Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MKL17Z256CAL4R

Part No.:
MKL17Z256CAL4R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
36-UFBGA, WLCSP
Datasheet:
AetrixMKL17Z256CAL4R.pdf
Description:
IC MCU 32BIT 256KB FLASH 36WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,416

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MKL17Z256CAL4R from NXP Semiconductors is a 48 MHz ARM® Cortex®-M0+ microcontroller with 256 KB flash, 32 KB SRAM, and 16 KB ROM bootloader, designed for ultra-low-power battery-operated edge sensors and wearable medical devices. It delivers 54 µA/MHz in very low power run mode, 1.96 µA in VLLS3 deep sleep (RTC + RAM retained), and operates across –40 to 85 °C in a 36-ball WLCSP package.

For engineers reviewing the MKL17Z256CAL4R datasheet, MKL17Z256CAL4R pinout, MKL17Z256CAL4R application, or MKL17Z256CAL4R equivalent, this page provides verified electrical specs, validated low-power mode behavior, confirmed WLCSP 2.8×2.7 mm pin assignment, and two field-tested alternative MCUs for cost- or footprint-sensitive designs.

Technical Context

The MKL17Z256CAL4R integrates an MCG-Lite clock system supporting HIRC (48 MHz ±0.5%), LIRC (8/2 MHz), and external 32 kHz crystal for RTC-enabling precise timing across all six static low-power modes. Its FlexIO module provides runtime-configurable serial peripheral emulation (UART/I²C/SPI/PWM) without dedicated hardware blocks.

It features a 16-bit 818 ksps ADC with internal 1.2 V reference and programmable gain, a high-speed analog comparator with integrated 6-bit DAC reference, and a 12-bit DAC-all operating down to 1.71 V supply. The 26 GPIOs include 23 interrupt-capable and 6 high-drive pins, fully multiplexed via PORTx_PCRn registers.

Key Specifications

Parameter Value and Actual Design Meaning
Core ARM Cortex-M0+ @ 48 MHz - deterministic real-time execution with Micro Trace Buffer for cycle-accurate debug.
Memory 256 KB flash / 32 KB SRAM / 16 KB ROM - supports over-the-air firmware updates via embedded bootloader.
Power Modes VLLS3: 1.96 µA (RTC + RAM retained); VLPR: 108–497 µA - enables multi-year battery life in sensor nodes.
Analog Peripherals 16-channel 16-bit ADC (818 ksps), 12-bit DAC, 6-bit DAC for comparator reference - single-chip signal acquisition and conditioning.
Package 36-ball WLCSP, 2.8 × 2.7 mm, 0.4 mm pitch - ultra-compact footprint for space-constrained wearables and IoT endpoints.
Operating Range 1.71–3.6 V supply; –40 to 85 °C ambient - certified for industrial-grade reliability in portable equipment.
I/O Count 26 GPIOs (23 interrupt-capable, 6 high-drive) - sufficient for sensor interface, LED control, and button inputs in compact designs.

Pinout & Package

Package: 36-ball Wafer-Level Chip Scale Package (WLCSP), 2.8 mm × 2.7 mm, 0.4 mm ball pitch, 0.6 mm thickness. Ball map conforms to NXP package drawing 98ASA00949D1.

Pin/Terminal Circuit Role Design Meaning
VDD Digital supply input 1.71–3.6 V main power rail; decoupling required per NXP layout guidelines (0.1 µF + 1 µF near each VDD ball).
VDDA Analog supply input Must be within ±0.1 V of VDD; powers ADC, DAC, and comparator-requires separate LC filtering for noise-sensitive measurements.
VSS / VSSA Digital/analog ground Separate digital and analog ground planes recommended; connected at single point near VREFH/VREFL to minimize coupling.
PTA0–PTA15, PTB0–PTB15, PTC0–PTC7, PTD0–PTD7 GPIO / peripheral function multiplexed 26 total usable I/Os; each pin configurable as UART/I²C/SPI/FlexIO/ADC input via PORTx_PCRn register settings.
XTAL32K / EXTAL32K 32 kHz crystal oscillator terminals Enables precision RTC operation in all low-power modes except VLLS0; requires 12.5 pF load capacitance crystal.
SWD_CLK / SWD_DIO Two-pin Serial Wire Debug interface Enables programming and real-time debug with minimal PCB footprint; no JTAG TAP required.

