STMicroelectronics MLPF-WB-02D3

Overview

MLPF-WB-02D3 from STMicroelectronics is a 2.4 GHz low-pass filter with integrated impedance matching network and harmonic rejection filter, designed specifically for RF front-end interfacing between STM32WB5x and STM32WB1x MCUs (WLCSP/UFBGA) and 50 Ω antennas. It delivers 1.2 dB typical insertion loss, ≥46 dB harmonic attenuation at 2f₀, and operates across –40 °C to +105 °C in Bluetooth 5 and IEEE 802.15.4 systems.

For engineers reviewing the MLPF-WB-02D3 datasheet, MLPF-WB-02D3 pinout, MLPF-WB-02D3 application, or MLPF-WB-02D3 equivalent, key selection criteria include its 6-bump CSPG package, 50 Ω antenna-side impedance match, deep harmonic suppression up to 5f₀, RF performance validation on 6-layer PCB stack-up, and ECOPACK2 compliance for industrial-grade wireless modules.

Technical Context

This device implements a monolithic IPD (Integrated Passive Device) structure on non-conductive glass substrate, enabling precise impedance transformation from the STM32WBxx RF output (matched to ~61 Ω differential or single-ended equivalent) to 50 Ω antenna interface. Its topology integrates both matching and filtering functions in one passive component without active bias or control lines.

The filter exhibits bandpass-like passband behavior from 2400–2500 MHz with sharp roll-off beyond 2.5 GHz, delivering ≥15 dB input return loss and ≥16 dB output return loss. Harmonic rejection is achieved via cascaded resonant sections targeting 4.8–5.0 GHz (2f₀), 7.2–7.5 GHz (3f₀), and higher-order multiples-critical for meeting ETSI/FCC spurious emission limits in certified BLE/Zigbee designs.

Key Specifications

Pinout & Package

CSPG (Chip Scale Package Glass) 6-bump package with 1.6 mm × 1.0 mm footprint, 0.63 mm nominal height, and solder bumps arranged in 2×3 grid (A1–A3, B1–B3). Compatible with standard flip-chip assembly processes using halide-free, no-clean solder paste and 3-mil stencil.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF front-end filtering and matching applications.

Compared with MLPF-WB-01D3, the MLPF-WB-02D3 provides broader MCU compatibility and superior harmonic suppression; versus Qorvo QPF4559, it offers zero-bias simplicity, minimal footprint, and deterministic RF behavior-ideal for cost- and size-sensitive certified wireless nodes.

Availability

MLPF-WB-02D3 is available at Aetrix Electronics and suitable for Bluetooth 5 LE modules, Zigbee® end devices, and IEEE 802.15.4 sensor hubs requiring stable component supply, full traceability, and lifecycle continuity support.

Supply support for MLPF-WB-02D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, MEMS, and power devices for industrial, automotive, and consumer markets.

The MLPF-WB-02D3 belongs to ST's RF passive portfolio built on proprietary IPD-on-glass technology, developed specifically to simplify RF front-end design for its STM32WB wireless MCU family and accelerate time-to-certification.

FAQ

What is the recommended PCB stack-up for optimal RF performance?

The validated 6-layer stack-up specifies mandatory ground plane on Layer 1 (directly under the device), open Layer 2, and ground reference on Layer 3. Dielectric thicknesses (Dk 3.3–4.3) must be tightly controlled between Layers 1–2 and 2–3 to maintain 61 Ω (MCU-to-filter) and 50 Ω (filter-to-antenna) transmission line impedances. Deviations require EM simulation and land pattern adjustment.

Can MLPF-WB-02D3 be used with non-ST MCUs?

No-its impedance matching network is calibrated exclusively for the RF output characteristics of STM32WB5x and STM32WB1x in WLCSP and UFBGA packages. Using it with other MCUs (e.g., Nordic nRF52/nRF53 or TI CC2652) results in degraded return loss, increased insertion loss, and insufficient harmonic rejection due to impedance mismatch.

Is reflow profile deviation acceptable for this component?

Strict adherence to ST's recommended reflow profile (peak 240–245 °C, 60–90 sec above 217 °C) is required. Exceeding 245 °C risks glass substrate cracking; falling below 217 °C causes incomplete solder joint formation. Air convection must be minimized to prevent component shift during liquidus phase-verified placement accuracy is ±0.05 mm.

Does this part require external DC blocking capacitors?

No-MLPF-WB-02D3 is fully DC-coupled. Its internal IPD structure contains no series capacitors or bias tees; both IN and OUT pins tolerate DC voltage from the MCU RFIO pin and antenna feed point. External DC blocks would disrupt the precisely tuned matching network and degrade RF performance.