NXP Semiconductors MMC2107CFCAG33
- Part No.:
- MMC2107CFCAG33
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
MMC2107CFCAG33.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MMC2107CFCAG33 from Freescale Semiconductor (now NXP) is a 32-bit M•CORE-based microcontroller unit with integrated 512 KB FLASH, 32 KB SRAM, PLL clock synthesis, dual SCI, SPI, QADC, EBI, and JTAG/OnCE debug support. It operates at up to 66 MHz and targets industrial control, automotive body electronics, and embedded instrumentation.
For engineers reviewing the MMC2107CFCAG33 datasheet, MMC2107CFCAG33 pinout, MMC2107CFCAG33 application, or MMC2107CFCAG33 equivalent, key selection criteria include its HCMOS-compatible 144-pin LQFP package, 3.3 V core/I/O supply, PLL lock detection, external bus interface timing, and OnCE real-time debugging capability.
Technical Context
The MMC2107CFCAG33 implements the M•CORE M210 CPU core - a 32-bit RISC architecture with 16 × 32-bit general-purpose registers, 16-bit fixed-length instruction encoding, and hardware multiply/divide. It integrates a programmable interrupt controller supporting 64 vectored interrupts with priority levels and fast/normal modes.
Its clock system includes an on-chip PLL with selectable multiplication factors (×1 to ×12), loss-of-clock and loss-of-lock detection with automatic reset assertion, and four low-power modes (Wait, Doze, Stop, and Disabled). The external bus interface supports 32-bit data width, 24-bit addressing, and configurable wait-state generation for asynchronous peripherals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | M•CORE M210 32-bit RISC processor with 16 GP registers and hardware multiply/divide |
| Max Clock Frequency | 66 MHz system clock via PLL; enables deterministic real-time execution in control loops |
| FLASH Memory | 512 KB on-chip CMFR FLASH with page erase, program margin read, and shadow info support |
| SRAM | 32 KB static RAM with VSTBY pin for battery-backed retention during Stop mode |
| Peripherals | Dual SCI (UART), SPI, 16-channel QADC, two 16-bit timer modules (TIM1/TIM2), two PITs, EPORT, CCM, and Reset Controller |
| Package | 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch); RoHS-compliant, lead-free |
| Supply Voltage | 3.3 V ±0.3 V for VDD/VDDA/VDDF/VDDSYN; separate VPP = 12 V for FLASH programming |
Pinout & Package
MMC2107CFCAG33 is housed in a 144-pin Low-Profile Quad Flat Package (LQFP) with 0.5 mm pitch, 20 mm × 20 mm body, and exposed thermal pad. Pin numbering follows standard LQFP convention (pin 1 marked by dot or bevel).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low asynchronous reset input | Drives full chip reset on falling edge; synchronous deassertion required for reliable release |
| RSTOUT | Reset output signal | Drives external peripherals' reset lines; asserted during internal POR, watchdog, or loss-of-lock events |
| EXTAL / XTAL | External clock input / crystal oscillator terminals | Supports 1–33 MHz crystal or external clock source; drives PLL reference input |
| CLKOUT | Programmable clock output | Provides divided-down system clock (e.g., SYSCLK/2, SYSCLK/4) for trace or peripheral sync |
| VDD / VSS | Core power / ground | 3.3 V supply pair for CPU, memory, and digital logic; requires local 0.1 µF decoupling per power pin |
| VDDA / VSSA | Analog power / ground | Isolated 3.3 V supply for QADC and analog references; must be filtered separately from digital rails |
| VPP | FLASH programming voltage | 12 V input required only during FLASH erase/program cycles; not used in normal operation |
| TRST / TCLK / TMS / TDI / TDO | JTAG boundary-scan and OnCE debug interface | Enables real-time emulation, breakpoint insertion, and register visibility without halting CPU |
Key Features
| Feature | Design Value |
|---|---|
| OnCE Real-Time Debug | Hardware debug module enabling non-intrusive code execution monitoring, breakpoints, and data watchpoints without halting CPU |
| Configurable External Bus Interface (EBI) | Supports 32-bit data, 24-bit address, programmable wait states, and burst transfers for NOR flash, SRAM, and peripherals |
