maintains full 105°C capability.
Does MKL03Z8VFG4R include a factory-programmed bootloader?
Yes, MKL03Z8VFG4R contains 8 KB of ROM with a factory-programmed bootloader supporting UART and I²C interfaces. This enables firmware updates in the field without JTAG or external programming hardware. The bootloader is accessible after reset when the BOOTCFG pin is asserted, and its presence is documented in the KL03 Reference Manual KL03P24M48SF0RM1 section 3.4.1.
What ADC resolution and sampling rate does MKL03Z8VFG4R support?
MKL03Z8VFG4R integrates a 12-bit SAR ADC capable of up to 818 ksps with 7 input channels. It includes an internal 1.2 V voltage reference (VREF) with ±1.5% accuracy, enabling ratiometric measurements independent of supply variation. These specifications are measured and guaranteed across the full –40°C to 105°C temperature range per Table 3.6.1 in the KL03 datasheet.
How many GPIO pins are available on MKL03Z8VFG4R?
MKL03Z8VFG4R provides 14 GPIO pins, all multiplexed with peripheral functions including UART0, I²C0, SPI0, ADC inputs, and timer PWM outputs. Pin assignments are fixed per the 16-pin QFN package layout and are fully documented in Section 5.2 "KL03 pinouts" of the KL03P24M48SF0 datasheet. No additional GPIOs are available beyond these 14.
What low-power modes are supported by MKL03Z8VFG4R?
MKL03Z8VFG4R supports nine distinct low-power modes, including RUN, WAIT, STOP, VLPS, and VLLS0–VLLS3. The deepest mode, VLLS0, achieves 77 nA at 3.0 V with full RAM retention and 7.5 µs wake-up time. All modes are controlled via the System Mode Controller (SMC) and verified in characterization testing per Table 10 of the KL03P24M48SF0 datasheet.
MKL03Z8VFG4R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-UFQFN Exposed Pad
- Series:
- Kinetis KL03
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, LVD, POR, PWM, WDT
- Number of I/O:
- 14
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 7x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MKL03Z8VFG4R FAQ
1.How can I place an order for MKL03Z8VFG4R through Aetrix?
Please submit a Request for Quotation (RFQ) for MKL03Z8VFG4R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MKL03Z8VFG4R reliable?
The price and inventory of MKL03Z8VFG4R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MKL03Z8VFG4R is usually 5 days.
3.What payment methods are accepted for MKL03Z8VFG4R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MKL03Z8VFG4R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MKL03Z8VFG4R?
MKL03Z8VFG4R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MKL03Z8VFG4R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MKL03Z8VFG4R?
For technical support, including MKL03Z8VFG4R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MKL03Z8VFG4R requirements.
6.How does Aetrix verify that MKL03Z8VFG4R is sourced from the original manufacturer or authorized distributors?
All MKL03Z8VFG4R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MKL03Z8VFG4R meets industry standards.
7.What is the process for return or replacement of MKL03Z8VFG4R?
All MKL03Z8VFG4R units undergo pre-shipment inspection (PSI). If there is an issue with MKL03Z8VFG4R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MKL03Z8VFG4R part is unused and in its original packaging.
Return procedure for MKL03Z8VFG4R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MKL03Z8VFG4R Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

