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NXP Semiconductors MKW36A512VFP4

Part No.:
MKW36A512VFP4
Manufacturer:
NXP Semiconductors
Category:
RF Transceiver ICs
Package:
40-VFQFN Exposed Pad
Datasheet:
AetrixMKW36A512VFP4.pdf
Description:
IC RF TXRX+MCU BLE 40HVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:490

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Product details

Overview

MKW36A512VFP4 from NXP Semiconductors is an AEC Q100 Grade 2 qualified ultra-low-power Bluetooth® Low Energy 5.0 wireless microcontroller featuring an Arm® Cortex®-M0+ core running at up to 48 MHz, 512 KB flash memory, integrated FlexCAN module with CAN FD support up to 3.2 Mbps, and a 2.4 GHz radio supporting up to 8 simultaneous BLE connections. It targets automotive digital key, secure vehicle access, and wireless firmware update systems.

For engineers reviewing the MKW36A512VFP4 datasheet, MKW36A512VFP4 pinout, MKW36A512VFP4 application, or MKW36A512VFP4 equivalent, this page delivers verified technical context, package-specific pin assignments, real-world use scenarios, and validated alternative options for automotive-grade BLE + CAN FD integration.

Technical Context

The MKW36A512VFP4 integrates a Bluetooth LE 5.0 Link Layer hardware accelerator with 1 Mbps PHY, supporting hardware-based slave latency and deep-sleep mode (DSM) for extended battery life in automotive access applications. Its radio achieves –95 dBm sensitivity at 1 Mbps BLE and –99 dBm at 250 kbps GFSK (BT=0.5, h=0.5), with programmable output power from –30 dBm to +5 dBm.

It implements a dual-clock architecture: 26/32 MHz crystal for RF timing and 32.768 kHz crystal for RTC and low-power BLE timing synchronization. The on-chip DC-DC buck converter enables operation from 2.1–3.6 V with typical Rx current of 6.3 mA and Tx current of 5.7 mA at 0 dBm - critical for coin-cell or Li-ion powered automotive peripherals.

Key Specifications

Parameter Value and Actual Design Meaning
Core Arm Cortex-M0+, 48 MHz max - enables real-time BLE stack execution with low interrupt latency.
Memory 512 KB flash + 64 KB SRAM + 8 KB FlexRAM - supports full BLE stack, application code, and EEPROM emulation without external storage.
Radio BLE 5.0 compliant, 8 simultaneous hardware connections - eliminates host MCU coordination overhead for multi-device pairing.
RF Sensitivity –95 dBm (BLE 1 Mbps), –99 dBm (250 kbps GFSK) - ensures robust link budget in noisy automotive cabin environments.
Power Consumption 258 nA in VLLS0 mode - enables >10-year battery life in passive entry systems with periodic wake-up.
CAN Interface FlexCAN with CAN FD up to 3.2 Mbps - allows high-bandwidth diagnostics and ECU parameter updates over existing vehicle CAN bus.
Operating Range 1.71–3.6 V supply, –40 to +105 °C - meets automotive Grade 2 thermal and voltage requirements without derating.

Pinout & Package

Package: 40-pin "Wettable" HVQFN, 6×6 mm, 0.5 mm pitch - optimized for automated optical inspection (AOI) and high-reliability solder joint formation in automotive PCB assembly.

Pin/Terminal Circuit Role Design Meaning
VDD_0, VDD_1, VDDA Analog & digital supply rails Support 1.71–3.6 V operation; VDDA powers ADC/CMP/VREF for precision analog sensing.
RF_IN/RF_OUT Bidirectional RF port Single-ended interface with integrated balun - eliminates external matching network for cost-sensitive antenna designs.
XTAL32K 32.768 kHz crystal input Enables precise BLE advertising interval timing and RTC operation during deep sleep (VLLS0).
CAN_H / CAN_L CAN FD differential pair Direct connection to vehicle CAN bus; supports 3.2 Mbps data rate for fast firmware download and diagnostics.
LPUART0_RX / LPUART0_TX Low-power UART channel Operates in VLPS/Stop modes - enables LIN-compliant diagnostics and bootloader communication during vehicle sleep.
GPIO_0–GPIO_17 General-purpose I/O 18 configurable pins in 40-pin package - sufficient for button matrix, LED indicators, and sensor interfaces in compact modules.

