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NXP Semiconductors MKL17Z256VMP4R

Part No.:
MKL17Z256VMP4R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-LFBGA
Datasheet:
AetrixMKL17Z256VMP4R.pdf
Description:
IC MCU 32BIT 256KB FLSH 64MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,119

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Product details

Overview

MKL17Z256VMP4R from NXP Semiconductors is a 48 MHz ARM® Cortex®-M0+ microcontroller with 256 KB flash, 32 KB SRAM, and 16 KB ROM bootloader, designed for ultra-low-power battery-operated systems. It delivers 54 µA/MHz in very low power run mode, 1.96 µA in VLLS3 deep-sleep mode (RAM + RTC retained), and supports up to 54 GPIOs in a 64-pin MAPBGA package - ideal for portable medical sensors and smart metering endpoints.

For engineers reviewing the MKL17Z256VMP4R datasheet, MKL17Z256VMP4R pinout, MKL17Z256VMP4R application, or MKL17Z256VMP4R equivalent, key selection criteria include its dual internal clock accuracy (0.5% at 48 MHz, 3% at 8/2 MHz), FlexIO-based peripheral emulation capability, 16-channel 12-bit ADC with internal Vref, and verified operation across –40 to 105 °C in MAPBGA packaging.

Technical Context

The MKL17Z256VMP4R implements an ARM Cortex-M0+ core with Micro Trace Buffer and Bit Manipulation Engine, paired with a flexible MCG-Lite clock system supporting HIRC (48 MHz), LIRC (2/8 MHz), and external crystal sources (32 kHz–32 MHz). Its low-power architecture includes six static power modes - VLLS0 through RUN - with sub-µA retention states enabled by dedicated low-leakage wakeup logic and configurable RTC backup.

Peripherals are organized around a 4-channel asynchronous DMA controller and dual clock domains: high-speed (up to 48 MHz) for CPU/flash and low-frequency (1 kHz–32 kHz) for RTC/LPTMR. The FlexIO module provides programmable serial interface emulation (UART/I²C/SPI/I²S/PWM), while analog subsystems integrate a 12-bit DAC, high-speed comparator with 6-bit reference DAC, and 16-channel ADC with built-in 1.2 V reference.

Key Specifications

ParameterValue and Actual Design Meaning
CoreARM Cortex-M0+, 48 MHz max - enables real-time control with deterministic interrupt latency under 12 cycles.
Memory256 KB flash / 32 KB SRAM / 16 KB ROM - sufficient for secure boot, firmware updates, and sensor fusion algorithms in edge nodes.
Low-Power Performance1.96 µA in VLLS3 (RTC + RAM retained) - supports multi-year battery life in wake-on-event applications like gas leak detectors.
Analog Subsystem16-channel 12-bit ADC + 12-bit DAC + comparator w/6-bit ref DAC - enables closed-loop analog control without external signal chain components.
Operating Range1.71–3.6 V supply, –40 to 105 °C - validated for industrial-grade reliability in automotive cabin modules and HVAC controllers.
I/O Capability54 GPIOs (31 interrupt-capable, 6 high-drive) - supports direct connection to displays, buttons, LEDs, and transducers in compact IoT endpoints.
Clock Accuracy0.5% @ 48 MHz HIRC, 3% @ 2/8 MHz LIRC - eliminates need for external crystals in cost-sensitive timing-critical functions like UART baud generation.

Pinout & Package

Package: 64-pin MAPBGA, 5 mm × 5 mm, 0.5 mm pitch, 1.23 mm thickness - optimized for high-density PCB layouts in space-constrained wearables and metering modules.

