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Home > Products > Integrated Circuits (ICs) > Embedded > Microcontrollers

NXP Semiconductors MKL16Z256VLH4R

Name: MKL16Z256VLH4R
Brand: NXP Semiconductors
SKU: MKL16Z256VLH4R
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MKL16Z256VLH4R

Manufacturer:: NXP Semiconductors

Category:: Microcontrollers

Package:: 64-LQFP

Datasheet:: MKL16Z256VLH4R.pdf

Description:: IC MCU 32BIT 256KB FLASH 64LQFP

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Product details

Overview

MKL16Z256VLH4R from NXP Semiconductors (formerly Freescale) is a 48 MHz ARM Cortex-M0+ based microcontroller in the Kinetis KL16 sub-family, featuring 256 KB flash, 32 KB SRAM, and ultra-low-power operation down to 0.41 µA in VLLS0 mode with full state retention. It integrates a 16-bit SAR ADC, 12-bit DAC, two UARTs, two I²C modules, two SPI interfaces, I²S/SAI, TSI touch interface, and six-channel TPM - deployed in industrial sensor nodes, portable medical devices, and battery-powered HMI systems.

For engineers reviewing the MKL16Z256VLH4R datasheet, MKL16Z256VLH4R pinout, MKL16Z256VLH4R application, or MKL16Z256VLH4R equivalent, this page delivers verified electrical specs, low-power mode timing, LQFP-64 package mapping, real-world use-value metrics for VLPR/VLPS current, and validated alternative MCUs for migration or second-sourcing - all grounded in the KL16P64M48SF4 Rev 5 datasheet and official NXP documentation.

Technical Context

The MKL16Z256VLH4R implements an ARM Cortex-M0+ core with Bit Manipulation Engine and Micro Trace Buffer, paired with a multi-mode clock system including internal 4 MHz IRC, 32 kHz LPO, and external crystal support (3–32 MHz). Its power architecture features nine low-power modes (VLPR, VLPS, LLS, VLLS0–3), dynamic clock gating, and zero-wait-state flash - enabling deterministic 4.5 µs wake-up from STOP mode and 2 µA static retention.

Peripheral integration includes a hardware TSI module supporting up to 54 GPIOs, dual DMA channels servicing 63 request sources, COP watchdog, and analog subsystem with 16-bit ADC (±1 LSB INL), 12-bit DAC (±1 LSB DNL), and comparator with integrated 6-bit DAC reference - all operating across –40°C to +105°C ambient temperature at 1.71–3.6 V supply.

Key Specifications

Parameter	Value and Actual Design Meaning
Core	ARM Cortex-M0+, 48 MHz max - delivers 1.25 DMIPS/MHz for deterministic real-time control in resource-constrained edge nodes.
Memory	256 KB flash (zero-wait-state), 32 KB SRAM - supports firmware over-the-air updates and local data buffering without external memory.
Power Modes	VLLS0: 0.41 µA @ 3.0 V, 25°C (PORPO=1); VLPR: 192 µA @ 4 MHz core, 3.0 V - enables multi-year battery life in coin-cell-powered sensors.
Analog	16-bit SAR ADC (1 MSps, ±1 LSB INL), 12-bit DAC (±1 LSB DNL), CMP with 6-bit DAC reference - suitable for precision signal conditioning and closed-loop control.
I/O & Interfaces	54 GPIOs (100 mA total sink/source), 2× UART, 2× I²C, 2× SPI, I²S/SAI, TSI - supports mixed-signal HMI, serial telemetry, and capacitive touch without external controllers.
Operating Range	1.71–3.6 V supply, –40°C to +105°C ambient - certified for industrial automation, automotive body electronics, and medical wearables.
Package	64-pin LQFP (10 × 10 × 1.4 mm, 0.5 mm pitch) - compatible with standard reflow profiles and manual inspection workflows.

Pinout & Package

64-pin LQFP (LH) package per drawing 98ASS23234W1: 10 mm × 10 mm body, 1.4 mm height, 0.5 mm lead pitch, exposed thermal pad (EPAD) connected to VSS. RoHS-compliant, moisture sensitivity level (MSL) 3.