Key Features

Feature Design Value
AEC Q100 Grade 2 qualification Validated for automotive ambient temperatures (–40 to +105 °C) and vibration/shock profiles - no requalification needed for Tier 1 production.
Integrated FlexCAN with CAN FD Eliminates need for external CAN transceiver and controller - reduces BOM count and PCB area in key fob or gateway modules.
Dual crystal support (26/32 MHz + 32.768 kHz) Enables independent RF timing accuracy and low-power clock domain separation - critical for BLE advertising stability during battery voltage sag.
Hardware AES-128 + TRNG Accelerates BLE Secure Connections pairing and firmware signature verification - prevents replay attacks in digital key handshakes.
On-chip DC-DC buck converter Reduces peak Rx/Tx current by ~30% vs linear regulator - extends coin-cell life in passive entry systems beyond 5 years.

Applications

Automotive Digital Key Wireless ECU Diagnostics

Use Scenario: Smartphone-based vehicle unlock and engine start using BLE proximity detection and cryptographic challenge-response.

IC Role / Device Role / Timing Role: Standalone BLE + CAN FD bridge - handles BLE link layer, Secure Connections pairing, and CAN FD message translation between smartphone and vehicle CAN bus.

Use Value: Enables OEMs to replace mechanical keys with software-defined access while maintaining AEC-Q100 reliability and <100 ms response latency.

Use Scenario: Over-the-air diagnostic session initiation via smartphone app to read DTCs, perform actuator tests, or calibrate sensors without physical OBD-II connector.

IC Role / Device Role / Timing Role: BLE-to-CAN FD protocol translator - receives BLE commands, formats CAN FD frames, and routes responses back over BLE with timestamped payload integrity.

Use Value: Reduces service bay dependency and enables remote technician support with authenticated, encrypted CAN FD traffic at 3.2 Mbps.

Secure Firmware Updates Smart Tire Pressure Sensor

Use Scenario: Wireless delivery of signed firmware patches to body control modules (BCM) or lighting ECUs during vehicle maintenance mode.

IC Role / Device Role / Timing Role: Trusted execution environment - verifies AES-128 signatures using hardware accelerator, decrypts payload in FlexRAM, and programs flash via secure bootloader.

Use Value: Eliminates need for dealership flash tools; supports field updates with cryptographic chain-of-trust and rollback protection.

Use Scenario: Battery-powered TPMS node transmitting pressure, temperature, and acceleration data every 30 seconds using BLE advertising packets.

IC Role / Device Role / Timing Role: Ultra-low-power sensor hub - samples ADC, processes data in Cortex-M0+, transmits via BLE 5.0 with extended advertising channels, then enters VLLS0 mode.

Use Value: Achieves >7-year battery life using 258 nA VLLS0 current and hardware-accelerated BLE packet generation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar wireless microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MKW36A512VFT4 48-pin "Wettable" HVQFN (7×7 mm); identical core/radio/peripherals but larger footprint and 25 GPIOs vs 18. Preferred when board layout requires additional GPIOs or higher RF performance margin via improved thermal dissipation. Select MKW36A512VFT4 if PCB space permits and extra I/O or thermal headroom is needed; otherwise MKW36A512VFP4 offers optimal size/cost balance.
MKW35A512VFP4 No FlexCAN or second LPUART; lacks CAN FD and LIN support; same 40-pin HVQFN package and memory configuration. Suitable only for pure BLE sensor nodes without vehicle bus integration - cannot replace MKW36A512VFP4 in CAN-connected applications. Choose MKW35A512VFP4 only for cost-sensitive BLE-only designs where CAN FD and LIN are unnecessary.

Compared with MKW36A512VFP4, MKW36A512VFT4 provides more I/O and thermal margin in a larger package, while MKW35A512VFP4 removes CAN FD and LIN capability to reduce cost - making it unsuitable for automotive access or diagnostics requiring vehicle bus bridging.

Availability

MKW36A512VFP4 is available at Aetrix Electronics and suitable for automotive digital key systems, wireless ECU diagnostics, and secure over-the-air firmware updates requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 compliance.

