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STMicroelectronics MLPF-WB-01E3
- Part No.:
- MLPF-WB-01E3
- Manufacturer:
- STMicroelectronics
- Category:
- RF Filters
- Package:
- 6-SMD, No Lead
- Datasheet:
-
MLPF-WB-01E3.pdf
- Description:
- RF FILTER LOW PASS 2.4GHZ 6SMD
- Quantity:
- Payment:
- Shipping:
Inventory:7,039
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Product details
Overview
MLPF-WB-01E3 from STMicroelectronics is a 2.4 GHz bumpless CSP low-pass filter with integrated impedance matching network and harmonic rejection filter, optimized for STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx, and STM32WB30Cx wireless MCUs. It delivers 1.1 dB typical insertion loss, 22 dB typical input return loss, and ≥38 dB attenuation at 2f₀, enabling Bluetooth 5, Zigbee®, and IEEE 802.15.4 RF front-end integration in space-constrained IoT nodes.
For engineers reviewing the MLPF-WB-01E3 datasheet, MLPF-WB-01E3 pinout, MLPF-WB-01E3 application, or MLPF-WB-01E3 equivalent, this component addresses critical RF BOM reduction, 50 Ω antenna interface matching, harmonic suppression compliance, and ultra-thin (≤450 µm) embedded RF filtering requirements in STM32WB-based designs.
Technical Context
This device implements a monolithic passive RF filter using ST's IPD (Integrated Passive Device) technology on non-conductive glass substrate, enabling precise 62 Ω matching to STM32WB RF output and 50 Ω transformation to antenna port. Its deep-rejection architecture targets harmonics up to 5f₀ (12.5 GHz), with measured attenuation of 45 dB at 3f₀ and 42 dB at 5f₀.
The bumpless CSP package supports flip-chip assembly with five terminals (IN, OUT, GND1–GND4), requiring controlled 62 Ω PCB trace to MCU and 50 Ω trace to antenna. Thermal operation spans −40 °C to +105 °C, and ESD robustness meets 2 kV HBM across all I/O pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency range | 2400–2500 MHz - Covers full 2.4 GHz ISM band for Bluetooth 5/Zigbee® operation |
| Insertion loss | 0.9–1.1 dB typ - Minimizes RF path loss between MCU and antenna without active gain |
| Input return loss | 14–22 dB typ - Ensures >96% power transfer from STM32WB RF output (62 Ω matched) |
| Output return loss | 16–24 dB typ - Maintains stable 50 Ω antenna interface with minimal VSWR |
| Harmonic rejection @ 2f₀ | 38–40 dB - Meets ETSI/EN 300 328 spectral mask for 2nd harmonic suppression |
| Package thickness | 375–425 µm - Enables ultra-low-profile placement under metal shields or in thin wearable modules |
| ESD rating (HBM) | 2000 V - Protects RF pins during handling and board assembly without external TVS |
Pinout & Package
Bumpless CSP (Chip-Scale Package) with glass substrate and copper bumps; footprint compatible with standard LGA land patterns. Dimensions: 1.0 mm × 1.6 mm (X × Y), thickness ≤425 µm. Coated construction per ECOPACK2 environmental standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN | RF input | Connects directly to STM32WB RF output pin; designed for 62 Ω characteristic impedance trace |
| OUT | RF output | Drives antenna port; internally matched to 50 Ω; requires 50 Ω transmission line routing |
| GND1–GND4 | Ground terminals | Four dedicated ground pads ensure low-inductance RF return path and minimize ground loop radiation |
Key Features
| Feature | Design Value |
|---|---|
| Integrated impedance matching | 62 Ω → 50 Ω transformation eliminates discrete matching components and layout tuning effort |
| Harmonics filtering | ≥38 dB rejection at 2f₀ and ≥43 dB at 3f₀ ensures regulatory compliance without added filters |
| Ultra-thin profile | ≤450 µm total thickness enables use in wearables, hearing aids, and slim sensor nodes |
| IPD-on-glass technology | Low-loss dielectric substrate maximizes Q-factor and minimizes insertion loss vs. silicon-based passives |
| ECOPACK2 compliance | Halogen-free, RoHS-compliant materials and processes meet global environmental directives |
Applications
| Bluetooth 5 LE Node | Zigbee® Smart Home Sensor |
|---|---|
Use Scenario: Compact battery-powered BLE beacon with STM32WB55 and PCB trace antenna. IC Role / Device Role / Timing Role: RF front-end filter providing harmonic suppression and impedance matching between MCU and antenna. Use Value: Eliminates 3–5 discrete matching components, reduces RF layout area by >60%, and passes FCC Part 15.247 conducted emission tests without redesign. | Use Scenario: Low-power occupancy sensor using STM32WB30 and chip antenna. IC Role / Device Role / Timing Role: Integrated low-pass filter ensuring clean 2.4 GHz transmit spectrum and stable antenna coupling. Use Value: Achieves >10 dB margin on EN 300 328 2nd-harmonic limit while maintaining 1.1 dB insertion loss for extended battery life. |
| IEEE 802.15.4 Thread Router | OpenThread Wearable Module |
