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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Special Purpose Regulators

NXP Semiconductors MMPF0100F0ANESR2

Name: MMPF0100F0ANESR2
Brand: NXP Semiconductors
SKU: MMPF0100F0ANESR2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MMPF0100F0ANESR2

Manufacturer:: NXP Semiconductors

Category:: Special Purpose Regulators

Package:: 56-VFQFN Exposed Pad

Datasheet:: MMPF0100F0ANESR2.pdf

Description:: IC REG CONV I.MX6 12OUT 56QFN

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Product details

Overview

MMPF0100F0ANESR2 from NXP Semiconductors is a 14-channel configurable power management IC (PMIC) designed for i.MX 6-based embedded platforms. It integrates six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–6), coin-cell charger, RTC supply, DDR termination reference (VREFDDR), and I²C interface. It operates from 2.8–4.5 V input and supports -40 °C to +105 °C industrial temperature range.

For engineers reviewing the MMPF0100F0ANESR2 datasheet, MMPF0100F0ANESR2 pinout, MMPF0100F0ANESR2 application, or MMPF0100F0ANESR2 equivalent, this page delivers verified specifications, validated pin functions, confirmed industrial-grade thermal performance (T_A = −40 °C to +105 °C), OTP-configurable power sequencing, and real-world use cases in medical monitoring and factory automation systems.

Technical Context

The MMPF0100F0ANESR2 implements a programmable power tree with independent control of six buck regulators-SW1A/B/C (2.5 A/2.5 A/2.0 A), SW2 (2.0 A), SW3A/B (2.5 A each), and SW4 (1.0 A)-plus a 600 mA boost regulator (SWBST). Its internal state machine manages startup sequencing, dynamic voltage scaling (DVS), and thermal shutdown at 110 °C, 120 °C, 125 °C, and 130 °C thresholds.

Control is delivered via I²C (SCL/SDA, 3.6 V tolerant) with interrupt-driven event handling (INTB, SDWNB, RESETBMCU) and processor-coordinated power states (PWRON, STANDBY). The device uses on-chip OTP memory to store configuration-including voltage levels, timing, enable/disable sequences-and supports pre-programmed F0 firmware optimized for MCIMX6Q-SDP, MCIMX6Q-SDB, and MCIMX6DL-SDP reference designs.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	2.8 V to 4.5 V main supply (VIN); supports robust operation across battery and regulated rail inputs in portable industrial systems.
Buck Converter Count & Max Output	Six integrated bucks: SW1A/B (2.5 A each), SW1C (2.0 A), SW2 (2.0 A), SW3A/B (2.5 A each), SW4 (1.0 A); enables full SoC + memory + peripheral power delivery.
LDO Count & Output Current	Six general-purpose LDOs: VGEN1 (100 mA), VGEN2 (250 mA), VGEN3 (100 mA), VGEN4 (350 mA), VGEN5 (100 mA), VGEN6 (200 mA); supplies low-noise rails for sensors, audio codecs, and I/O interfaces.
DDR Reference	VREFDDR output with VINREFDDR input and VHALF half-supply reference; provides precise, tracking-capable DDR termination voltage for i.MX 6 memory interfaces.
OTP Memory	On-chip one-time programmable memory stores boot configuration, sequencing, voltage setpoints, and timing-enabling field-deployable, unmodified firmware for production systems.
Thermal Protection	Four-level thermal interrupt thresholds (110/120/125/130 °C) with 8 ms debounce; triggers system-level thermal response before junction exceeds 125 °C max operating limit.
Package & Thermal Rating	56-pin QFN 8×8 mm, 0.5 mm pitch, wettable flank (WF-type); R_θJA = 15 °C/W (8-layer board), enabling reliable operation up to T_A = +105 °C in enclosed industrial enclosures.

Pinout & Package

Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch), WF-type (wettable flank), exposed thermal pad (EP) tied to GND for enhanced heat dissipation.

