My Inquiry
My Account
NXP Semiconductors MKL26Z64VFM4
- Part No.:
- MKL26Z64VFM4
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
MKL26Z64VFM4.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 32QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,710
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MKL26Z64VFM4 from NXP (formerly Freescale) is a 48 MHz ARM Cortex-M0+ microcontroller in 32-pin QFN package, featuring 64 KB flash, 8 KB SRAM, USB 2.0 On-The-Go with on-chip transceiver, 16-bit SAR ADC, and ultra-low-power operation down to 0.4 µA in VLLS0 mode. It serves as an entry-level 32-bit MCU for battery-powered human-machine interface and sensor-edge applications.
For engineers reviewing the MKL26Z64VFM4 datasheet, MKL26Z64VFM4 pinout, MKL26Z64VFM4 application, or MKL26Z64VFM4 equivalent, key selection criteria include its 32-pin QFN footprint, USB OTG capability with integrated 5 V-to-3.3 V regulator, 16-bit ADC resolution, -40°C to +105°C industrial temperature range, and support for nine low-power modes including VLLS0 with full state retention and 4.5 µs wakeup.
Technical Context
The MKL26Z64VFM4 implements a single-core ARM Cortex-M0+ processor with Thumb-2 instruction set, executing from zero-wait-state flash memory. Its clock system integrates MCG with multiple modes (FEI, FBE, BLPI, BLPE) supporting internal 4 MHz/32 kHz IRC and external crystal inputs up to 16 MHz.
Peripheral integration includes a 6-channel TPM timer, two UARTs, two SPIs, I²S/SAI, two I²C modules, TSI-based touch sensing, and a 12-bit DAC paired with analog comparator. Power management leverages clock gating, dynamic voltage scaling, and dedicated low-leakage domains enabling sub-µA stop-mode operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M0+, 48 MHz max - delivers 30.5 CoreMark/mA efficiency in run mode |
| Memory | 64 KB flash / 8 KB SRAM - sufficient for USB device stack + real-time control firmware |
| USB Interface | Full-/low-speed OTG with on-chip transceiver and 5 V-to-3.3 V regulator - eliminates external PHY and LDO |
| ADC | 16-bit SAR ADC with PGA - supports high-resolution sensor signal acquisition without external amplifier |
| Low-Power Modes | Nine modes including VLLS0 (0.4 µA @ 3.0 V) - enables multi-year battery life in wake-on-event designs |
| Operating Voltage | 1.71–3.6 V - compatible with single-cell Li-ion, LiPo, and 3.3 V rail systems |
| Temperature Range | -40°C to +105°C - qualified for industrial and automotive under-hood environments |
Pinout & Package
32-pin QFN (VFM4), 5 mm × 5 mm × 1 mm, 0.5 mm pitch, exposed thermal pad. Pinout conforms to KL26P64M48SF5 package drawing 98ASA00473D1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Digital power supply and ground | Decoupling required per datasheet layout guidelines; VSS connects to exposed thermal pad |
| VDDA, VSSA | Analog power and ground | Must be isolated from digital planes; 100 nF + 1 µF local decoupling mandatory |
| USB_DP / USB_DM | USB differential data lines | Require 27 Ω series resistors and 15 kΩ pull-down on DM for device enumeration |
| PTA0 / PTA1 | USB_VREGIN / USB_VBUS | Accept 4.75–5.25 V input; enable internal 3.3 V regulator for USB PHY operation |
| PTB0 / PTB1 | SWD_CLK / SWD_DIO | Support debug via 2-pin Serial Wire Debug; no reset line needed for basic programming |
| PTC0–PTC7 | GPIO / TSI channels | Configurable as capacitive touch inputs; support self- and mutual-capacitance measurement |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power architecture | 0.4 µA VLLS0 current with full RAM retention and 4.5 µs wakeup - enables energy harvesting and coin-cell operation |
| Integrated USB OTG PHY | On-die transceiver + 5 V-to-3.3 V regulator - reduces BOM count by 4 components vs discrete PHY solution |
| 16-bit SAR ADC with PGA | Programmable gain up to 16× and hardware averaging - achieves effective resolution >14 bits for precision sensor interfaces |
| Touch Sensing Interface (TSI) | Hardware-accelerated capacitive sensing on up to 16 pins - eliminates need for external touch controller IC |
| Bit Manipulation Engine (BME) | Atomic bit-set/clear/test instructions - improves RTOS task switching and peripheral register access reliability |
Applications
| Smart Thermostat Interface | Industrial Sensor Node |
|---|---|
Use Scenario: Local temperature/humidity display with capacitive touch buttons and wireless reporting. IC Role / Device Role / Timing Role: Main controller handling TSI input, ADC sampling, USB configuration, and real-time clock management. Use Value: Single-chip integration of touch, analog sensing, and USB connectivity reduces PCB area by 35% versus discrete MCU + touch controller + USB PHY solution. | Use Scenario: Battery-powered vibration/temperature monitor in factory machinery with periodic BLE upload. IC Role / Device Role / Timing Role: Low-power data acquisition unit entering VLLS0 between 10-second sensor reads; wakes on RTC alarm. Use Value: 0.4 µA VLLS0 current extends 2000 mAh Li-SOCl₂ battery life to >10 years at 10 s wake interval. |
| USB-C Powered Peripheral | Medical Patch Monitor |
Use Scenario: Portable ECG front-end that draws power and communicates via USB-C port. IC Role / Device Role / Timing Role: USB device controller managing VBUS detection, 5 V-to-3.3 V regulation, and isochronous data streaming. Use Value: Integrated USB regulator and transceiver eliminate external DC-DC and PHY, meeting IEC 62368-1 creepage requirements in compact form factor. | Use Scenario: Disposable wearable patch measuring skin impedance and temperature for hydration tracking. IC Role / Device Role / Timing Role: Ultra-low-power signal conditioner acquiring analog bio-signals and storing encrypted logs in flash. Use Value: 16-bit ADC + PGA enables 12-bit ENOB at 100 SPS without external op-amps, reducing component count and leakage paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| KL26Z64VFT4 | 48-pin QFN, 36 GPIOs, same core/peripherals but larger package and higher I/O count | Suitable where board space allows and additional GPIOs or ADC channels are required | Select when needing >23 GPIOs or routing flexibility beyond 32-pin constraints |
| KL27Z64VFM4 | Same 32-pin QFN, adds full-speed USB crystal-less operation and improved ADC accuracy (±1 LSB INL) | Better suited for USB host-side enumeration or higher-precision analog acquisition | Prefer when crystal-free USB device operation or tighter ADC linearity is critical |
Compared with MKL26Z64VFM4, KL26Z64VFT4 offers more I/O in a larger footprint while KL27Z64VFM4 enhances USB robustness and analog precision-both retain identical software compatibility and toolchain support within the Kinetis L family.