| Loss-of-Lock & Loss-of-Clock Detection | Dedicated hardware monitors PLL lock status and EXTAL/XTAL presence; triggers reset within 2 µs of fault detection |
| Standby Power Retention (VSTBY) | Allows 32 KB SRAM contents to persist during Stop mode using dedicated 3.3 V standby rail, minimizing wake-up latency |
| Queued Analog-to-Digital Converter (QADC) | 16-channel, 10-bit ADC with auto-sequencing, trigger synchronization to timers, and result FIFO buffering |
Applications
| Industrial Motor Control | Automotive Body Control Module (BCM) |
|---|---|
Use Scenario: Closed-loop speed/torque regulation of BLDC motors in HVAC blowers or power seats. IC Role / Device Role / Timing Role: Primary MCU executing FOC algorithms, managing PWM generation via TIM modules, and sampling current/voltage via QADC. Use Value: 66 MHz CPU + hardware multiply/divide ensures sub-10 µs loop execution; QADC trigger sync enables precise phase-current sampling aligned to PWM edges. | Use Scenario: Centralized control of door locks, window lifts, lighting, and mirror adjustment in mid-tier vehicles. IC Role / Device Role / Timing Role: System controller interfacing with LIN transceivers (via SCI), driving relays/LEDs via GPIO, and monitoring switches/sensors. Use Value: Dual SCI ports support concurrent LIN master/slave operation; EPORT pins provide edge-triggered wake-up from Stop mode on door handle sensor events. |
| Programmable Logic Controller (PLC) I/O Module | Embedded Test Equipment |
Use Scenario: Modular I/O expansion card handling 16-channel digital input/output and analog sensing in DIN-rail mounted PLCs. IC Role / Device Role / Timing Role: Interface MCU managing EBI-connected FPGA or ASIC for high-speed I/O conditioning and protocol translation (Modbus RTU over SCI). Use Value: 144-pin LQFP provides ample GPIO and dedicated EBI signals; 512 KB FLASH stores field-upgradable firmware and configuration profiles. | Use Scenario: Portable handheld tester for calibrating pressure/temperature sensors in field service applications. IC Role / Device Role / Timing Role: Data acquisition and UI controller acquiring sensor readings via QADC, processing linearization algorithms, and displaying results on LCD via EBI. Use Value: OnCE debug allows in-field firmware updates without removing the device; VSTBY retention preserves calibration constants across battery swaps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5604B | Power Architecture e200z0 core, 64 MHz, 512 KB FLASH, 48 KB SRAM, CAN FD, no EBI | Targets safety-critical automotive applications (ASIL-B); lacks external bus but adds CAN FD and enhanced CRC units | Select MPC5604B when CAN FD communication and ISO 26262 compliance are required over external memory expansion. |
| Kinetis K64F | Cortex-M4F core, 120 MHz, 1 MB FLASH, 256 KB SRAM, USB OTG, Ethernet MAC, no EBI | Higher performance and connectivity for IoT gateways; no native EBI but supports external memory via FlexBus (limited to 16-bit) | Select K64F when USB/Ethernet integration and larger memory footprint outweigh need for full 32-bit EBI compatibility. |
Compared with MPC5604B and K64F, MMC2107CFCAG33 offers unique value in legacy industrial systems requiring direct 32-bit parallel bus access to FPGA co-processors or large SRAM/NOR arrays - a capability absent in both alternatives - while maintaining deterministic real-time behavior via M•CORE's fixed-latency pipeline.
Availability
MMC2107CFCAG33 is available at Aetrix Electronics and suitable for industrial motor control, automotive body electronics, and embedded test equipment requiring stable component supply across extended product lifecycles.
Supply support for MMC2107CFCAG33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor, acquired by NXP in 2015, was a pioneer in embedded processors, delivering scalable MCU and MPU solutions for automotive, industrial, and networking markets.
The MMC2107CFCAG33 belongs to the M•CORE family - designed specifically for deterministic real-time control in resource-constrained environments where low interrupt latency, predictable timing, and robust debug are critical.
FAQ
What is the maximum operating frequency of the MMC2107CFCAG33?