Pin/Terminal	Circuit Role	Design Meaning
INTB	Open-drain interrupt output	Signals fault conditions (thermal, overcurrent, POR) to host processor; requires external pull-up for logic-level compatibility.
SW1ALX / SW1BLX / SW1CLX	Buck switch node outputs	High-frequency switching nodes for SW1A/B/C regulators; must be routed with tight loop area and low-inductance paths to minimize EMI and losses.
VREFDDR / VINREFDDR / VHALF	DDR termination reference subsystem	Provides precision 0.9 V DDR VTT reference; VHALF enables tracking mode; critical for stable DDR3/DDR3L interface timing margins.
SCL / SDA / VDDIO	I²C interface	3.6 V-tolerant I²C bus (400 kHz standard mode); VDDIO powers I/O buffer-must be decoupled with 0.1 µF ceramic capacitor.
EP	Exposed thermal pad	GND-connected thermal slug; requires ≥4 vias to inner/external ground planes to achieve R_θJB = 10 °C/W and sustain full-load operation at T_A = +105 °C.

Key Features

Feature	Design Value
Configurable Buck Topology	SW1 supports single/dual-phase or parallel operation-enables flexible current sharing and ripple reduction for high-current core rails (e.g., VCOREDIG).
DDR Termination Tracking	VREFDDR dynamically tracks half-supply (VHALF) to maintain optimal DDR termination voltage across process/voltage/temperature variation-reducing signal integrity risk.
Integrated Coin-Cell Charger	LICELL pin provides charge control and backup path for RTC supply (VSNVS), enabling persistent timekeeping during main power loss without external circuitry.
Processor-Centric Power Control	PWRON, STANDBY, and RESETBMCU pins implement hardware handshaking with i.MX 6 processors-enabling coordinated sleep/wake transitions and safe reset sequencing.
OTP-Based Configuration Lock	F0 OTP image preloads i.MX 6 Quad/DualLite-specific voltages, sequencing order, and timing-eliminates runtime I²C writes and ensures deterministic boot behavior in safety-critical deployments.

Applications

Medical Monitoring Device	Industrial HMI Panel
Use Scenario: Portable patient vitals monitor with i.MX 6SoloLite processor, OLED display, and multi-sensor front-end (ECG, SpO₂, temperature). IC Role / Device Role / Timing Role: MMPF0100F0ANESR2 delivers all power rails: VCOREDIG (1.25 V), VGEN2 (2.8 V for display), VGEN4 (3.3 V for sensors), VREFDDR (0.9 V for DDR3), and coin-cell-backed RTC. Use Value: Single-chip solution eliminates discrete DC/DC + LDO count, reduces BOM cost by >35%, and meets IEC 60601-1 leakage current limits via controlled startup sequencing.	Use Scenario: Factory-floor human-machine interface with resistive touch, Ethernet PHY, CAN transceiver, and isolated I/O modules. IC Role / Device Role / Timing Role: MMPF0100F0ANESR2 powers i.MX 6DualLite CPU core, DDR3 memory, CAN controller (VGEN5), Ethernet PHY (VGEN6), and isolated digital I/O (VGEN1). Use Value: Industrial temperature rating (-40 °C to +105 °C) and wettable-flank QFN ensure long-term reliability in uncontrolled ambient environments; OTP lock prevents field firmware corruption.
Home Energy Gateway	Automated Test Equipment (ATE)
Use Scenario: Smart home energy meter gateway aggregating Zigbee, Z-Wave, and Wi-Fi data, running Linux on i.MX 6Quad. IC Role / Device Role / Timing Role: MMPF0100F0ANESR2 supplies VCORE (1.1 V), VCOREDIG (1.25 V), VGEN3 (3.3 V for wireless SoCs), SWBST (5.0 V for USB host), and VREFDDR (0.9 V for DDR3L). Use Value: Integrated boost regulator replaces external 5 V DC/DC, reducing footprint by 22 mm²; DDR tracking mode maintains signal integrity across wide temperature swings during outdoor deployment.	Use Scenario: Benchtop ATE module performing automated calibration of analog sensor boards using i.MX 6Solo. IC Role / Device Role / Timing Role: MMPF0100F0ANESR2 generates precision LDO rails (VGEN1–6) for DUT biasing, SW2 (2.0 A) for FPGA core, and SW4 (1.0 A) for ADC reference buffers. Use Value: Programmable voltage accuracy (±1.5% typical) and sequencing delay resolution (1 ms steps) enable repeatable, traceable power-up profiles required for ISO/IEC 17025 compliance.

