NXP Semiconductors MKL27Z128VFM4
- Part No.:
- MKL27Z128VFM4
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-UFQFN Exposed Pad
- Datasheet:
-
MKL27Z128VFM4.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 32QFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,510
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MKL27Z128VFM4 from NXP Semiconductors (formerly Freescale) is a 48 MHz ARM® Cortex®-M0+ microcontroller with 128 KB flash, 32 KB SRAM, and USB Full-Speed 2.0 device controller supporting crystal-less operation. It delivers 54 µA/MHz in very low power run mode and 1.96 µA in VLLS3 deep-sleep mode with RAM + RTC retained, targeting battery-powered sensor nodes and portable medical devices requiring integrated USB connectivity and ultra-low-power operation.
For engineers reviewing the MKL27Z128VFM4 datasheet, MKL27Z128VFM4 pinout, MKL27Z128VFM4 application, or MKL27Z128VFM4 equivalent, key selection criteria include its 32-pin QFN package, 23 GPIOs (19 interrupt-capable + 6 high-drive), 7-channel single-ended ADC, and integrated ROM bootloader enabling field firmware updates without external programming hardware.
Technical Context
The MKL27Z128VFM4 integrates an ARM Cortex-M0+ core with tightly coupled peripherals including a crystal-less USB FS 2.0 controller, FlexIO for customizable serial interface emulation, and dual clock domains (HIRC up to 48 MHz and LIRC at 2/8 MHz). Its power architecture supports six static low-power modes - from VLPR (4 MHz core @ 249 µA) to VLLS0 (0.18 µA) - with precise voltage reference (1.2 V internal) and configurable LVD thresholds.
Peripherals are mapped via flexible pin multiplexing: two low-power UARTs operate in VLPS/VLLS modes, the 16-bit ADC achieves 818 ksps with internal Vref, and the 12-bit DAC plus 6-bit DAC-in-CMP enables analog signal generation and programmable threshold detection. All I/Os support 1.71–3.6 V operation with ±25 mA per-pin drive capability on six high-drive pads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM Cortex-M0+, 48 MHz max - deterministic real-time execution with Micro Trace Buffer for cycle-accurate debugging. |
| Memory | 128 KB flash / 32 KB SRAM / 16 KB ROM bootloader - sufficient for USB HID stack + sensor fusion algorithms in standalone edge node designs. |
| USB Interface | Crystal-less USB FS 2.0 device - eliminates external 12 MHz crystal and associated BOM cost and layout area. |
| Power Efficiency | 54 µA/MHz (VLPR mode) / 1.96 µA (VLLS3 with RAM+RTC) - enables multi-year battery life in coin-cell-powered IoT endpoints. |
| Analog Peripherals | 16-bit 818 ksps ADC (7 SE channels), 12-bit DAC, 6-bit DAC-in-CMP - supports precision sensor signal conditioning and closed-loop control without external components. |
| Package & I/O | 32-pin QFN (5×5 mm, 0.5 mm pitch), 23 GPIOs (19 interrupt-capable, 6 high-drive) - compact footprint for space-constrained wearables and handheld diagnostics. |
| Operating Range | 1.71–3.6 V supply, –40 to +105 °C - suitable for industrial-grade portable equipment operating across wide ambient conditions. |
Pinout & Package
32-pin QFN package (5 mm × 5 mm, 0.5 mm pitch, 0.65 mm thickness) with exposed thermal pad (EP) on underside for enhanced heat dissipation in sealed enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VSS, VSSA | Power and ground rails | Separate digital/analog supplies enable noise isolation; VDDA must be within ±0.1 V of VDD for ADC/DAC accuracy. |
| USB_DP / USB_DM | USB Full-Speed differential pair | Internally biased for crystal-less operation; requires 27 Ω series resistors and 1.5 kΩ pull-up on DP per USB spec. |
| PTA0–PTA3, PTB0–PTB7, PTC0–PTC7, PTD0–PTD7 | GPIO multiplexed pins | 23 total GPIOs; 19 support interrupt generation; 6 support 25 mA high-drive for direct LED/relay driving. |
| ADC0_SE0–ADC0_SE6 | Single-ended ADC inputs | 7 dedicated analog input channels mapped to PTA0–PTA3, PTB0–PTB2 - no external mux needed for 7-sensor monitoring. |
| CLKIN / CLKOUT | External clock interface | Optional 3–32 MHz crystal input or 32–40 kHz RTC crystal; CLKOUT can mirror internal HIRC/LIRC for system clock distribution. |