Pin/Terminal	Circuit Role	Design Meaning
VDD, VDDA, VSS, VSSA	Power and ground rails	Digital (VDD/VSS) and analog (VDDA/VSSA) supplies require separate decoupling; ≤0.1 V differential between VDD–VDDA and VSS–VSSA ensures ADC/DAC accuracy.
PTA0–PTA31, PTB0–PTB17, PTC0–PTC17, PTD0–PTD15	GPIO bank terminals	54 total configurable pins with digital filtering, slew-rate control, and high-drive capability on select pins (e.g., PTB0/PTB1) for driving LEDs or small relays directly.
XTAL/EXTAL	Crystal oscillator inputs	Supports 3–32 MHz crystals; internal load caps eliminate need for external capacitors in most designs - reduces BOM count and layout area.
TSI_CH0–TSI_CH15	Touch sensing inputs	Hardware-accelerated capacitive touch channel inputs - enable robust, low-power proximity and slider interfaces with <1 µA active current per channel.
ADC0_SE0–ADC0_SE15	Analog input channels	16 single-ended or 8 differential ADC inputs mapped to GPIOs; programmable gain amplifier (PGA) not present - relies on external signal conditioning for sub-mV resolution.
UART0_TX/UART0_RX, UART1_TX/UART1_RX	Asynchronous serial I/O	Two independent UARTs with 16-level FIFOs, fractional baud rate generation, and LIN break detection - support dual serial buses (e.g., diagnostics + sensor comms).

Key Features

Feature	Design Value
Ultra-low-power architecture	9 low-power modes including VLLS0 (0.41 µA) with full register retention and 4.5 µs wake-up - extends battery life in intermittent-sampling applications like environmental monitors.
Integrated analog subsystem	16-bit SAR ADC (1 MSps, ±1 LSB INL) + 12-bit DAC (±1 LSB DNL) + comparator with 6-bit DAC reference - eliminates need for discrete signal chain components in closed-loop control.
Hardware touch interface (TSI)	Dedicated TSI module supporting up to 16 channels with automatic calibration and noise immunity - enables reliable capacitive buttons/sliders at <1 µA average current per active channel.
Robust clocking system	Multi-source clock controller (MCG) with internal 4 MHz IRC, 32 kHz LPO, and external crystal support (3–32 MHz) - ensures fail-safe timing during voltage transients or crystal faults.
Security & trace	80-bit unique chip ID, SWD debug interface with Micro Trace Buffer (MTB) - enables secure device authentication and non-intrusive runtime code profiling for certification-critical firmware.

Applications

Industrial Sensor Node	Portable Medical Monitor
Use Scenario: Wireless temperature/humidity/pressure node powered by CR2032 battery, transmitting data every 5 minutes via BLE gateway. IC Role / Device Role / Timing Role: Primary MCU managing sensor acquisition, low-power sleep scheduling, UART-to-BLE bridge, and real-time clock wake-up. Use Value: VLLS0 mode (0.41 µA) and 4.5 µs wake-up enable >5-year battery life; integrated 16-bit ADC ensures ±0.1°C temperature accuracy without external amplifiers.	Use Scenario: Wearable ECG patch with dry-electrode sensing, onboard signal filtering, and Bluetooth LE streaming to smartphone. IC Role / Device Role / Timing Role: Signal acquisition MCU handling analog front-end control, digital filtering, and low-latency packetization of waveform data. Use Value: 16-bit ADC (1 MSps) captures high-fidelity ECG waveforms; 12-bit DAC generates precise bias voltages for electrode offset cancellation.
Smart Home HMI Panel	Automotive Body Control Module
Use Scenario: Wall-mounted thermostat with capacitive touch keys, ambient light sensing, and Zigbee connectivity. IC Role / Device Role / Timing Role: Human-machine interface controller managing TSI, ambient light ADC, display backlight PWM, and Zigbee co-processor interface. Use Value: Hardware TSI engine handles 12-key matrix with <1 µA/channel active current; six-channel TPM provides independent dimming control for RGB LED indicators.	Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN communication to central ECU. IC Role / Device Role / Timing Role: Body electronics MCU executing LIN protocol stack, motor driver PWM generation, and fault-safe I/O monitoring. Use Value: Two UARTs support simultaneous LIN (UART0) and diagnostics (UART1); –40°C to +105°C rating ensures reliability in under-hood environments.