Key Features

Feature Design Value
FlexIO module Runtime-reconfigurable serial interface engine supporting UART, I²C, SPI, I²S, PWM, and custom protocols-eliminates need for external level shifters or protocol translators.
Low-power modes Six static modes including VLLS0 (0.18 µA), VLLS1 (0.66 µA), and VLLS3 (1.96 µA with RTC+RAM)-enables wake-on-event with sub-µA quiescent current.
Embedded ROM bootloader 16 KB factory-programmed ROM with UART/USB HID boot loader-supports field firmware updates without external programmer.
High-accuracy internal clocks 48 MHz HIRC (±0.5% over temp/voltage), 8/2 MHz LIRC (±3%)-reduces BOM cost by eliminating external crystals for non-RTC functions.
Analog integration 16-bit ADC with internal 1.2 V reference, 12-bit DAC, and comparator with 6-bit DAC reference-enables closed-loop control and sensor signal chain in one die.

Applications

Wearable Health Monitor Smart Industrial Sensor Node

Use Scenario: Continuous ECG/PPG signal acquisition and local feature extraction in wrist-worn device.

IC Role / Device Role / Timing Role: Primary MCU executing sensor fusion algorithms, managing BLE connectivity, and controlling ultra-low-power sleep/wake cycles.

Use Value: 1.96 µA VLLS3 current extends battery life to >2 years on coin cell; integrated ADC/DAC eliminates external signal conditioning ICs.

Use Scenario: Wireless temperature/humidity/pressure sensing node deployed in factory floor with 10-year battery target.

IC Role / Device Role / Timing Role: System controller interfacing with analog sensors, running predictive maintenance firmware, and scheduling LoRaWAN transmissions.

Use Value: FlexIO emulates custom sensor interfaces; 36-ball WLCSP enables miniaturized PCB design; -40 to 85 °C rating ensures operation in uncontrolled environments.

Portable Medical Diagnostic Tool Energy-Harvesting IoT Endpoint

Use Scenario: Handheld blood glucose meter requiring precise analog measurement and secure data logging.

IC Role / Device Role / Timing Role: Signal acquisition MCU with calibrated ADC reference, encrypted flash storage, and USB HID interface.

Use Value: Internal 1.2 V voltage reference ensures <±0.5% ADC accuracy; ROM bootloader enables secure firmware updates in clinical settings.

Use Scenario: Solar-powered environmental monitor harvesting µW-level energy, transmitting data every 15 minutes.

IC Role / Device Role / Timing Role: Ultra-low-quiescent controller managing energy buffer, sensor sampling, and burst RF transmission.

Use Value: VLLS0 mode draws only 0.18 µA at 25 °C-maximizes duty cycle efficiency; 1.71 V minimum supply enables operation during low-light energy harvesting.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
EFM32PG12B500F1024GL125 ARM Cortex-M4 @ 40 MHz; 1024 KB flash; 256 KB RAM; 1.27 µA deep sleep (RTC+RAM) Higher performance and memory; superior analog front-end (2 Msps ADC); larger QFN-64 package (7×7 mm) Choose when algorithm complexity exceeds Cortex-M0+ capability or when higher-resolution ADC is required.
STM32L072CZY6TR ARM Cortex-M0+ @ 32 MHz; 192 KB flash; 20 KB RAM; 0.33 µA shutdown (RTC+RAM) Lower active power (113 µA/MHz); smaller 49-ball WLCSP (2.14×2.14 mm); no FlexIO equivalent Prefer for extreme size constraints and lowest possible shutdown current, accepting reduced peripheral flexibility.

Compared with MKL17Z256CAL4R, the EFM32PG12B500 offers higher compute headroom and richer analog resources but demands more PCB area and power budget; the STM32L072CZY6TR achieves lower shutdown current and smaller footprint but lacks FlexIO and has less flash/RAM-making MKL17Z256CAL4R optimal for balanced low-power, small-size, and peripheral-flexible designs.

Availability

MKL17Z256CAL4R is available at Aetrix Electronics and suitable for wearable health monitors, smart industrial sensor nodes, and portable medical diagnostic tools requiring stable component supply and long-term lifecycle support.

Supply support for MKL17Z256CAL4R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 50 years of embedded systems expertise.

The Kinetis KL17 family targets cost-sensitive, battery-powered edge devices-delivering ARM Cortex-M0+ performance with industry-leading low-power modes and flexible peripheral integration for compact sensor and control systems.

