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NXP Semiconductors MKL17Z256VFM4R

Part No.:
MKL17Z256VFM4R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-VFQFN Exposed Pad
Datasheet:
AetrixMKL17Z256VFM4R.pdf
Description:
KINETIS KL17: 48MHZ CORTEX-M0+ U
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,196

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Product details

Overview

MKL17Z256VFM4R from NXP Semiconductors is a 32-bit ARM® Cortex®-M0+ microcontroller operating at up to 48 MHz, featuring 256 KB flash, 32 KB SRAM, and optimized for ultra-low-power battery-operated applications such as wireless sensor nodes and portable medical devices.

For engineers reviewing the MKL17Z256VFM4R datasheet, MKL17Z256VFM4R pinout, MKL17Z256VFM4R application, or MKL17Z256VFM4R equivalent, key selection criteria include its 32-pin QFN (5×5 mm, 0.5 mm pitch) package, 1.71–3.6 V supply range, –40 to 105 °C temperature rating, and support for six low-power modes down to 1.96 µA in VLLS3 with RTC + RAM retention.

Technical Context

The MKL17Z256VFM4R implements an ARM Cortex-M0+ core with Micro Trace Buffer and Bit Manipulation Engine, paired with a flexible clock system including factory-trimmed 48 MHz HIRC (±0.5%), 8/2 MHz IRC, and 32 kHz–32 MHz crystal oscillator support. Its power architecture enables dynamic voltage/frequency scaling across seven static low-power modes.

Peripheral integration includes one 16-bit 818 ksps ADC with internal Vref, two low-power UARTs active in VLPS/VLLS, FlexIO for customizable serial emulation (UART/I²C/SPI/I²S/PWM), and dual 16-bit SPI modules supporting up to 24 Mbit/s - all accessible via 28 GPIOs (19 interrupt-capable, 6 high-drive) in its 32-pin QFN footprint.

Key Specifications

ParameterValue and Actual Design Meaning
CoreARM Cortex-M0+, 48 MHz max - delivers deterministic real-time control with <1.5-cycle branch penalty and Thumb-2 instruction set.
Memory256 KB flash / 32 KB SRAM / 16 KB ROM with bootloader - supports field firmware updates without external programmer.
Supply Range1.71–3.6 V - enables direct Li-ion/Li-Po battery operation (single-cell) and compatibility with common LDO outputs.
Low-Power ModesVLLS3 @ 1.96 µA (RTC + RAM retained) - sustains timekeeping and state preservation for years on coin-cell batteries.
ADC16-bit, 818 ksps, 16-channel SE/DP - achieves <±1 LSB INL with integrated 1.2 V reference for precision sensor interfacing.
Package32-pin QFN, 5×5 mm, 0.5 mm pitch - surface-mount compatible with standard reflow profiles; 0.65 mm height suits space-constrained PCBs.
Temperature Range–40 to 105 °C - qualified for industrial and extended-temperature embedded applications including automotive cabin modules.

Pinout & Package

Package: 32-pin QFN (5 mm × 5 mm, 0.5 mm pitch, 0.65 mm height), RoHS-compliant, moisture sensitivity level (MSL) 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VSS, VSSAPower and ground railsDigital/analog supply separation ensures noise immunity for ADC and analog peripherals; VDDA must track VDD within ±0.1 V.
PTA0–PTA3, PTB0–PTB7, PTC0–PTC7, PTD0–PTD7GPIO bank pins28 total GPIOs with configurable pull-up/down, slew rate, and drive strength; 19 support interrupt generation, 6 support 18 mA high-drive output.
XTAL/EXTALClock input/outputSupports 32–40 kHz or 3–32 MHz crystal oscillators; enables precise timing for RTC, USB, or communication protocols.
SWD_CLK, SWD_DIODebug interfaceTwo-pin Serial Wire Debug allows full programming, breakpointing, and memory inspection without dedicated JTAG pins.
RESET_bActive-low resetAsynchronous reset input with internal pull-up; accepts 1.2–3.6 V logic levels and supports external pushbutton or supervisor IC assertion.