Use Scenario: Multi-protocol edge router supporting OpenThread and BLE on STM32WB50. IC Role / Device Role / Timing Role: Harmonic-rejecting RF filter shared across concurrent 2.4 GHz protocols to maintain spectral purity. Use Value: Prevents intermodulation distortion between simultaneous BLE advertising and Thread data transmission, verified via conducted spurious emission testing. | Use Scenario: Sub-gram medical wearable with flexible PCB and shielded enclosure. IC Role / Device Role / Timing Role: Ultra-thin RF filter enabling direct integration beneath metal shielding without height penalty. Use Value: Maintains 22 dB input return loss and 45 dB 3f₀ rejection at 425 µm total thickness-critical for EMI containment in Class II medical devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF front-end filtering applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QPFM1201 | 0.8 dB IL, but requires external 62 Ω matching; no integrated matching network | Higher BOM count and layout sensitivity; suited for custom-tuned RF paths | Select when optimizing for lowest possible insertion loss and accepting design complexity |
| Skyworks SKY16604-362LF | 1.3 dB IL, 5-pin SMT package (1.6 × 1.6 mm), no GND4 terminal | Larger footprint and reduced harmonic rejection (32 dB @ 2f₀); less suitable for dense STM32WB layouts | Select only if existing PCB land pattern matches SKY16604 and harmonic margin is not critical |
Compared with QPFM1201 and SKY16604-362LF, MLPF-WB-01E3 uniquely integrates 62 Ω-to-50 Ω matching and achieves superior harmonic rejection (>40 dB at 2f₀) in a smaller, thinner package-reducing RF validation time and improving first-pass success in STM32WB designs.
Availability
MLPF-WB-01E3 is available at Aetrix Electronics and suitable for Bluetooth 5 LE beacons, Zigbee® smart home sensors, and OpenThread wearable modules requiring stable component supply, consistent RF performance, and ECOPACK2-compliant sourcing.
Supply support for MLPF-WB-01E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, power management, and MEMS sensors for industrial, automotive, and consumer markets.
This part belongs to ST's RF Front-End Passive portfolio, engineered specifically to simplify and miniaturize wireless connectivity solutions for STM32WB-series dual-core Arm Cortex-M4/M0+ SoCs.
FAQ
What is the recommended PCB trace impedance between STM32WB and MLPF-WB-01E3?
The input trace from STM32WB RF output to MLPF-WB-01E3 IN pad must be designed for 62 Ω characteristic impedance, as specified in DS13532 Section 3.1. This value is fixed by the internal matching network and deviating significantly causes measurable return loss degradation and potential radiated emissions failure.
Can MLPF-WB-01E3 be used with non-ST MCUs operating in the 2.4 GHz band?
No-its internal matching network is tailored exclusively to the 62 Ω single-ended RF output impedance of STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx, and STM32WB30Cx. Using it with other MCUs (e.g., Nordic nRF52/nRF53 or TI CC2652) results in poor return loss and unpredictable harmonic suppression due to impedance mismatch.
Is reflow soldering supported, and what stencil thickness is required?
Yes-reflow soldering is fully supported. A 100 µm stencil thickness is mandatory per DS13532 Section 3.3, with openings aligned precisely to footprint dimensions. Thicker stencils cause excessive solder volume, risking bridging between GND pads or solder balling on the glass substrate surface.
Does MLPF-WB-01E3 require external DC blocking capacitors?
No-this is a fully passive, DC-coupled RF filter. The IN and OUT ports are internally DC-connected; no series capacitors are needed or recommended. Adding external DC blocks introduces parasitic inductance that degrades return loss above 2.4 GHz and violates the validated RF path design.
MLPF-WB-01E3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 6-SMD, No Lead
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Frequency:
- 2.4GHz
- Bandwidth:
- -
- Filter Type:
- Low Pass
- Ripple:
- -
- Insertion Loss:
- 0.9dB
- Mounting Type:
- Surface Mount
- Size / Dimension:
- -
- Height (Max):
- -
MLPF-WB-01E3 FAQ
1.How can I place an order for MLPF-WB-01E3 through Aetrix?
Please submit a Request for Quotation (RFQ) for MLPF-WB-01E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MLPF-WB-01E3 reliable?
The price and inventory of MLPF-WB-01E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MLPF-WB-01E3 is usually 5 days.
3.What payment methods are accepted for MLPF-WB-01E3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MLPF-WB-01E3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MLPF-WB-01E3?
MLPF-WB-01E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MLPF-WB-01E3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MLPF-WB-01E3?
For technical support, including MLPF-WB-01E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MLPF-WB-01E3 requirements.
6.How does Aetrix verify that MLPF-WB-01E3 is sourced from the original manufacturer or authorized distributors?
All MLPF-WB-01E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MLPF-WB-01E3 meets industry standards.
7.What is the process for return or replacement of MLPF-WB-01E3?
All MLPF-WB-01E3 units undergo pre-shipment inspection (PSI). If there is an issue with MLPF-WB-01E3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MLPF-WB-01E3 part is unused and in its original packaging.
Return procedure for MLPF-WB-01E3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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