Key Features
| Feature | Design Value |
|---|---|
| Crystal-less USB FS 2.0 | Eliminates 12 MHz crystal, load capacitors, and routing constraints - reduces BOM count by ≥3 parts and PCB area by >2 mm². |
| FlexIO module | Configurable logic engine emulates UART/I²C/SPI/IrDA/PWM - replaces discrete level shifters or protocol bridges in custom peripheral interfaces. |
| Low-power timer (LPTMR) | Runs from 1 kHz LPO in VLLS1/VLLS3 - enables wake-up intervals from 1 ms to 36 hours without CPU intervention or external RTC. |
| Embedded ROM bootloader | Supports UART/USB HID firmware updates in-field - avoids need for SWD debugger during production programming or field service. |
| High-accuracy internal references | 48 MHz HIRC (±0.5%), 8/2 MHz LIRC (±3%), 1.2 V bandgap - removes external oscillators and voltage references for cost-sensitive designs. |
Applications
| Wearable Health Monitor | USB-C Powered Sensor Hub |
|---|---|
|
Use Scenario: Compact wrist-worn device measuring heart rate, skin temperature, and motion using analog front-end sensors and BLE-to-USB bridge. IC Role / Device Role / Timing Role: Primary MCU executing sensor fusion, managing USB HID reports, and regulating power across sleep/wake cycles using VLLS3 retention. Use Value: 1.96 µA deep-sleep current extends CR2032 battery life beyond 12 months; crystal-less USB enables direct PC connection without timing component overhead. |
Use Scenario: Industrial sensor aggregation unit powered via USB-C PD (5 V), collecting data from 6 analog pressure transducers and 2 digital I²C accelerometers. IC Role / Device Role / Timing Role: USB device endpoint converting analog/digital sensor streams into CDC ACM serial packets; FlexIO handles custom I²C burst reads while CPU sleeps. Use Value: 7-channel ADC with internal 1.2 V reference achieves <1% gain error across –40 to +105 °C; high-drive GPIOs directly drive USB-C VCONN switches. |
| Portable Diagnostic Tool | Smart Energy Meter Interface |
|
Use Scenario: Handheld ECG/EMG analyzer with OLED display, tactile buttons, and rechargeable Li-ion battery. IC Role / Device Role / Timing Role: Real-time signal acquisition host with DMA-driven ADC sampling, waveform rendering via SPI OLED driver, and USB mass storage for waveform export. Use Value: 818 ksps ADC sample rate captures 100+ Hz bio-signals; ROM bootloader allows clinical firmware updates via drag-and-drop USB drive. |
Use Scenario: DIN-rail mounted meter add-on module interfacing legacy pulse-output meters and RS-485 utility networks via USB-C host port. IC Role / Device Role / Timing Role: USB device presenting as CDC ACM to upstream gateway; UART0 handles ISO7816 smart card interface for utility authentication. Use Value: ISO7816 UART supports 1.5 Mbit/s contactless card reading; 105 °C rating ensures reliability inside thermally stressed meter enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| EFM32PG12B500F1024GL125 | ARM Cortex-M4, 1024 KB flash, 256 KB RAM, 1.42 µA deep-sleep - higher performance but larger 125-pin QFP package and no native USB device. | Requires external USB PHY; better suited for complex motor control or audio processing where M4 DSP extensions are critical. | Select when >48 MHz core speed, floating-point, or larger memory is required - not a drop-in replacement due to pinout and USB architecture differences. |
| STM32L072KBU6 | ARM Cortex-M0+, 128 KB flash, 20 KB RAM, 0.29 µA shutdown - lower deep-sleep current but lacks crystal-less USB and has only 12-bit ADC (1.14 Msps). | No USB device controller; relies on external USB bridge IC - increases BOM and complicates EMI compliance for USB-certified designs. | Choose for ultra-low-power sensor nodes where USB is handled externally or omitted; verify ADC channel count (19 vs. MKL27Z128VFM4's 7) matches signal chain needs. |
Compared with EFM32PG12B500F1024GL125 and STM32L072KBU6, the MKL27Z128VFM4 uniquely balances crystal-less USB integration, 7-channel ADC, and sub-2 µA deep-sleep in a 32-pin QFN - making it optimal for compact, self-contained USB-connected edge sensors where layout area and component count are constrained.