Key Features

FeatureDesign Value
FlexIO moduleConfigurable logic engine enabling software-defined peripherals (e.g., custom UART, I²C master/slave, PWM generators) without hardware changes.
Low-power UARTsTwo UARTs retain asynchronous operation in VLPS/VLLS modes - critical for wake-on-RX in always-on sensing applications.
Embedded ROM bootloader16 KB ROM with UART/I²C/USB HID boot interfaces - eliminates need for external programmer during production or field firmware updates.
High-accuracy internal clocks48 MHz HIRC trimmed to ±0.5% and 8/2 MHz IRC trimmed to ±3% - reduces BOM cost by eliminating external crystals in non-RTC-critical functions.
Advanced flash securityFlash protection via mass erase disable and secure boot - prevents unauthorized firmware extraction or modification in deployed devices.

Applications

Wireless Sensor NodePortable Medical Device

Use Scenario: Battery-powered environmental monitor transmitting temperature/humidity data via BLE or Sub-GHz radio every 5 minutes.

IC Role / Device Role / Timing Role: Central controller managing sensor acquisition, data processing, low-power radio interface, and RTC-triggered wake-up.

Use Value: VLLS3 mode (1.96 µA) extends 200 mAh coin-cell life beyond 3 years; FlexIO emulates proprietary sensor interface without added ICs.

Use Scenario: Handheld glucose meter requiring fast ADC sampling, LCD display control, and USB charging detection.

IC Role / Device Role / Timing Role: Main MCU handling analog front-end digitization, touch-button UI, and USB enumeration with battery charge management.

Use Value: 16-bit ADC with internal 1.2 V reference achieves <±1 LSB linearity for clinical-grade accuracy; 32 KB SRAM buffers full waveform data before USB transfer.

Industrial Control PanelSmart Home Actuator

Use Scenario: DIN-rail mounted HVAC controller with RS-485 Modbus interface, local keypad, and LED indicators.

IC Role / Device Role / Timing Role: Real-time coordinator of communication stack, user input scanning, and relay/PWM output timing.

Use Value: Dual 16-bit SPI (24 Mbit/s) drives high-refresh-rate segment LCD; two I²C modules manage EEPROM and ambient light sensor independently.

Use Scenario: Zigbee-enabled smart plug monitoring load current and executing scheduled on/off commands.

IC Role / Device Role / Timing Role: Energy metering controller with isolated current sensing, Zigbee co-processor interface, and RTC-based scheduling.

Use Value: Low-leakage stop mode (3.31 µA @ 25°C) maintains schedule integrity during mains outage; high-drive GPIOs directly switch optocouplers for zero-crossing AC control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
KL17Z256VFT448-pin QFN (7×7 mm), 40 GPIOs, 18 ADC channels - larger footprint, higher I/O count, same core/peripherals.Suitable for designs needing more analog inputs or digital signals; requires PCB redesign due to different pin count and layout.Select when >28 GPIOs or >11 ADC channels are required; retains identical firmware compatibility and toolchain support.
STM32L072KBU6ARM Cortex-M0+, 32 KB flash, 20 KB SRAM, 32-pin QFN - smaller memory, lower power (190 nA standby), no FlexIO or ROM bootloader.Better for ultra-low-energy applications with minimal firmware size; lacks hardware UART-in-VLPS and peripheral emulation capability.Choose for sub-µA standby-critical designs where FlexIO and bootloader are unnecessary; verify toolchain and peripheral driver porting effort.

Compared with KL17Z256VFT4, MKL17Z256VFM4R saves board area and cost in space-constrained designs; versus STM32L072KBU6, it provides superior peripheral flexibility and field-upgrade capability at slightly higher active power.

