Diodes Incorporated MMBZ5238BS-7-F

Overview

MMBZ5238BS-7-F from Diodes Incorporated is a dual isolated 200 mW surface-mount Zener diode in SOT-363 package, with nominal zener voltage 8.7 V (min 8.27 V, max 9.14 V) at 20 mA test current, 8 Ω dynamic impedance at 20 mA, and 600 µA reverse leakage at 6.5 V. It serves as precision voltage reference and overvoltage clamp in low-power analog signal conditioning circuits.

For engineers reviewing the MMBZ5238BS-7-F datasheet, MMBZ5238BS-7-F pinout, MMBZ5238BS-7-F application, or MMBZ5238BS-7-F equivalent, key selection criteria include zener voltage tolerance, thermal resistance (625 °C/W), dual-diode isolation integrity, and SOT-363 footprint compatibility with high-density PCB layouts.

Technical Context

This device integrates two electrically isolated Zener diodes in a single ultra-small SOT-363 package, enabling compact dual-rail voltage regulation or bidirectional transient suppression without cross-coupling. Its planar die construction ensures stable breakdown characteristics across -65 °C to +150 °C operating range.

Rated for 200 mW total power dissipation on FR4 board with recommended pad layout, it exhibits 625 °C/W junction-to-ambient thermal resistance and maintains ≤600 µA reverse leakage at VR = 6.5 V - critical for low-quiescent-current bias networks.

Key Specifications

Pinout & Package

SOT-363 is a 6-pin ultra-small surface-mount plastic package with dual isolated anode/cathode pairs and two no-connect terminals. Molded plastic case meets UL 94V-0 flammability rating and J-STD-020D Level 1 moisture sensitivity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-Zener voltage reference applications.

Compared with BZX84-C8V2LT1G and MMBZ5237BS-7-F, MMBZ5238BS-7-F uniquely delivers 8.7 V nominal regulation with dual-isolation in SOT-363 - essential for differential sensing and multi-rail clamping where cross-talk and footprint constraints prohibit discrete solutions.

Availability

MMBZ5238BS-7-F is available at Aetrix Electronics and suitable for industrial sensor signal conditioning, USB port ESD protection, and low-power IoT node biasing requiring stable component supply across extended temperature ranges and high-volume production cycles.

Supply support for MMBZ5238BS-7-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers and manufacturing facilities across Asia and the Americas.

This part belongs to the MMBZ52xxBS series of dual Zener diodes designed specifically for space-constrained, low-power voltage reference and transient suppression applications in consumer, industrial, and automotive electronics.

FAQ

What is the maximum reverse voltage this device can withstand before breakdown?

The MMBZ5238BS-7-F has a nominal zener voltage of 8.7 V at 20 mA test current, with guaranteed breakdown occurring between 8.27 V and 9.14 V. Below 8.27 V, reverse leakage remains ≤600 µA at 6.5 V - confirming stable non-conduction up to that threshold.

Can both Zener diodes operate simultaneously without interference?

Yes - the SOT-363 package contains two fully isolated diode dies with separate anode/cathode terminals (A1/C1 and A2/C2). No shared substrate or parasitic coupling exists, enabling simultaneous, independent operation in dual-rail or differential configurations.

Is this device suitable for use in automotive applications?

Yes - it operates across −65 °C to +150 °C, meets RoHS and green compound requirements, and supports ISO 7637-2 pulse immunity when used with appropriate series impedance. Its 200 mW rating and 625 °C/W thermal resistance require thermal-aware layout in under-hood environments.

How does the SOT-363 package affect PCB layout and thermal performance?

The SOT-363's 2.2 mm × 1.35 mm footprint enables high-density routing, but its 625 °C/W junction-to-ambient thermal resistance demands optimized copper pour and via placement. Recommended pad layout per Diodes Inc. AP02001 reduces thermal impedance by ≥30% versus generic land patterns.