Availability
MKL27Z128VFM4 is available at Aetrix Electronics and suitable for wearable health monitors, USB-C sensor hubs, portable diagnostic tools, and smart energy meter interfaces requiring stable component supply across extended production lifecycles.
Supply support for MKL27Z128VFM4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's Kinetis portfolio.
The Kinetis KL27 family was designed specifically for cost-sensitive, battery-operated USB-peripheral applications - emphasizing crystal-less USB, ultra-low-power modes, and integrated analog subsystems to minimize external components.
FAQ
What is the maximum operating frequency of the MKL27Z128VFM4 core?
The MKL27Z128VFM4 features an ARM Cortex-M0+ core rated for up to 48 MHz operation using the internal high-accuracy reference clock (HIRC). This frequency is achievable across the full –40 to +105 °C temperature range and 1.71–3.6 V supply voltage, with timing validated per the official datasheet Rev. 5 (2015). The MKL27Z128VFM4 maintains this speed without external crystal dependency due to factory-trimmed HIRC calibration.
Does the MKL27Z128VFM4 support USB device functionality without an external crystal?
Yes, the MKL27Z128VFM4 integrates a crystal-less USB Full-Speed 2.0 device controller that uses its internal 48 MHz HIRC as the USB clock source. This eliminates the need for an external 12 MHz crystal, associated load capacitors, and board layout for USB timing - confirmed in the "USB electrical specifications" section of the MKL27Z128VFM4 datasheet (Rev. 5, Table 3.8.1).
How many analog-to-digital converter (ADC) input channels does the MKL27Z128VFM4 provide?
The MKL27Z128VFM4 includes a 16-bit ADC module with up to 7 single-ended input channels (ADC0_SE0 through ADC0_SE6), as specified in the Ordering Information table and verified in Section 3.6.1 of the MKL27Z128VFM4 datasheet. These channels are physically mapped to PTA0–PTA3 and PTB0–PTB2 pins, with no multiplexer required for basic 7-sensor acquisition.
What low-power modes are supported by the MKL27Z128VFM4, and what is the lowest current draw?
The MKL27Z128VFM4 supports six static low-power modes, including VLLS0 (Very-Low-Leakage Stop 0) with typical current draw of 0.18 µA at 1.8 V and 25 °C. In VLLS3 mode with RAM and RTC retained, it draws 1.96 µA at 3.0 V - values measured and published in Table 9 of the MKL27Z128VFM4 datasheet (Rev. 5, August 2015).
Is there a built-in bootloader in the MKL27Z128VFM4, and how is it accessed?
Yes, the MKL27Z128VFM4 contains 16 KB of ROM with a factory-programmed bootloader supporting UART and USB HID interfaces. It is activated by holding the RESET pin low while asserting the proper boot configuration pins (BOOTCFG[1:0] = 10), enabling firmware updates without JTAG/SWD debug hardware - detailed in Chapter 4 ("Bootloader") of the MKL27Z128VFM4 Reference Manual (KL27P64M48SF6RM1).
MKL27Z128VFM4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-UFQFN Exposed Pad
- Series:
- Kinetis KL2
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- I2C, SPI, UART/USART, USB
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 23
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 16x16b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MKL27Z128VFM4 FAQ
1.How can I place an order for MKL27Z128VFM4 through Aetrix?
Please submit a Request for Quotation (RFQ) for MKL27Z128VFM4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MKL27Z128VFM4 reliable?
The price and inventory of MKL27Z128VFM4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MKL27Z128VFM4 is usually 5 days.
3.What payment methods are accepted for MKL27Z128VFM4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MKL27Z128VFM4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MKL27Z128VFM4?
MKL27Z128VFM4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MKL27Z128VFM4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MKL27Z128VFM4?
For technical support, including MKL27Z128VFM4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MKL27Z128VFM4 requirements.
6.How does Aetrix verify that MKL27Z128VFM4 is sourced from the original manufacturer or authorized distributors?
All MKL27Z128VFM4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MKL27Z128VFM4 meets industry standards.
7.What is the process for return or replacement of MKL27Z128VFM4?
All MKL27Z128VFM4 units undergo pre-shipment inspection (PSI). If there is an issue with MKL27Z128VFM4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MKL27Z128VFM4 part is unused and in its original packaging.
Return procedure for MKL27Z128VFM4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MKL27Z128VFM4 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

.jpg)