Pin/TerminalCircuit RoleDesign Meaning
VDD/VSSDigital power/groundDual-supply domain separation ensures noise immunity between digital logic and analog peripherals.
VDDA/VSSAAnalog power/groundIndependent analog rail minimizes switching noise coupling into ADC/DAC paths.
PTA0–PTD7GPIO multiplexed I/OConfigurable as UART/I²C/SPI/FlexIO pins - enables single-hardware design reuse across multiple communication protocols.
EXTAL0/XTAL032 kHz crystal oscillator input/outputEnables precise RTC timekeeping with ±20 ppm stability over temperature - critical for energy metering compliance.
SWD_CLK/SWD_DIOTwo-pin Serial Wire DebugReduces debug footprint vs JTAG; supports full programming, tracing, and real-time variable inspection in production firmware.

Key Features

FeatureDesign Value
Embedded ROM bootloaderEnables field firmware upgrades via UART/I²C without external programmer - reduces service costs in deployed infrastructure.
FlexIO moduleProgrammable logic engine emulates custom serial interfaces (e.g., proprietary sensor protocols), avoiding ASIC redesigns.
High-accuracy internal clocks0.5% 48 MHz HIRC eliminates crystal BOM cost and layout area while maintaining UART timing margin at 115.2 kbps.
VLLS3 deep-sleep mode1.96 µA retention current allows wake-on-interrupt response within 104 µs - essential for responsive human-interface devices.
Advanced flash securityPrevents unauthorized firmware extraction or modification via flash protection registers - meets IEC 62443-3-3 SL2 requirements.

Applications

Portable Medical SensorSmart Energy Meter

Use Scenario: Continuous ECG waveform acquisition and local anomaly detection in handheld diagnostic devices.

IC Role / Device Role / Timing Role: Primary controller executing sensor fusion, real-time filtering, and Bluetooth LE packetization.

Use Value: 16-channel ADC with internal 1.2 V reference enables ratiometric measurement stability across battery voltage decay; VLLS3 sleep extends 200 mAh coin-cell life to >3 years.

Use Scenario: Revenue-grade electricity metering with tamper detection and time-of-use tariff calculation.

IC Role / Device Role / Timing Role: System-on-chip managing metrology ADC, RTC, secure storage, and PLC/HPLC communication stack.

Use Value: 32 kHz crystal-backed RTC with ±20 ppm accuracy satisfies ANSI C12.1 and IEC 62053-21 timekeeping requirements; 256 KB flash stores encryption keys and firmware rollback images.

Industrial Wireless NodeAutomotive Cabin Controller

Use Scenario: Battery-powered vibration/temperature monitoring node transmitting data via LoRaWAN every 15 minutes.

IC Role / Device Role / Timing Role: Low-power host managing sensor polling, data compression, and radio interface timing synchronization.

Use Value: FlexIO emulates custom SPI timing for MEMS accelerometers; 54 µA/MHz run efficiency maximizes duty-cycle headroom for RF transmission bursts.

Use Scenario: Occupancy-sensing dashboard module controlling ambient lighting and climate based on capacitive touch and IR proximity.

IC Role / Device Role / Timing Role: Real-time coordinator of capacitive sensing, PWM dimming, and CAN FD gateway functions.

Use Value: 6 high-drive GPIOs directly drive LED strings without external drivers; –40 to 105 °C rating ensures operation in parked-car thermal extremes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
KL27Z256VLH4Same Cortex-M0+ core, 48 MHz, but adds USB OTG PHY and higher ADC resolution (16-bit); larger 64-LQFP package.Better suited for USB-connected diagnostics tools; lacks MAPBGA option and has higher active current (7.39 mA vs 6.45 mA at 48 MHz).Select when USB device functionality is mandatory and board space permits LQFP; avoid if MAPBGA footprint or lowest deep-sleep current is required.
STM32L072KBU6ARM Cortex-M0+, 32 MHz, 128 KB flash, 20 KB SRAM; 32-QFN only; lower deep-sleep (0.33 µA) but no FlexIO or ROM bootloader.Targeted at simpler sensor nodes without protocol emulation needs; requires external bootloader implementation.Choose for ultra-low-quiescent designs where peripheral flexibility is secondary to absolute minimum sleep current and cost.

