STMicroelectronics MLPF-WB-04D3

Overview

MLPF-WB-04D3 from STMicroelectronics is a 2.4 GHz integrated low-pass filter with impedance matching network and harmonic rejection, designed specifically for RF front-end integration with STM32WBA QFN and BGA series MCUs. It delivers 1.2 dB typical insertion loss, 24 dB typical input return loss, 59–66 dB harmonic attenuation at 2f₀, 50 Ω antenna-side impedance, and operates across –40 °C to +105 °C.

For engineers reviewing the MLPF-WB-04D3 datasheet, MLPF-WB-04D3 pinout, MLPF-WB-04D3 application, or MLPF-WB-04D3 equivalent, this component addresses critical RF path optimization in Bluetooth 5, Zigbee®, OpenThread, and IEEE 802.15.4 systems where matched 63 Ω MCU interface and 50 Ω antenna interface must coexist with deep harmonic suppression and minimal board area.

Technical Context

This device implements a monolithic IPD (Integrated Passive Device) structure on non-conductive glass substrate, enabling precise control of parasitic coupling and high-Q filtering performance. Its topology integrates both impedance transformation (63 Ω → 50 Ω) and multi-order harmonic rejection up to 5f₀ (12.5 GHz), with defined RF transmission line requirements: 63 Ω between MCU and filter, 50 Ω between filter and antenna.

The CSPG package uses six solder bumps with strict mechanical tolerances (e.g., A = 0.58–0.68 mm, D = 1.55–1.65 mm), and requires dedicated PCB land pattern design including top-layer ground plane, high via density near the device, and controlled stack-up to maintain target characteristic impedances.

Key Specifications

Pinout & Package

CSPG (Chip Scale Package Glass) package with 6 solder bumps, 1.60 mm × 1.00 mm footprint, and ≤630 µm profile after reflow. Compliant with ECOPACK2 environmental standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF front-end filter applications.

Compared with QPFM2002 and SKY66422-374, MLPF-WB-04D3 uniquely provides monolithic 63 Ω-to-50 Ω matching with <1.2 dB loss and sub-1 mm² footprint-enabling direct STM32WBA integration without layout rework or external components.

Availability

MLPF-WB-04D3 is available at Aetrix Electronics and suitable for Bluetooth 5, Zigbee®, and OpenThread wireless nodes requiring stable component supply, consistent RF performance across production lots, and ECOPACK2-compliant sourcing.

Supply support for MLPF-WB-04D3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, analog ICs, power devices, and sensors for industrial, automotive, and consumer markets.

MLPF-WB-04D3 belongs to ST's RF Front-End IPD portfolio, engineered to simplify wireless MCU integration by replacing discrete matching networks and harmonic filters with monolithic, calibrated solutions optimized for STM32 ultra-low-power wireless families.

FAQ

What is the recommended PCB stack-up for optimal RF performance?

The datasheet specifies a reference stack-up with defined dielectric thickness and constant to achieve 63 Ω (MCU-to-filter) and 50 Ω (filter-to-antenna) microstrip impedances. Physical trace dimensions must be tuned for your actual stack-up; top-layer ground plane and high via density near the device are mandatory for repeatable return loss and harmonic suppression.

Can MLPF-WB-04D3 be used with non-ST MCUs?

It is electrically optimized for STM32WBA series' 63 Ω RF output impedance. Using it with other MCUs requires verifying source impedance match and recalculating return loss; mismatch may degrade insertion loss and harmonic rejection. No characterization data exists for non-ST devices.

Is reflow profile strictly limited to ST's recommended 240–245 °C peak?

Yes-the CSPG package and internal IPD structure require strict adherence to ST's ECOPACK reflow profile (peak 240–245 °C, 60–90 sec above 217 °C). Exceeding 245 °C risks bump delamination; falling below 240 °C may cause insufficient solder wetting and open joints.

Does MLPF-WB-04D3 require external DC blocking capacitors?

No-it is fully DC-coupled. The IN and OUT ports are designed for direct connection to the STM32WBA RF output and antenna feed, respectively, with no series capacitance needed. Adding external DC blocks would disrupt the calibrated impedance match and degrade RF performance.