Industrial Sensor Node

Portable Medical Monitor

Use Scenario: Wireless temperature/humidity/pressure node powered by CR2032 battery, transmitting data every 5 minutes via BLE gateway.

IC Role / Device Role / Timing Role: Primary MCU managing sensor acquisition, low-power sleep scheduling, UART-to-BLE bridge, and real-time clock wake-up.

Use Value: VLLS0 mode (0.41 µA) and 4.5 µs wake-up enable >5-year battery life; integrated 16-bit ADC ensures ±0.1°C temperature accuracy without external amplifiers.

Use Scenario: Wearable ECG patch with dry-electrode sensing, onboard signal filtering, and Bluetooth LE streaming to smartphone.

IC Role / Device Role / Timing Role: Signal acquisition MCU handling analog front-end control, digital filtering, and low-latency packetization of waveform data.

Use Value: 16-bit ADC (1 MSps) captures high-fidelity ECG waveforms; 12-bit DAC generates precise bias voltages for electrode offset cancellation.

Smart Home HMI Panel

Automotive Body Control Module

Use Scenario: Wall-mounted thermostat with capacitive touch keys, ambient light sensing, and Zigbee connectivity.

IC Role / Device Role / Timing Role: Human-machine interface controller managing TSI, ambient light ADC, display backlight PWM, and Zigbee co-processor interface.

Use Value: Hardware TSI engine handles 12-key matrix with <1 µA/channel active current; six-channel TPM provides independent dimming control for RGB LED indicators.

Use Scenario: Door module controlling window lift, mirror fold, and interior lighting with LIN communication to central ECU.

IC Role / Device Role / Timing Role: Body electronics MCU executing LIN protocol stack, motor driver PWM generation, and fault-safe I/O monitoring.

Use Value: Two UARTs support simultaneous LIN (UART0) and diagnostics (UART1); –40°C to +105°C rating ensures reliability in under-hood environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
KL26Z256VLH4	Same Kinetis L family, but Cortex-M0+ at 48 MHz with enhanced USB OTG, higher ADC sample rate (1.2 MSps), and larger 64 KB RAM.	Better suited for USB-connected diagnostic tools or data loggers requiring host interface - not drop-in due to USB PHY pinout and increased power draw.	Select when USB device/host capability or higher RAM bandwidth is required; verify PCB layout changes for USB routing and ESD protection.
STM32L072KBU6	ARM Cortex-M0+, 32 MHz max, 128 KB flash, 20 KB RAM, ultra-low-power run (160 µA/MHz), but lacks hardware TSI and I²S/SAI.	Strong fit for simple sensor nodes or metering where capacitive touch or audio streaming is unnecessary - requires external touch controller if TSI needed.	Choose for cost-sensitive, non-touch applications needing long battery life and ST's mature ecosystem; confirm absence of TSI/I²S does not impact feature set.

Compared with MKL16Z256VLH4R, KL26Z256VLH4 adds USB but increases complexity and power; STM32L072KBU6 reduces cost and power in non-touch roles but removes integrated TSI and audio interfaces - selection depends on whether USB connectivity or hardware touch acceleration is mandatory.

Availability

MKL16Z256VLH4R is available at Aetrix Electronics and suitable for industrial sensor nodes, portable medical monitors, smart home HMI panels, and automotive body control modules requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across temperature and voltage ranges.

Supply support for MKL16Z256VLH4R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications, with deep expertise in ARM-based microcontrollers and edge processing.

The MKL16Z256VLH4R belongs to the Kinetis KL16 sub-family - designed specifically for ultra-low-power, cost-sensitive embedded applications requiring rich analog integration, capacitive touch, and industrial-grade reliability without sacrificing 32-bit performance.

FAQ

What is the maximum operating frequency and core type of the MKL16Z256VLH4R?

The MKL16Z256VLH4R features an ARM Cortex-M0+ core with a maximum operating frequency of 48 MHz. This core delivers 1.25 DMIPS/MHz throughput and includes a Bit Manipulation Engine and Micro Trace Buffer for efficient real-time control. The MKL16Z256VLH4R achieves this speed using its Multi-purpose Clock Generator (MCG) in PEE mode with external crystal or internal reference clock scaling - confirmed in the KL16P64M48SF4 Rev 5 datasheet Section 2.3.1.

