NXP Semiconductors MKL17Z32VDA4
- Part No.:
- MKL17Z32VDA4
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 36-XFBGA
- Datasheet:
-
MKL17Z32VDA4.pdf
- Description:
- IC MCU 32BIT 32KB FLASH 36XFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,599
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Product details
Overview
MKL17Z32VDA4 from NXP Semiconductors (formerly Freescale) is a 32 KB Flash, 8 KB SRAM ARM® Cortex®-M0+ microcontroller in 36-pin XFBGA (3.5×3.5 mm, 0.5 mm pitch), optimized for ultra-low-power battery-operated applications. It delivers 48 MHz core performance, 1.71–3.6 V operation, –40 to 105 °C temperature range, and integrates FlexIO, hardware CRC, and 15-channel 16-bit ADC with internal voltage reference.
For engineers reviewing the MKL17Z32VDA4 datasheet, MKL17Z32VDA4 pinout, MKL17Z32VDA4 application, or MKL17Z32VDA4 equivalent, key selection considerations include its 36-pin XFBGA footprint, 32 GPIOs, low-power UART/I²C/SPI peripherals, stop-mode current of 1.68 µA (RAM + RTC retained), and ROM-based bootloader supporting UART/I²C/SPI firmware updates.
Technical Context
The MKL17Z32VDA4 implements an ARM Cortex-M0+ core with Thumb-2 instruction set, NVIC supporting 32 interrupt vectors and 4 priority levels, and a multiplexed crossbar switch enabling concurrent bus master access. Its clock system combines 48 MHz HIRC, 8 MHz LIRC, 1 kHz LPO, and external crystal support (32 kHz–32 MHz).
Power management includes six static low-power modes - VLPR, VLPW, Stop, VLPS, LLS, and VLLS - with wake-up via LLWU (8 pins + 4 internal sources), AWIC, or NVIC. Peripherals are clock-gated per module, with independent clock source selection (e.g., LPUART uses bus clock, RTC uses ERCLK32K, FlexIO uses bus clock).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M0+, up to 48 MHz - enables real-time control at sub-100 µA/MHz efficiency |
| Flash / SRAM | 32 KB flash / 8 KB SRAM - sufficient for BLE sensor node firmware with OTA update space |
| Operating Voltage | 1.71–3.6 V - supports direct Li-ion/Li-Po battery input without regulator overhead |
| Temperature Range | –40 to 105 °C - qualified for industrial and automotive under-hood edge sensing |
| Low-Power Stop Current | 1.68 µA (RAM + RTC retained) - enables multi-year battery life in periodic wake-up sensor nodes |
| ADC Resolution | 16-bit, up to 15 single-ended channels - provides high-precision analog monitoring without external signal conditioning |
| I/O Count | 32 GPIOs (all 5 V tolerant) - supports mixed-signal interface to sensors, switches, and LEDs in compact layouts |
Pinout & Package
Package: 36-pin XFBGA (3.5 mm × 3.5 mm, 0.5 mm pitch, 0.5 mm thickness), JEDEC MO-220 compliant, reflow-compatible.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O supply | Primary 1.71–3.6 V power input; requires local 100 nF decoupling |
| VSS | Ground reference | Dedicated ground return for analog/digital domains; must be low-impedance |
| PTA0 / SWD_CLK | Debug clock / GPIO | Two-function pin: enables 2-pin SWD programming and debug trace via Micro Trace Buffer |
| PTA1 / SWD_DIO | Debug data I/O / GPIO | Shared SWD bidirectional data line; supports serial wire debug without JTAG overhead |
| PTB0 / LLWU_P5 | Wake-up input / GPIO | Configurable as low-leakage wake-up source from Very Low Leakage Stop (VLLS) mode |
| PTC0 / ADC0_SE0 | Analog input / GPIO | Single-ended ADC channel 0 input; supports internal 1.2 V reference for ratiometric measurements |
Key Features
| Feature | Design Value |
|---|---|
| FlexIO module | Programmable logic engine enabling custom UART/I²C/SPI/I²S/PWM protocols - eliminates need for external protocol bridge ICs |
| Hardware CRC module | Dedicated 32-bit CRC accelerator - offloads checksum computation from CPU during firmware update or data logging |
| ROM bootloader | 16 KB factory-programmed ROM with UART/I²C/SPI firmware update support - enables field upgrades without debug interface |
| Low-power timers | LPTMR + RTC + PIT - allows precise timekeeping and periodic wake-up at <2 µA total system current |
| Security features | Flash protection regions, 80-bit unique ID, SWD lockout after security enable - meets basic industrial device authentication requirements |
Applications
| Wireless Sensor Node | Industrial Control Panel |
|---|---|
Use Scenario: Battery-powered environmental monitor transmitting temperature/humidity via BLE or Sub-GHz RF. IC Role / Device Role / Timing Role: Main controller executing sensor acquisition, data preprocessing, low-power scheduling, and radio interface management. Use Value: 1.68 µA stop-mode current extends 2-AA battery life beyond 5 years; FlexIO adapts to proprietary RF PHY timing without FPGA. |
Use Scenario: Local HMI on PLC rack with pushbuttons, LED indicators, and RS-485 diagnostics port. IC Role / Device Role / Timing Role: Dedicated UI processor handling button debouncing, LED PWM dimming, and isolated serial communication. Use Value: 32 GPIOs drive 12 buttons + 8 LEDs directly; hardware CRC ensures integrity of firmware updates over noisy industrial buses. |
| Smart Meter Interface | Medical Wearable |
Use Scenario: Pulse-output interface between utility meter and gateway, capturing kWh pulses and reporting via NB-IoT. IC Role / Device Role / Timing Role: Isolated pulse counter with timestamping, secure storage, and cellular modem handshaking. Use Value: RTC + LPTMR provide accurate time-stamped event capture; 105 °C rating supports enclosure mounting near transformer heat sources. |
Use Scenario: ECG/PPG patch collecting biopotential signals, performing motion artifact filtering, and streaming to smartphone. IC Role / Device Role / Timing Role: Analog front-end controller managing ADC sampling, digital filtering, and Bluetooth LE packetization. Use Value: 16-bit ADC with internal reference achieves >90 dB SNR for low-amplitude bio-signals; 3.5×3.5 mm XFBGA enables ultra-thin wearable form factor. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MKL27Z32VDA4 | Same 36-pin XFBGA package, but 64 KB Flash, 16 KB SRAM, USB OTG, and enhanced ADC calibration - higher memory and connectivity headroom | Better suited for USB-enabled field programmers or devices requiring dual-role USB interface | Select when future firmware growth or USB host/device capability is required; same PCB layout but higher BOM cost |
| STM32L053R8T6 | 32-pin LQFP, 64 KB Flash, 8 KB SRAM, no FlexIO, but integrated AES-128 and true random number generator | Preferred for security-critical IoT endpoints where cryptographic acceleration outweighs peripheral flexibility | Choose when hardware crypto acceleration and certified TRNG are mandatory; requires PCB redesign due to different package and pinout |
Compared with MKL17Z32VDA4, MKL27Z32VDA4 offers scalable memory and USB without layout change, while STM32L053R8T6 trades FlexIO for embedded crypto - making MKL17Z32VDA4 optimal for cost-constrained, peripheral-flexible, battery-life-critical designs.