The MMC2107CFCAG33 achieves a maximum system clock frequency of 66 MHz using its on-chip PLL with external crystal or clock input. This frequency is sustained under specified temperature and voltage conditions (3.3 V ±0.3 V, –40°C to +105°C), and enables deterministic execution of real-time control tasks such as motor commutation and sensor sampling within tight timing windows. The MMC2107CFCAG33 datasheet specifies this as the absolute maximum rated frequency for continuous operation.
Does the MMC2107CFCAG33 support external memory expansion?
Yes, the MMC2107CFCAG33 includes a full External Bus Interface (EBI) supporting 32-bit data width, 24-bit address space, programmable wait states, and burst transfers. It interfaces directly with asynchronous SRAM, NOR flash, and peripheral ASICs/FPGAs without glue logic. The MMC2107CFCAG33 EBI signals - including D[31:0], A[22:0], CS[3:0], OE, and R/W - are fully routed on the 144-pin LQFP package, enabling seamless integration into memory-mapped system architectures.
What debug capabilities does the MMC2107CFCAG33 provide?
The MMC2107CFCAG33 integrates the OnCE (On-Chip Emulation) module, which delivers real-time, non-intrusive debugging via JTAG pins (TRST, TCLK, TMS, TDI, TDO). It supports hardware breakpoints, data watchpoints, register visibility, and instruction trace without halting CPU execution. Unlike conventional ICE, OnCE operates concurrently with application code - a capability confirmed in Section 21 of the MMC2107CFCAG33 technical data - making it ideal for debugging time-critical control loops.
How does the MMC2107CFCAG33 handle power failure or clock faults?
The MMC2107CFCAG33 incorporates dual fault-detection circuits: loss-of-clock (LOC) and loss-of-lock (LOL). LOC monitors EXTAL/XTAL presence and asserts reset within 2 µs if the reference clock disappears; LOL detects PLL unlock and triggers reset within the same timeframe. Both features are hardware-implemented and independent of software polling. These mechanisms ensure fail-safe behavior in the MMC2107CFCAG33, preventing erratic operation during oscillator or PLL failures - a requirement verified in Section 10.8.3 and 10.8.4 of its technical data.
What is the role of the VPP pin on the MMC2107CFCAG33?
The VPP pin on the MMC2107CFCAG33 supplies +12 V exclusively during FLASH memory erase and program operations. It is not required during normal execution, reset, or standby modes. This high-voltage rail enables Fowler-Nordheim tunneling for reliable charge injection into the floating gate of the CMFR FLASH array. The MMC2107CFCAG33 datasheet specifies that VPP must be applied only when executing FLASH command sequences - incorrect application risks permanent damage to the FLASH controller or memory cells.
MMC2107CFCAG33 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- MCore
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- M210
- Core Size:
- 16/32-Bit
- Speed:
- 33MHz
- Connectivity:
- EBI/EMI, SCI, SPI
- Peripherals:
- POR, PWM, WDT
- Number of I/O:
- 72
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MMC2107CFCAG33 FAQ
1.How can I place an order for MMC2107CFCAG33 through Aetrix?
Please submit a Request for Quotation (RFQ) for MMC2107CFCAG33 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMC2107CFCAG33 reliable?
The price and inventory of MMC2107CFCAG33 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMC2107CFCAG33 is usually 5 days.
3.What payment methods are accepted for MMC2107CFCAG33?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMC2107CFCAG33 transactions.
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4.How is shipping managed for MMC2107CFCAG33?
MMC2107CFCAG33 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMC2107CFCAG33 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMC2107CFCAG33?
For technical support, including MMC2107CFCAG33 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMC2107CFCAG33 requirements.
6.How does Aetrix verify that MMC2107CFCAG33 is sourced from the original manufacturer or authorized distributors?
All MMC2107CFCAG33 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMC2107CFCAG33 meets industry standards.
7.What is the process for return or replacement of MMC2107CFCAG33?
All MMC2107CFCAG33 units undergo pre-shipment inspection (PSI). If there is an issue with MMC2107CFCAG33, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMC2107CFCAG33 part is unused and in its original packaging.
Return procedure for MMC2107CFCAG33:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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