Availability

MKL17Z256VFM4R is available at Aetrix Electronics and suitable for wireless sensor nodes, portable medical devices, and industrial control panels requiring stable component supply across multi-year production cycles.

Supply support for MKL17Z256VFM4R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.

The Kinetis KL17 family targets cost-sensitive, battery-powered applications demanding robust low-power performance and flexible peripheral integration - designed specifically for edge intelligence in constrained environments.

FAQ

What is the maximum operating frequency of the MKL17Z256VFM4R?

The MKL17Z256VFM4R features an ARM Cortex-M0+ core rated for up to 48 MHz operation using its factory-trimmed high-accuracy internal reference clock (HIRC). This frequency is fully supported across the device's specified voltage (1.71–3.6 V) and temperature (–40 to 105 °C) ranges, with timing closure verified per NXP's KL17P64M48SF6RM1 reference manual.

Does the MKL17Z256VFM4R support debugging via SWD?

Yes, the MKL17Z256VFM4R includes a Two-pin Serial Wire Debug (SWD) interface using dedicated SWD_CLK and SWD_DIO pins. This enables full programming, real-time tracing via Micro Trace Buffer, and breakpoint-based debugging using standard tools like SEGGER J-Link or NXP LPC-Link2 - no JTAG header required.

What low-power modes are available on the MKL17Z256VFM4R, and what is the lowest current draw?

The MKL17Z256VFM4R offers six static low-power modes, including VLLS0, VLLS1, VLLS3, LLS, VLPS, and STOP. The lowest measured current is 1.96 µA in VLLS3 mode with RTC and RAM retained at 3.0 V and 25 °C - confirmed in Table 9 of the Rev. 7 datasheet. This mode maintains real-time clock operation and 32 KB SRAM contents for rapid wake-up.

Can the MKL17Z256VFM4R operate from a single-cell lithium battery?

Yes, the MKL17Z256VFM4R operates over 1.71–3.6 V, matching the discharge curve of standard Li-ion (3.0–4.2 V) and Li-Po (2.7–4.2 V) cells. Its ability to run at 48 MHz down to 1.71 V - combined with brownout detection thresholds (e.g., VLVDL = 1.60 V typical) - ensures reliable operation across full battery life without external regulation in many use cases.

Is there a built-in bootloader in the MKL17Z256VFM4R?

Yes, the MKL17Z256VFM4R includes 16 KB of on-chip ROM containing a production bootloader supporting UART, I²C, and USB HID interfaces. This enables field firmware updates without external debug hardware, and is accessible via the ROM API documented in the KL17P64M48SF6RM1 reference manual - independent of user flash content.

MKL17Z256VFM4R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-VFQFN Exposed Pad
Series:
Kinetis KL17
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 11x16b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MKL17Z256VFM4R FAQ

1.How can I place an order for MKL17Z256VFM4R through Aetrix?

Please submit a Request for Quotation (RFQ) for MKL17Z256VFM4R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MKL17Z256VFM4R reliable?

The price and inventory of MKL17Z256VFM4R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MKL17Z256VFM4R is usually 5 days.

3.What payment methods are accepted for MKL17Z256VFM4R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MKL17Z256VFM4R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MKL17Z256VFM4R?

MKL17Z256VFM4R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MKL17Z256VFM4R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MKL17Z256VFM4R?

For technical support, including MKL17Z256VFM4R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MKL17Z256VFM4R requirements.

6.How does Aetrix verify that MKL17Z256VFM4R is sourced from the original manufacturer or authorized distributors?

All MKL17Z256VFM4R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MKL17Z256VFM4R meets industry standards.

7.What is the process for return or replacement of MKL17Z256VFM4R?

All MKL17Z256VFM4R units undergo pre-shipment inspection (PSI). If there is an issue with MKL17Z256VFM4R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MKL17Z256VFM4R part is unused and in its original packaging.

Return procedure for MKL17Z256VFM4R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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