STMicroelectronics MLPF-WB-01D3

Overview

MLPF-WB-01D3 from STMicroelectronics is a 2.4 GHz integrated low-pass filter with impedance matching network and harmonic rejection, designed specifically for RF front-end integration with STM32WBxx microcontrollers in UFQFPN and VFQFPN packages. It delivers 1.1 dB typical insertion loss, 21 dB typical input/output return loss, 39 dB attenuation at 2f₀ (4.8–5.0 GHz), and operates across –40 °C to +105 °C for Bluetooth 5 and IEEE 802.15.4 wireless modules.

For engineers reviewing the MLPF-WB-01D3 datasheet, MLPF-WB-01D3 pinout, MLPF-WB-01D3 application, or MLPF-WB-01D3 equivalent, this component enables rapid RF layout validation with pre-matched 67 Ω interface to STM32WBxx and 50 Ω antenna port, while meeting ECOPACK2 environmental compliance and CSPG package height ≤ 630 μm after reflow.

Technical Context

The MLPF-WB-01D3 implements a monolithic passive RF filter using ST's IPD (Integrated Passive Device) technology on non-conductive glass substrate, enabling high Q-factor and stable performance across temperature. Its topology integrates a single-ended 67 Ω-to-50 Ω matching network and a deep-rejection multi-pole low-pass structure targeting harmonics up to 5f₀ (12–12.5 GHz).

It is optimized for direct connection between STM32WBxx RF output (IN) and antenna (OUT), with six grounded terminals (GND1–GND4) providing symmetrical RF return paths and minimizing ground loop inductance. No external bias or control signals are required - operation is fully passive and frequency-fixed.

Key Specifications

Pinout & Package

CSPG (Chip Scale Package Glass) with 6 solder bumps, footprint 1.6 mm × 1.0 mm, height ≤ 630 μm after reflow. Glass substrate enables superior RF isolation vs. silicon-based passives.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF front-end filter applications.

Compared with QPFM1002 and SKYFR-000320, MLPF-WB-01D3 uniquely eliminates matching network design effort for STM32WBxx, reduces total RF BOM count, and guarantees harmonics performance without layout iteration - making it optimal for time-critical ST-based wireless development.

Availability

MLPF-WB-01D3 is available at Aetrix Electronics and suitable for Bluetooth 5 module production, Zigbee® smart home hubs, and OpenThread border routers requiring stable component supply and guaranteed RF performance across temperature.

Supply support for MLPF-WB-01D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering microcontrollers, analog ICs, power devices, and MEMS sensors for industrial, automotive, and consumer markets.

The MLPF-WB-01D3 belongs to ST's RF Front-End Passive portfolio, engineered to accelerate certification-ready wireless designs for STM32WB series MCUs by integrating matching and filtering in a single CSPG device.

FAQ

What is the recommended PCB stack-up for optimal RF performance with MLPF-WB-01D3?

The datasheet specifies a 2-layer stack-up with mandatory ground plane on L1 (under the device) and reference ground on L2. Dielectric thickness must be 0.5–1.6 mm (Dk 3.6–4.9). Drill density under the filter must be maximized to ensure equipotentiality and minimize ground inductance.

Can MLPF-WB-01D3 be used with STM32WBxx in QFN packages other than UFQFPN/VFQFPN?

No - the matching network is specifically tuned to the RF output impedance and parasitics of STM32WBxx in UFQFPN and VFQFPN packages. Use with WLCSP or other QFN variants requires re-characterization and may degrade return loss and harmonic suppression.

Is external DC blocking required on IN or OUT pins?

No - MLPF-WB-01D3 is fully AC-coupled internally. Neither IN nor OUT requires external DC blocking capacitors, simplifying layout and reducing component count. The device passes only RF signals and blocks DC by design.

What reflow profile parameters are critical for reliable solder joint formation?

Peak temperature must be 240–245 °C for 60–90 seconds; ramp rates should not exceed 3 °C/s. Air convection must be minimized to prevent component movement. Solder paste must be halide-free ROL0, "no-clean", with 20–38 µm particle size and high tack force.