Supply support for MKW36A512VFP4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with leadership in ARM-based microcontrollers and wireless SoCs.

The MKW36A series belongs to NXP's Kinetis W-family of automotive-qualified wireless MCUs, designed specifically to enable secure, low-power Bluetooth LE 5.0 connectivity with integrated CAN FD for vehicle access, diagnostics, and firmware update applications.

FAQ

What is the maximum Bluetooth LE connection count supported by MKW36A512VFP4?

MKW36A512VFP4 supports up to 8 simultaneous hardware Bluetooth LE connections in any master/slave combination, enabling multi-device pairing scenarios such as smartphone + smartwatch + key fob within a single vehicle access system. This capability is implemented in hardware and does not require host CPU intervention for connection management.

Does MKW36A512VFP4 include CAN FD support, and what is its maximum baud rate?

Yes, MKW36A512VFP4 includes a fully integrated FlexCAN module with CAN FD support up to 3.2 Mbps baud rate. This allows high-speed diagnostics and firmware downloads over the vehicle's existing CAN bus infrastructure without requiring external CAN controllers or transceivers.

What package type and dimensions does MKW36A512VFP4 use?

MKW36A512VFP4 uses a 40-pin "Wettable" HVQFN package measuring 6×6 mm with 0.5 mm pitch. This package supports automated optical inspection (AOI) and provides reliable solder joint formation for automotive-grade manufacturing, distinguishing it from the 48-pin variants in the same family.

How does MKW36A512VFP4 achieve ultra-low power consumption in automotive applications?

MKW36A512VFP4 achieves ultra-low power via nine MCU low-power modes including VLLS0 (258 nA), integrated DC-DC buck converter (6.3 mA typical Rx current), and hardware-accelerated BLE deep-sleep modes. These features collectively enable >7-year battery life in passive entry systems operating from a single CR2032 coin cell.

Is MKW36A512VFP4 qualified for automotive use, and under which standard?

Yes, MKW36A512VFP4 is AEC Q100 Grade 2 qualified, certified for operation across –40 °C to +105 °C ambient temperature with full reliability testing including HTOL, TC, and ESD. This qualification makes it suitable for front-end automotive applications such as digital key fobs, TPMS gateways, and body control modules.

MKW36A512VFP4 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
Kinetis KW36A
Package/Case:
40-VFQFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Type:
TxRx + MCU
RF Family/Standard:
Bluetooth
Protocol:
Bluetooth v5.0
Modulation:
FSK, GFSK, MSK
Frequency:
2.4GHz
Data Rate (Max):
1Mbps
Power - Output:
5dBm
Sensitivity:
-95dBm
Memory Size:
265kB Flash, 64kB RAM
Serial Interfaces:
I2C, SPI, UART
GPIO:
-
Voltage - Supply:
1.71V ~ 3.6V
Current - Receiving:
6.3mA
Current - Transmitting:
5.7mA
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Supplier Device Package:
40-HVQFN (6x6)

MKW36A512VFP4 FAQ

1.How can I place an order for MKW36A512VFP4 through Aetrix?

Please submit a Request for Quotation (RFQ) for MKW36A512VFP4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MKW36A512VFP4 reliable?

The price and inventory of MKW36A512VFP4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MKW36A512VFP4 is usually 5 days.

3.What payment methods are accepted for MKW36A512VFP4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MKW36A512VFP4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MKW36A512VFP4?

MKW36A512VFP4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MKW36A512VFP4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MKW36A512VFP4?

For technical support, including MKW36A512VFP4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MKW36A512VFP4 requirements.

6.How does Aetrix verify that MKW36A512VFP4 is sourced from the original manufacturer or authorized distributors?

All MKW36A512VFP4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MKW36A512VFP4 meets industry standards.

7.What is the process for return or replacement of MKW36A512VFP4?

All MKW36A512VFP4 units undergo pre-shipment inspection (PSI). If there is an issue with MKW36A512VFP4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MKW36A512VFP4 part is unused and in its original packaging.

Return procedure for MKW36A512VFP4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MKW36A512VFP4 Tags

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