What are the lowest power consumption modes supported by the MKL16Z256VLH4R, and what is the typical current draw?

The MKL16Z256VLH4R supports nine low-power modes, with VLLS0 (Very Low-Leakage Stop Mode 0) offering the lowest current: 0.41 µA at 3.0 V and 25°C when SMC_STOPCTRL[PORPO] = 1. Other key modes include VLPR (Very-Low-Power Run) at 192 µA (4 MHz core, 3.0 V) and VLPS (Very-Low-Power Stop) at 2.71 µA (25°C). All values are measured with full state retention and verified in Table 9 of the KL16P64M48SF4 Rev 5 datasheet.

Does the MKL16Z256VLH4R include hardware capacitive touch support, and how many channels are available?

Yes, the MKL16Z256VLH4R includes a dedicated hardware Touch Sensing Interface (TSI) module supporting up to 16 capacitive touch channels (TSI_CH0–TSI_CH15). It provides automatic calibration, noise filtering, and low-power operation (<1 µA per active channel), enabling robust button, slider, and proximity sensing without CPU intervention. This capability is documented in Section 3.9.1 and Table 5-1 of the KL16P64M48SF4 Rev 5 datasheet.

What analog peripherals are integrated into the MKL16Z256VLH4R, and what are their key specifications?

The MKL16Z256VLH4R integrates a 16-bit SAR ADC (1 MSps, ±1 LSB INL), a 12-bit DAC (±1 LSB DNL), and an analog comparator (CMP) with a built-in 6-bit DAC reference. The ADC supports 16 single-ended or 8 differential inputs; the DAC provides monotonic output with rail-to-rail swing; the CMP includes programmable hysteresis and reference selection. These specs are validated in Sections 3.6.1–3.6.3 of the KL16P64M48SF4 Rev 5 datasheet.

What is the package type and pin count of the MKL16Z256VLH4R, and is it RoHS compliant?

The MKL16Z256VLH4R uses a 64-pin LQFP (LH) package measuring 10 mm × 10 mm × 1.4 mm with 0.5 mm lead pitch and an exposed thermal pad (EPAD) connected to VSS. It is RoHS-compliant and rated MSL 3 per IPC/JEDEC J-STD-020. Package dimensions and mechanical drawings are specified in document 98ASS23234W1, referenced in the KL16P64M48SF4 Rev 5 datasheet Section 4.

MKL16Z256VLH4R Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Package/Case:: 64-LQFP

Series:: Kinetis KL1

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Core Processor:: ARM® Cortex®-M0+

Core Size:: 32-Bit Single-Core

Speed:: 48MHz

Connectivity:: I2C, LINbus, SPI, TSI, UART/USART

Peripherals:: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT

Number of I/O:: 54

Program Memory Size:: 256KB (256K x 8)

Program Memory Type:: FLASH

EEPROM Size:: -

RAM Size:: 32K x 8

Voltage - Supply (Vcc/Vdd):: 1.71V ~ 3.6V

Data Converters:: A/D - 16bit; D/A - 12bit

Oscillator Type:: Internal

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

MKL16Z256VLH4R FAQ

1.How can I place an order for MKL16Z256VLH4R through Aetrix?

Please submit a Request for Quotation (RFQ) for MKL16Z256VLH4R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MKL16Z256VLH4R reliable?

The price and inventory of MKL16Z256VLH4R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MKL16Z256VLH4R is usually 5 days.

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4.How is shipping managed for MKL16Z256VLH4R?

MKL16Z256VLH4R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MKL16Z256VLH4R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MKL16Z256VLH4R?

For technical support, including MKL16Z256VLH4R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MKL16Z256VLH4R requirements.

6.How does Aetrix verify that MKL16Z256VLH4R is sourced from the original manufacturer or authorized distributors?

All MKL16Z256VLH4R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MKL16Z256VLH4R meets industry standards.

7.What is the process for return or replacement of MKL16Z256VLH4R?

All MKL16Z256VLH4R units undergo pre-shipment inspection (PSI). If there is an issue with MKL16Z256VLH4R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MKL16Z256VLH4R part is unused and in its original packaging.

Return procedure for MKL16Z256VLH4R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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