Compared with KL27Z256VLH4 and STM32L072KBU6, MKL17Z256VMP4R uniquely balances MAPBGA density, FlexIO-driven hardware reconfigurability, and sub-2 µA deep-sleep - making it optimal for compact, field-upgradable, multi-protocol edge nodes requiring long battery life.

Availability

MKL17Z256VMP4R is available at Aetrix Electronics and suitable for portable medical sensors, smart energy meters, industrial wireless nodes, and automotive cabin controllers requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MKL17Z256VMP4R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with R&D centers across 30+ countries and ISO 9001-certified manufacturing.

The Kinetis KL17 family targets cost-sensitive, battery-powered applications demanding robust low-power performance and flexible peripheral integration - specifically engineered for smart sensing, metering, and wearable endpoints.

FAQ

What is the maximum operating temperature range for MKL17Z256VMP4R?

MKL17Z256VMP4R is rated for –40 to 105 °C operation, validated for MAPBGA packaging per NXP's datasheet Rev. 7 (Oct 2023). This extended range supports deployment in automotive cabin environments and industrial enclosures without forced cooling, unlike commercial-grade variants limited to 85 °C.

Does MKL17Z256VMP4R include a factory-programmed bootloader?

Yes, MKL17Z256VMP4R integrates 16 KB of ROM containing a production-ready bootloader supporting UART and I²C firmware updates. This eliminates the need for external programming hardware during field upgrades and enables secure over-the-air patching in certified medical or utility applications.

How many ADC channels does MKL17Z256VMP4R support, and what is their resolution?

MKL17Z256VMP4R features a single 16-channel, 12-bit successive-approximation ADC with integrated high-accuracy 1.2 V internal voltage reference. It supports both single-ended (up to 16 channels) and differential (up to 4 pairs) configurations, enabling precision ratiometric measurements in battery-powered sensor systems.

What debug interface does MKL17Z256VMP4R use, and how many pins are required?

MKL17Z256VMP4R uses a two-pin Serial Wire Debug (SWD) interface - SWD_CLK and SWD_DIO - supporting full programming, real-time tracing via Micro Trace Buffer, and non-intrusive variable inspection. This reduces debug header footprint by 50% versus traditional JTAG, preserving PCB space in miniaturized designs.

Is MKL17Z256VMP4R pin-compatible with other KL17 family members in the same package?

Yes, MKL17Z256VMP4R shares identical 64-pin MAPBGA pinout and signal mapping with MKL17Z128VMP4 and MKL17Z256VMP4 (non-R suffix), enabling flash-size scalability without PCB redesign. However, the 'R' suffix denotes tape-and-reel packaging - electrical and mechanical compatibility remains unchanged.

MKL17Z256VMP4R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-LFBGA
Series:
Kinetis KL1
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 20x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MKL17Z256VMP4R FAQ

1.How can I place an order for MKL17Z256VMP4R through Aetrix?

Please submit a Request for Quotation (RFQ) for MKL17Z256VMP4R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MKL17Z256VMP4R reliable?

The price and inventory of MKL17Z256VMP4R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MKL17Z256VMP4R is usually 5 days.

3.What payment methods are accepted for MKL17Z256VMP4R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MKL17Z256VMP4R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MKL17Z256VMP4R?

MKL17Z256VMP4R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MKL17Z256VMP4R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MKL17Z256VMP4R?

For technical support, including MKL17Z256VMP4R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MKL17Z256VMP4R requirements.

6.How does Aetrix verify that MKL17Z256VMP4R is sourced from the original manufacturer or authorized distributors?

All MKL17Z256VMP4R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MKL17Z256VMP4R meets industry standards.

7.What is the process for return or replacement of MKL17Z256VMP4R?

All MKL17Z256VMP4R units undergo pre-shipment inspection (PSI). If there is an issue with MKL17Z256VMP4R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MKL17Z256VMP4R part is unused and in its original packaging.

Return procedure for MKL17Z256VMP4R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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