FAQ

What is the maximum operating frequency and core type of the MKL17Z256CAL4R?

The MKL17Z256CAL4R features an ARM Cortex-M0+ core rated for up to 48 MHz operation. This frequency is supported by the high-accuracy internal reference clock (HIRC) with ±0.5% tolerance across voltage and temperature. All peripherals-including ADC, FlexIO, and UART-are fully functional at this speed, and the device maintains full specification compliance in run, wait, and stop modes at 48 MHz.

Does the MKL17Z256CAL4R support in-system programming and debugging?

Yes, the MKL17Z256CAL4R supports two-pin Serial Wire Debug (SWD) for full programming, erase, and real-time debugging via standard tools like SEGGER J-Link or OpenSDA. It also includes a factory-programmed 16 KB ROM bootloader enabling UART- or USB-based firmware updates without external debug hardware-critical for field-deployed devices.

What low-power modes does the MKL17Z256CAL4R offer, and what is the lowest achievable current?

The MKL17Z256CAL4R provides six static low-power modes. The lowest current is achieved in VLLS0 mode: 0.18 µA typical at 25 °C with PORPO = 1, retaining only essential logic. For RTC + RAM retention, VLLS3 draws 1.96 µA typical at 25 °C-verified per NXP datasheet Rev. 7 (Oct 2023) Table 9. All modes support wake-on-pin, RTC alarm, or LPTMR event.

What package and pin count does the MKL17Z256CAL4R use, and is pinout documentation available?

The MKL17Z256CAL4R uses a 36-ball WLCSP package measuring 2.8 mm × 2.7 mm with 0.4 mm pitch. Its pinout is fully documented in Section 5.2 ("KL17 Family Pinouts") of the official NXP datasheet KL17P64M48SF6 Rev. 7, and the mechanical drawing is published as 98ASA00949D1. Ball assignments include dedicated VDD/VSS pairs, SWD interface, 32 kHz crystal pads, and 26 multiplexed GPIOs.

Can the MKL17Z256CAL4R emulate additional serial interfaces beyond its native peripherals?

Yes-the FlexIO module in MKL17Z256CAL4R enables runtime emulation of UART, IrDA, SPI, I²C, I²S, PWM, and custom protocols using programmable state machines and timers. Unlike fixed-function peripherals, FlexIO allows dynamic reconfiguration without reset, making it ideal for multi-sensor systems where interface requirements vary across product variants or firmware versions.

MKL17Z256CAL4R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
36-UFBGA, WLCSP
Series:
Kinetis KL1
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 7x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MKL17Z256CAL4R FAQ

1.How can I place an order for MKL17Z256CAL4R through Aetrix?

Please submit a Request for Quotation (RFQ) for MKL17Z256CAL4R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MKL17Z256CAL4R reliable?

The price and inventory of MKL17Z256CAL4R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MKL17Z256CAL4R is usually 5 days.

3.What payment methods are accepted for MKL17Z256CAL4R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MKL17Z256CAL4R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MKL17Z256CAL4R?

MKL17Z256CAL4R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MKL17Z256CAL4R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MKL17Z256CAL4R?

For technical support, including MKL17Z256CAL4R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MKL17Z256CAL4R requirements.

6.How does Aetrix verify that MKL17Z256CAL4R is sourced from the original manufacturer or authorized distributors?

All MKL17Z256CAL4R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MKL17Z256CAL4R meets industry standards.

7.What is the process for return or replacement of MKL17Z256CAL4R?

All MKL17Z256CAL4R units undergo pre-shipment inspection (PSI). If there is an issue with MKL17Z256CAL4R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MKL17Z256CAL4R part is unused and in its original packaging.

Return procedure for MKL17Z256CAL4R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MKL17Z256CAL4R Tags

  • MKL17Z256CAL4R
  • MKL17Z256CAL4R PDF
  • MKL17Z256CAL4R Datasheet
  • MKL17Z256CAL4R Specifications
  • MKL17Z256CAL4R Images
  • NXP Semiconductors
  • NXP Semiconductors MKL17Z256CAL4R
  • Buy MKL17Z256CAL4R
  • MKL17Z256CAL4R Price
  • MKL17Z256CAL4R Distributor
  • MKL17Z256CAL4R Supplier
  • MKL17Z256CAL4R Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER