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NXP Semiconductors MKL27Z64VDA4R

Part No.:
MKL27Z64VDA4R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
36-XFBGA
Datasheet:
AetrixMKL27Z64VDA4R.pdf
Description:
IC MCU 32BIT 64KB FLASH 36XFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,449

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Product details

Overview

MKL27Z64VDA4R from NXP Semiconductors (formerly Freescale) is a 48 MHz ARM® Cortex®-M0+ microcontroller with 64 KB flash, 16 KB SRAM, and USB Full-Speed 2.0 device controller supporting crystal-less operation. It features a high-accuracy 48 MHz internal reference clock (±0.5%), down to 46 µA/MHz in very low power run mode, and 1.68 µA in stop mode with RAM + RTC retained - optimized for battery-powered USB peripherals such as smart sensors and portable medical devices.

For engineers reviewing the MKL27Z64VDA4R datasheet, MKL27Z64VDA4R pinout, MKL27Z64VDA4R application, or MKL27Z64VDA4R equivalent, key selection criteria include its 36-pin XFBGA package (3.5×3.5 mm, 0.5 mm pitch), 30 GPIOs, 14-channel 16-bit ADC, FlexIO peripheral for custom serial emulation, and integrated ROM bootloader supporting UART/I2C/USB/SPI firmware updates.

Technical Context

The MKL27Z64VDA4R implements an ARM Cortex-M0+ core with NVIC and SWD debug interface, paired with a MCG-Lite clock generator supporting HIRC48M (±0.5%), LIRC8M (±3%), and 32–40 kHz/3–32 MHz crystal oscillators. Its memory subsystem includes 64 KB flash (1 KB pages), 16 KB SRAM, and 16 KB ROM containing a field-upgradable bootloader.

Peripherals are organized across three clock domains: platform (max 48 MHz), bus (max 24 MHz), and system (USB FS clock). Key modules include USB FS device controller (crystal-less), two I²C interfaces (up to 1 Mbit/s), two SPI modules (24/12 Mbit/s), FlexIO for UART/SPI/I²C/PWM emulation, and a 16-bit ADC with internal 1.2 V reference achieving up to 818 ksps at ≤13-bit resolution.

Key Specifications

Parameter Value and Actual Design Meaning
Core ARM Cortex-M0+, 48 MHz max - delivers deterministic real-time control with Thumb-2 instruction set compatibility.
Flash / SRAM 64 KB flash (1 KB pages), 16 KB SRAM - supports secure firmware storage and real-time data buffering without external memory.
USB Interface USB Full-Speed 2.0 device only, crystal-less operation - eliminates external 12 MHz crystal, reducing BOM cost and PCB area.
ADC 16-bit SAR ADC, 14 single-ended channels, 818 ksps at ≤13-bit - enables high-resolution sensor acquisition with internal voltage reference calibration.
Low-Power Performance 46 µA/MHz in VLPR mode; 1.68 µA in stop mode (RAM + RTC retained) - extends battery life in always-on sensing applications.
Package 36-pin XFBGA, 3.5×3.5×0.5 mm, 0.5 mm pitch - compact footprint suitable for space-constrained wearable and IoT edge nodes.
Operating Range 1.71–3.6 V supply; –40 to +105 °C - supports industrial-grade operation in varied environmental conditions.

Pinout & Package

Package: 36-pin XFBGA (3.5 mm × 3.5 mm, 0.5 mm pitch, 0.5 mm thickness), per package drawing 98ASA00708D.

Pin/Terminal Circuit Role Design Meaning
VDD Core & I/O supply 1.71–3.6 V input; powers all digital logic and GPIOs; requires local 100 nF decoupling.
VSS Digital ground Reference return for core and I/O circuits; must be connected to low-impedance ground plane.
PTA0 / USB_DP USB differential data+ Integrated USB FS transceiver D+ line; supports crystal-less operation with internal oscillator trimming.
PTA1 / USB_DM USB differential data− Integrated USB FS transceiver D− line; requires 27 Ω series termination per USB spec.
PTB0 GPIO / LLWU wake-up input Configurable general-purpose I/O; also serves as low-leakage wake-up source from VLLS modes.
PTC1 GPIO / LLWU wake-up input Second dedicated wake-up pin; enables ultra-low-power event-driven sensing without CPU polling.

Key Features

Feature Design Value
Crystal-less USB FS Eliminates external 12 MHz crystal and load capacitors, reducing component count and layout complexity for USB-peripheral designs.
FlexIO module Programmable logic engine enabling runtime emulation of UART, SPI, I²C, I²S, or PWM - replaces discrete glue logic and expands peripheral flexibility.
Hardware CRC module Accelerates checksum computation for firmware integrity verification and communication protocol framing without CPU overhead.
ROM bootloader 16 KB factory-programmed ROM supporting UART/I2C/USB/SPI-based firmware updates - enables field upgrades without JTAG debugger.
Multi-mode power management Six static low-power modes (VLPR/VLPW/Stop/VLPS/LLS/VLLS) with selective peripheral retention - balances responsiveness and energy efficiency in battery-critical systems.

Applications

Smart Wearable Sensor Hub USB-C Powered Diagnostic Tool

Use Scenario: Compact wrist-worn health monitor aggregating PPG, accelerometer, and temperature data, transmitting via USB to host PC for analysis.

IC Role / Device Role / Timing Role: Central MCU managing sensor fusion, real-time signal processing, and crystal-less USB FS data streaming with precise 48 MHz timing.

Use Value: 1.68 µA stop mode preserves battery during idle; FlexIO offloads SPI-to-I²C bridging for multi-vendor sensor integration.

Use Scenario: Portable clinical diagnostic device powered directly from USB-C port, performing on-the-fly ECG waveform capture and analysis.

IC Role / Device Role / Timing Role: USB-powered host-facing controller executing firmware updates over USB, running ADC sampling at 818 ksps with internal 1.2 V reference.

Use Value: 64 KB flash stores dual firmware images; ROM bootloader enables secure field updates without exposing flash contents via debug interface.

Industrial Wireless Node Gateway Low-Power USB HID Peripheral

Use Scenario: Battery-operated gateway collecting Modbus RTU data from legacy RS-485 sensors and relaying via USB to PLC or SCADA system.

IC Role / Device Role / Timing Role: Protocol translator with UART-to-USB bridge function, leveraging FlexIO for RS-485 direction control and hardware CRC for error detection.

Use Value: 46 µA/MHz VLPR mode extends 10-year battery life; LPUART modules remain active in stop mode for scheduled wake-up polling.

Use Scenario: USB keyboard/mouse with programmable keys and RGB backlight, requiring minimal latency and zero-latency wake from sleep on keypress.

IC Role / Device Role / Timing Role: HID-class USB device controller with LLWU-triggered wake from VLLS0 on GPIO interrupt, resuming full operation in <10 µs.

Use Value: 30 GPIOs support matrix scanning and LED drivers; internal 48 MHz clock ensures USB SOF timing compliance without external crystal.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MKL27Z64VLH4 64-pin LQFP (10×10 mm); 51 GPIOs; same core/peripherals; higher pin count and thermal mass. Better suited for prototyping, debugging, or applications requiring >30 GPIOs or enhanced thermal dissipation. Select when board space allows larger package and additional I/O or debug accessibility is prioritized over miniaturization.
MKE02Z64VLD4 ARM Cortex-M0+ core, 40 MHz; 64 KB flash; no USB; 32-pin LQFP; lacks FlexIO and crystal-less USB capability. Targeted at non-USB cost-sensitive control applications where USB connectivity is unnecessary. Choose only if USB is excluded from system requirements and lower BOM cost outweighs peripheral flexibility loss.

Compared with MKL27Z64VDA4R, MKL27Z64VLH4 offers greater I/O and layout simplicity at the expense of size, while MKE02Z64VLD4 sacrifices USB and FlexIO to reduce cost - making MKL27Z64VDA4R the optimal balance of miniaturization, USB integration, and peripheral versatility for space-constrained USB-peripheral designs.

Availability

MKL27Z64VDA4R is available at Aetrix Electronics and suitable for battery-powered USB peripherals, portable medical diagnostics, and industrial wireless gateways requiring stable component supply and long-term lifecycle support.

Supply support for MKL27Z64VDA4R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader delivering secure, scalable solutions for automotive, industrial, IoT, and mobile applications, with deep expertise in ARM-based microcontrollers and connectivity IP.

The Kinetis KL27 family was designed specifically for cost-sensitive, battery-operated USB-enabled edge devices - emphasizing ultra-low-power operation, crystal-less USB, and flexible peripheral emulation via FlexIO.

FAQ

What is the package type and pin count of MKL27Z64VDA4R?

MKL27Z64VDA4R uses a 36-pin XFBGA package measuring 3.5 mm × 3.5 mm with 0.5 mm pitch and 0.5 mm thickness. This compact form factor is documented in Freescale package drawing 98ASA00708D and supports high-density PCB layouts typical in wearables and portable instrumentation.

Does MKL27Z64VDA4R support crystal-less USB operation?

Yes, MKL27Z64VDA4R integrates a USB Full-Speed 2.0 device controller with internal oscillator trimming that enables crystal-less operation - eliminating the need for an external 12 MHz crystal and associated load capacitors while maintaining USB specification compliance.

What are the low-power modes supported by MKL27Z64VDA4R?

MKL27Z64VDA4R supports six static low-power modes: Very Low Power Run (VLPR), Very Low Power Wait (VLPW), Stop, Very Low Power Stop (VLPS), Low Leakage Stop (LLS), and Very Low Leakage Stop (VLLS0/VLLS1/VLLS3), with current draw as low as 1.68 µA in stop mode while retaining RAM and RTC.

How many GPIOs and ADC channels does MKL27Z64VDA4R provide?

MKL27Z64VDA4R provides 30 general-purpose I/O pins and supports up to 14 single-ended ADC input channels. The 16-bit SAR ADC achieves up to 818 ksps sampling rate at ≤13-bit resolution using the internal 1.2 V voltage reference.

Is there a built-in bootloader in MKL27Z64VDA4R?

Yes, MKL27Z64VDA4R includes 16 KB of factory-programmed ROM containing a bootloader that supports firmware updates over UART, I²C, SPI, and USB interfaces - enabling field upgrades without requiring JTAG/SWD debug access or exposing flash contents.

MKL27Z64VDA4R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
36-XFBGA
Series:
Kinetis KL2
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, FlexIO, SPI, UART/USART, USB
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
30
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 14x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MKL27Z64VDA4R FAQ

1.How can I place an order for MKL27Z64VDA4R through Aetrix?

Please submit a Request for Quotation (RFQ) for MKL27Z64VDA4R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MKL27Z64VDA4R reliable?

The price and inventory of MKL27Z64VDA4R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MKL27Z64VDA4R is usually 5 days.

3.What payment methods are accepted for MKL27Z64VDA4R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MKL27Z64VDA4R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MKL27Z64VDA4R?

MKL27Z64VDA4R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MKL27Z64VDA4R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MKL27Z64VDA4R?

For technical support, including MKL27Z64VDA4R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MKL27Z64VDA4R requirements.

6.How does Aetrix verify that MKL27Z64VDA4R is sourced from the original manufacturer or authorized distributors?

All MKL27Z64VDA4R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MKL27Z64VDA4R meets industry standards.

7.What is the process for return or replacement of MKL27Z64VDA4R?

All MKL27Z64VDA4R units undergo pre-shipment inspection (PSI). If there is an issue with MKL27Z64VDA4R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MKL27Z64VDA4R part is unused and in its original packaging.

Return procedure for MKL27Z64VDA4R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MKL27Z64VDA4R Tags

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