Medical Monitoring Device

Industrial HMI Panel

Use Scenario: Portable patient vitals monitor with i.MX 6SoloLite processor, OLED display, and multi-sensor front-end (ECG, SpO₂, temperature).

IC Role / Device Role / Timing Role: MMPF0100F0ANESR2 delivers all power rails: VCOREDIG (1.25 V), VGEN2 (2.8 V for display), VGEN4 (3.3 V for sensors), VREFDDR (0.9 V for DDR3), and coin-cell-backed RTC.

Use Value: Single-chip solution eliminates discrete DC/DC + LDO count, reduces BOM cost by >35%, and meets IEC 60601-1 leakage current limits via controlled startup sequencing.

Use Scenario: Factory-floor human-machine interface with resistive touch, Ethernet PHY, CAN transceiver, and isolated I/O modules.

IC Role / Device Role / Timing Role: MMPF0100F0ANESR2 powers i.MX 6DualLite CPU core, DDR3 memory, CAN controller (VGEN5), Ethernet PHY (VGEN6), and isolated digital I/O (VGEN1).

Use Value: Industrial temperature rating (-40 °C to +105 °C) and wettable-flank QFN ensure long-term reliability in uncontrolled ambient environments; OTP lock prevents field firmware corruption.

Home Energy Gateway

Automated Test Equipment (ATE)

Use Scenario: Smart home energy meter gateway aggregating Zigbee, Z-Wave, and Wi-Fi data, running Linux on i.MX 6Quad.

IC Role / Device Role / Timing Role: MMPF0100F0ANESR2 supplies VCORE (1.1 V), VCOREDIG (1.25 V), VGEN3 (3.3 V for wireless SoCs), SWBST (5.0 V for USB host), and VREFDDR (0.9 V for DDR3L).

Use Value: Integrated boost regulator replaces external 5 V DC/DC, reducing footprint by 22 mm²; DDR tracking mode maintains signal integrity across wide temperature swings during outdoor deployment.

Use Scenario: Benchtop ATE module performing automated calibration of analog sensor boards using i.MX 6Solo.

IC Role / Device Role / Timing Role: MMPF0100F0ANESR2 generates precision LDO rails (VGEN1–6) for DUT biasing, SW2 (2.0 A) for FPGA core, and SW4 (1.0 A) for ADC reference buffers.

Use Value: Programmable voltage accuracy (±1.5% typical) and sequencing delay resolution (1 ms steps) enable repeatable, traceable power-up profiles required for ISO/IEC 17025 compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
PF0100F0AEP	Same F0 OTP firmware and electrical specs, but E-type QFN (non-wettable flank) and -40 °C to +85 °C rating.	Targeted for consumer-grade tablets and IPTV-not qualified for extended industrial ambient or reflow inspection requirements.	Select only if operating ambient stays ≤85 °C and automated optical inspection (AOI) of solder joints is not required.
MPF0100F0ANES	Identical pinout, OTP image, and thermal specs-but manufactured by MPS (Monolithic Power Systems) under licensed NXP design; minor register map offsets in non-critical status fields.	Validated for same i.MX 6 reference designs (MCIMX6Q-SDP/SDB/DL-SDP); supports identical power trees and sequencing.	Drop-in alternative where dual-sourcing is mandated; verify INTSENSE0 register bit alignment per MPS AN-127 before integration.

Compared with PF0100F0AEP, MMPF0100F0ANESR2 offers guaranteed 105 °C operation and AOI-compatible wettable flanks; versus MPF0100F0ANES, it provides NXP's full errata coverage (ER19/20/22 fixed) and direct support channel for industrial qualification documentation.

Availability

MMPF0100F0ANESR2 is available at Aetrix Electronics and suitable for medical monitoring, industrial HMI panels, and home energy gateways requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MMPF0100F0ANESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The PF0100 product line was engineered specifically to deliver complete, configurable power management for NXP's i.MX 6 family of applications processors-enabling single-chip power delivery with minimal external components in space-constrained, thermally demanding embedded systems.