Availability
MKL17Z32VDA4 is available at Aetrix Electronics and suitable for wireless sensor nodes, industrial HMI panels, smart meter interfaces, and medical wearables requiring stable component supply across long-lifecycle deployments.
Supply support for MKL17Z32VDA4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.
The Kinetis KL17 family was designed specifically for ultra-low-power, cost-sensitive embedded applications - emphasizing battery longevity, flexible peripheral emulation, and robust security for resource-constrained edge devices.
FAQ
What is the maximum operating frequency of the MKL17Z32VDA4?
The MKL17Z32VDA4 operates at a maximum core frequency of 48 MHz using its internal 48 MHz high-accuracy HIRC oscillator. This frequency is fully supported across its full voltage range (1.71–3.6 V) and temperature range (–40 to 105 °C), and is used for both CPU execution and platform clock generation in Run and VLPR modes.
Does the MKL17Z32VDA4 support in-system programming without a debugger?
Yes, the MKL17Z32VDA4 includes a factory-programmed 16 KB ROM bootloader that supports firmware updates over UART, I²C, or SPI interfaces - enabling field upgrades without SWD connection. The bootloader is accessible after reset when BOOTCFG0 pin is low or FOPT register is configured accordingly.
How many ADC channels does the MKL17Z32VDA4 support in its 36-pin XFBGA package?
The MKL17Z32VDA4 in the 36-pin XFBGA (VDA4) package supports 15 single-ended or 4 differential ADC input channels. This is confirmed in Table 1 of the KL17 datasheet, which lists "15/4" for ADC channels (SE/DP) under the MKL17Z32VDA4 row - fewer than the 20/4 available in 64-pin variants due to pin count limitations.
What low-power modes are available on the MKL17Z32VDA4, and what is the lowest achievable current draw?
The MKL17Z32VDA4 supports six low-power modes: VLPR, VLPW, Stop, VLPS, LLS, and VLLS. Its lowest active-retention current is 1.68 µA in Stop mode with RAM and RTC retained. In VLLS3 mode, current drops further to ~0.7 µA (per datasheet Rev. 5, Section 5.2.2), though only the 32-byte register file and limited peripherals remain functional.
Is the MKL17Z32VDA4 pin-compatible with other Kinetis KL17 variants in the same package?
Yes, all KL17 variants in the 36-pin XFBGA (VDA4) package - including MKL17Z32VDA4 and MKL17Z64VDA4 - share identical pinouts and electrical characteristics. They differ only in Flash/SRAM size and marking; firmware built for MKL17Z32VDA4 runs unmodified on MKL17Z64VDA4, enabling seamless memory scalability.
MKL17Z32VDA4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 36-XFBGA
- Series:
- Kinetis KL1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- I2C, FlexIO, SPI, UART/USART
- Peripherals:
- DMA, I2S, PWM, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 15x16b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MKL17Z32VDA4 FAQ
1.How can I place an order for MKL17Z32VDA4 through Aetrix?
Please submit a Request for Quotation (RFQ) for MKL17Z32VDA4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MKL17Z32VDA4 reliable?
The price and inventory of MKL17Z32VDA4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MKL17Z32VDA4 is usually 5 days.
3.What payment methods are accepted for MKL17Z32VDA4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MKL17Z32VDA4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MKL17Z32VDA4?
MKL17Z32VDA4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MKL17Z32VDA4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MKL17Z32VDA4?
For technical support, including MKL17Z32VDA4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MKL17Z32VDA4 requirements.
6.How does Aetrix verify that MKL17Z32VDA4 is sourced from the original manufacturer or authorized distributors?
All MKL17Z32VDA4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MKL17Z32VDA4 meets industry standards.
7.What is the process for return or replacement of MKL17Z32VDA4?
All MKL17Z32VDA4 units undergo pre-shipment inspection (PSI). If there is an issue with MKL17Z32VDA4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MKL17Z32VDA4 part is unused and in its original packaging.
Return procedure for MKL17Z32VDA4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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