Availability
MKL26Z64VFM4 is available at Aetrix Electronics and suitable for industrial sensor nodes, medical wearables, and USB-powered peripherals requiring stable component supply and long-term lifecycle assurance.
Supply support for MKL26Z64VFM4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets.
The Kinetis KL26 series belongs to NXP's ultra-low-power 32-bit MCU portfolio, designed specifically for cost-sensitive, battery-operated edge devices requiring USB connectivity, capacitive touch, and high-precision analog sensing.
FAQ
What is the maximum operating frequency of the MKL26Z64VFM4 core?
The MKL26Z64VFM4 features an ARM Cortex-M0+ core rated for up to 48 MHz operation. This frequency is achievable using the MCG in PEE mode with an external 8 MHz crystal and PLL multiplication. At 48 MHz, the device delivers 30.5 CoreMark/mA efficiency and supports zero-wait-state execution from flash memory.
Does the MKL26Z64VFM4 support USB device functionality without external components?
Yes, the MKL26Z64VFM4 integrates a full-speed USB 2.0 transceiver and a 5 V-to-3.3 V regulator. When powered from USB VBUS (4.75–5.25 V), it autonomously generates its 3.3 V USB PHY supply and handles differential signaling on USB_DP/USB_DM pins - requiring only 27 Ω series resistors and standard USB termination.
What low-power modes are available on the MKL26Z64VFM4 and what is the lowest current draw?
The MKL26Z64VFM4 supports nine low-power modes, including VLLS0 (Very-Low-Leakage Stop Mode 0). In VLLS0 with PORPO=1, it draws just 0.23 µA typical at 25°C while retaining full SRAM and register contents and enabling 4.5 µs wakeup via RTC or GPIO interrupt - ideal for energy-constrained applications.
Can the MKL26Z64VFM4 perform capacitive touch sensing?
Yes, the MKL26Z64VFM4 includes a dedicated Touch Sensing Interface (TSI) module supporting up to 16 electrodes. It provides hardware-accelerated self- and mutual-capacitance measurement, automatic calibration, and noise immunity features - enabling robust touch buttons, sliders, or proximity detection without external controller or firmware overhead.
What is the ADC resolution and key analog capability of the MKL26Z64VFM4?
The MKL26Z64VFM4 integrates a 16-bit SAR ADC with programmable gain amplifier (PGA) offering gains of 1×, 2×, 4×, 8×, or 16×. It achieves ±1 LSB integral nonlinearity and supports hardware averaging, enabling effective resolution exceeding 14 bits at 100 SPS - suitable for precision temperature, pressure, or biomedical signal acquisition.
MKL26Z64VFM4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-VFQFN Exposed Pad
- Series:
- Kinetis KL2
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART, USB, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 23
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D - 16bit; D/A - 12bit
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
MKL26Z64VFM4 FAQ
1.How can I place an order for MKL26Z64VFM4 through Aetrix?
Please submit a Request for Quotation (RFQ) for MKL26Z64VFM4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MKL26Z64VFM4 reliable?
The price and inventory of MKL26Z64VFM4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MKL26Z64VFM4 is usually 5 days.
3.What payment methods are accepted for MKL26Z64VFM4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MKL26Z64VFM4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MKL26Z64VFM4?
MKL26Z64VFM4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MKL26Z64VFM4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MKL26Z64VFM4?
For technical support, including MKL26Z64VFM4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MKL26Z64VFM4 requirements.
6.How does Aetrix verify that MKL26Z64VFM4 is sourced from the original manufacturer or authorized distributors?
All MKL26Z64VFM4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MKL26Z64VFM4 meets industry standards.
7.What is the process for return or replacement of MKL26Z64VFM4?
All MKL26Z64VFM4 units undergo pre-shipment inspection (PSI). If there is an issue with MKL26Z64VFM4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MKL26Z64VFM4 part is unused and in its original packaging.
Return procedure for MKL26Z64VFM4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MKL26Z64VFM4 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