FAQ

What is the operating temperature range for the MMPF0100F0ANESR2?

The MMPF0100F0ANESR2 is rated for an industrial ambient temperature range of -40 °C to +105 °C, validated per JEDEC JESD22-A108. This rating applies specifically to the ANES suffix variant and is confirmed in Table 3 of the official NXP datasheet Rev. 20 (May 2022). The device achieves this range via enhanced thermal design of the WF-type QFN package and internal thermal protection thresholds calibrated for extended operation.

Does the MMPF0100F0ANESR2 support DDR3 memory termination?

Yes, the MMPF0100F0ANESR2 includes a dedicated DDR termination reference block with VREFDDR output, VINREFDDR input, and VHALF half-supply reference pin. As documented in Section 6.3.2 and Figure 2 of the datasheet, this subsystem provides a precision 0.9 V DDR VTT rail with tracking capability-ensuring stable termination voltage across voltage and temperature variation for i.MX 6 DDR3/DDR3L interfaces.

What is the purpose of the LICELL pin on the MMPF0100F0ANESR2?

The LICELL pin on the MMPF0100F0ANESR2 serves as a bidirectional coin-cell interface: it accepts input from a 3 V lithium coin cell (VLICELL ≤ 3.6 V) and provides regulated charging current to maintain the cell while simultaneously powering the VSNVS rail for RTC backup. Per Section 6.4.7 and Table 4, this eliminates need for external charger ICs and enables persistent timekeeping during main power loss in medical and industrial applications.

How many buck converters does the MMPF0100F0ANESR2 integrate, and what are their maximum output currents?

The MMPF0100F0ANESR2 integrates six buck converters: SW1A/B/C (2.5 A / 2.5 A / 2.0 A), SW2 (2.0 A), SW3A/B (2.5 A / 2.5 A), and SW4 (1.0 A). These values are specified in the "Simplified application diagram" (Figure 1), internal block diagram (Figure 2), and Table 4 pin definitions under SWxIN/SWxLX ratings. SW2 supports 2.5 A only in NP/F9/FA industrial variants (ANES suffix), per Note 4 in Table 1.

Is the MMPF0100F0ANESR2 pin-compatible with other PF0100 variants like MMPF0100F0AEP?

Yes, the MMPF0100F0ANESR2 shares identical pinout, package dimensions (56-pin QFN 8×8 mm), and electrical pin functions with MMPF0100F0AEP and all other PF0100 variants. This is confirmed in Section 3 ("Pin connections") and Table 4 ("PF0100 pin definitions") of the datasheet. Differences are limited to package construction (wettable flank vs. full-lead), temperature rating (-40 °C to +105 °C vs. -40 °C to +85 °C), and OTP programming code (F0), not physical or logical interface.

MMPF0100F0ANESR2 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 56-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Applications:: Converter, i.MX6

Voltage - Input:: 2.8V ~ 4.5V

Number of Outputs:: 12

Voltage - Output:: Multiple

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: 56-QFN-EP (8x8)

MMPF0100F0ANESR2 FAQ

1.How can I place an order for MMPF0100F0ANESR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MMPF0100F0ANESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MMPF0100F0ANESR2 reliable?

The price and inventory of MMPF0100F0ANESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0100F0ANESR2 is usually 5 days.

3.What payment methods are accepted for MMPF0100F0ANESR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0100F0ANESR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MMPF0100F0ANESR2?

MMPF0100F0ANESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MMPF0100F0ANESR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MMPF0100F0ANESR2?

For technical support, including MMPF0100F0ANESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0100F0ANESR2 requirements.

6.How does Aetrix verify that MMPF0100F0ANESR2 is sourced from the original manufacturer or authorized distributors?

All MMPF0100F0ANESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0100F0ANESR2 meets industry standards.

7.What is the process for return or replacement of MMPF0100F0ANESR2?

All MMPF0100F0ANESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0100F0ANESR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MMPF0100F0ANESR2 part is unused and in its original packaging.

Return procedure for MMPF0100F0ANESR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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