Diodes Incorporated MMBZ5231BTS-7-F

Overview

MMBZ5231BTS-7-F from Diodes Incorporated is a triple-surface-mount Zener diode array in SOT363 package, providing three isolated 5.1 V ±5% Zener references with 17 Ω dynamic impedance at 20 mA, 5 µA reverse leakage at 2.0 V, and 200 mW power dissipation. It serves as precision voltage clamp and reference in low-power analog monitoring circuits for automotive body control modules.

For engineers reviewing the MMBZ5231BTS-7-F datasheet, MMBZ5231BTS-7-F pinout, MMBZ5231BTS-7-F application, or MMBZ5231BTS-7-F equivalent, key selection criteria include zener voltage tolerance (±5%), low leakage at VR = 2.0 V (≤5 µA), thermal resistance (625 °C/W), and AEC-Q101 qualification for automotive-grade reliability.

Technical Context

This device integrates three electrically isolated Zener junctions in a single ultra-small SOT363 package, enabling compact multi-rail voltage regulation without cross-coupling. Each diode operates independently with identical electrical specs: nominal 5.1 V breakdown, 20 mA test current, and 17 Ω zener impedance at I_ZT.

Designed for high-reliability automotive applications, it meets AEC-Q101 stress testing requirements and features halogen/antimony-free "Green" construction with matte tin lead finish. Its thermal derating curve shows linear power reduction above +25°C ambient, reaching zero dissipation at +150°C.

Key Specifications

Pinout & Package

Package: SOT363 - six-terminal, ultra-small outline transistor package with 0.65 mm lead pitch, molded plastic case rated UL 94V-0, and moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode array applications.

Compared with MMBZ5231BS-7-F and BZX84-C5V1,315, the MMBZ5231BTS-7-F uniquely delivers three matched, isolated 5.1 V references in one AEC-Q101-qualified SOT363 package - reducing component count by 67%, minimizing inter-trace coupling, and ensuring consistent thermal drift across rails.

Availability

MMBZ5231BTS-7-F is available at Aetrix Electronics and suitable for automotive body control modules, industrial sensor signal conditioning, USB-C power delivery monitoring, and smart meter voltage supervision requiring stable component supply and long-term lifecycle support.

Supply support for MMBZ5231BTS-7-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing facilities in China, Taiwan, and the U.S.

This part belongs to the MMBZ52xxBTS series of triple Zener arrays, designed specifically for space-constrained, high-reliability automotive and industrial applications requiring multiple precision voltage references in minimal footprint.

FAQ

What is the maximum reverse leakage current for MMBZ5231BTS-7-F at 2.0 V?

The maximum reverse leakage current is 5.0 µA at V_R = 2.0 V, measured per the datasheet's Note 7 short-pulse test method. This value is guaranteed across the full operating temperature range (−65°C to +150°C) and ensures minimal standby current in always-on monitoring circuits.

Is MMBZ5231BTS-7-F suitable for reflow soldering per JEDEC J-STD-020?

Yes - it is rated Moisture Sensitivity Level 1 per J-STD-020D, meaning it can be exposed indefinitely to factory ambient conditions and withstand standard Pb-free reflow profiles (peak 260°C) without baking. The matte tin finish ensures reliable solder wetting and intermetallic formation.

How does the SOT363 package affect thermal performance compared to SOT23?

The SOT363 has higher thermal resistance (625 °C/W vs. ~350 °C/W for typical SOT23) due to smaller copper area and shared thermal path among three die. To maintain 200 mW rating, use the recommended pad layout from AP02001 with 1.0 mm² thermal vias under the center pad and avoid enclosing the device in thermally isolated zones.

Can MMBZ5231BTS-7-F replace single Zeners in existing designs without layout changes?

No - its SOT363 footprint (2.2 × 1.3 mm, 0.65 mm pitch) is incompatible with SOT23 (2.9 × 1.3 mm, 1.9 mm pitch). Direct replacement requires PCB redesign. However, using all three Zeners simultaneously reduces total component count and improves matching versus three discrete SOT23 devices.