STMicroelectronics MLPF-WB55-01E3

Overview

MLPF-WB55-01E3 from STMicroelectronics is a 2.4 GHz bumpless CSP low-pass filter with integrated impedance matching network and harmonic rejection filter, designed specifically for RF output coupling between STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx, and STM32WB30Cx MCUs and external antennas. It delivers 1.1 dB typical insertion loss, 22 dB typical input return loss, and ≥38 dB attenuation at 2f₀, enabling Bluetooth 5 and IEEE 802.15.4 compliant wireless subsystems.

For engineers reviewing the MLPF-WB55-01E3 datasheet, MLPF-WB55-01E3 pinout, MLPF-WB55-01E3 application, or MLPF-WB55-01E3 equivalent, key selection criteria include its 50 Ω antenna-side impedance, 62 Ω MCU-side matching, ≤450 µm thickness, ECOPACK2 compliance, and validated RF performance across 2400–2500 MHz.

Technical Context

This device implements a monolithic IPD (Integrated Passive Device) structure on non-conductive glass substrate, enabling precise control of parasitic inductance/capacitance for optimized RF matching. Its topology integrates a 5th-order low-pass response with deep harmonic suppression-specifically ≥38 dB at 2f₀, ≥43 dB at 3f₀, and ≥35 dB at 5f₀-while maintaining broadband passband flatness.

The matching network is pre-tuned to transform the STM32WB series' internal RF output (62 Ω single-ended) to standard 50 Ω antenna interface, eliminating discrete matching components. PCB layout requires strict adherence to 62 Ω trace from MCU to IN and 50 Ω trace from OUT to antenna, as defined in DS12804 Rev 3 Section 3.1.

Key Specifications

Pinout & Package

Bumpless CSP (Chip-Scale Package) with 6 solderable pads on glass substrate, footprint compatible with STM32WB reference designs. Total package size: 1000 × 1600 µm (X × Y), substrate thickness 375–425 µm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF front-end filter applications.

Compared with MLPF-WB55-01E3, the -02E3 variant sacrifices cross-family compatibility for marginal harmonic improvement, while QM26001 increases design effort and test variability due to external matching dependency.

Availability

MLPF-WB55-01E3 is available at Aetrix Electronics and suitable for Bluetooth 5 LE sensor nodes, Zigbee® smart home hubs, and IEEE 802.15.4 industrial sensors requiring stable component supply, consistent RF performance, and ECOPACK2-compliant sourcing.

Supply support for MLPF-WB55-01E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, delivering microcontrollers, analog ICs, MEMS, and power devices for industrial, automotive, and consumer markets.

This part belongs to ST's RF Front-End IPD portfolio, engineered to simplify wireless connectivity design by integrating matching, filtering, and ESD protection into miniature glass-based packages for STM32 Wireless MCUs.

FAQ

What is the recommended PCB trace impedance between STM32WB and MLPF-WB55-01E3?

The trace from STM32WB RFOUT to MLPF-WB55-01E3 IN must be designed for 62 Ω characteristic impedance, as specified in DS12804 Section 3.1. This matches the MCU's internal output impedance and ensures optimal power transfer and return loss. Deviation beyond ±5 Ω degrades S11 performance and increases harmonic content.

Can MLPF-WB55-01E3 be used with non-ST MCUs operating at 2.4 GHz?

No-its matching network is laser-trimmed and validated exclusively for STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx, and STM32WB30Cx RF outputs. Using it with other 2.4 GHz transceivers (e.g., nRF52840, CC2652R) results in poor return loss (<10 dB) and unpredictable harmonic suppression due to impedance mismatch.

Is reflow profile adjustment required for MLPF-WB55-01E3's glass substrate?

No special reflow profile is needed-the bumpless CSP package is qualified for standard lead-free JEDEC J-STD-020 Level 3 conditions. Peak temperature must not exceed 260°C, and time above 217°C should be 60–150 seconds. The glass substrate exhibits no warpage or delamination under these conditions per DS12804 Section 3.4.

Does MLPF-WB55-01E3 include ESD protection on RF ports?

Yes-it features integrated 2000 V HBM ESD protection on both IN and OUT pins, verified per JESD22-A114-C. This eliminates need for external TVS diodes in most layouts, provided PCB layout follows ST's land pattern guidelines (e.g., symmetric pad placement, closed vias) to preserve protection integrity.