NXP Semiconductors MMPF0100F0AZES
- Part No.:
- MMPF0100F0AZES
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0100F0AZES.pdf
- Description:
- IC REG CONV I.MX6 12OUT 56QFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,424
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MMPF0100F0AZES from NXP Semiconductors is an AEC-Q100 Grade 2 automotive power management IC (PMIC) designed for i.MX 6 family processors. It integrates six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–6), RTC supply, coin-cell charger, DDR termination reference (VREFDDR), and I²C programmable control logic - delivering full-system power for infotainment, digital clusters, and HUDs with 2.8–4.5 V input.
For engineers reviewing the MMPF0100F0AZES datasheet, MMPF0100F0AZES pinout, MMPF0100F0AZES application, or MMPF0100F0AZES equivalent, key selection criteria include OTP-programmable startup sequencing, dual-phase buck capability on SW1A/B, VSNVS LDO/switch support, thermal interrupt reporting (THERM110I–THERM130I), and compatibility with MCIMX6Q-SDP/MCIMX6DL-SDP reference designs.
Technical Context
The MMPF0100F0AZES implements a hierarchical power tree with independent state machine control per regulator group, supporting dynamic voltage scaling (DVS) for core and memory rails. Its OTP memory stores boot configuration, including POR settings, voltage targets, sequencing delays, and enable/disable states - eliminating external configuration components.
It features integrated bias generation (VCOREDIG = 1.5 V, VCOREREF = 1.5 V, VHALF = half-supply for DDR tracking), dedicated GNDREF/GNDREF1 ground references per regulator domain, and robust thermal protection with four programmable junction temperature thresholds (110°C/120°C/125°C/130°C) reported via I²C-interrupt flags.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V main supply (VIN); supports automotive battery transients via internal LDO pre-regulation |
| Buck Regulators | Six configurable: SW1A/B (2.5 A each, single/dual-phase), SW1C (2 A), SW2 (2 A), SW3A/B (2.5 A total), SW4 (1 A) |
| LDO Outputs | Six general-purpose: VGEN1 (100 mA, 2.5 V), VGEN2 (250 mA, 2.5 V), VGEN3 (100 mA, 3.6 V), VGEN4 (350 mA, 3.6 V), VGEN5 (100 mA, 3.6 V), VGEN6 (200 mA, 3.6 V) |
| VREFDDR Accuracy | ±1.5% over -40°C to +105°C; tracks DDR termination voltage with VHALF input for adaptive calibration |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz); 7-bit slave address 0x08; supports register read/write and interrupt status polling |
| Thermal Protection | Four junction temperature thresholds (110°C/120°C/125°C/130°C); debounced 8 ms; generates dedicated interrupt flags per threshold |
| Ambient Temp Range | -40°C to +105°C (AEC-Q100 Grade 2 qualified) |
Pinout & Package
Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch, wettable flank ES suffix). Exposed thermal pad (EP) must be connected to PCB ground plane via multiple vias for thermal dissipation and electrical stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1ALX / SW1BLX / SW1CLX | Buck switch node outputs | High-frequency switching nodes for SW1A/B/C regulators; require low-inductance layout and separate feedback routing |
| VGEN1–VGEN6 | LDO regulated outputs | Stable analog supplies for peripherals (audio codec, sensors, USB PHY); each requires specified ceramic output capacitance |
| VREFDDR / VHALF / VINREFDDR | DDR termination reference subsystem | VREFDDR provides precise DDR VTT reference; VHALF enables tracking mode; VINREFDDR supplies internal reference buffer |
| INTB / THERMxxxI flags | Open-drain interrupt outputs | Active-low signals indicating fault conditions (thermal, overcurrent, POR failure); require external pull-up |
| SCL / SDA / VDDIO | I²C interface pins | Standard bidirectional I²C bus; VDDIO powers internal level shifters - must match host I/O voltage (1.8 V or 3.3 V) |
| VSNVS | Always-on LDO/switch output | Provides backup power to MCU real-time clock or non-volatile memory; supports coin-cell charging via LICELL pin |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable power tree | One-time programmable memory stores complete startup sequence, voltage targets, timing delays, and enable states - eliminates external configuration EEPROM or firmware initialization overhead |
| Dual-phase SW1A/B operation | Combines two 2.5 A buck channels into single 5 A output with interleaved switching - reduces input/output ripple and eases thermal design for high-current cores |
| VREFDDR tracking mode | Adaptively adjusts DDR termination voltage using VHALF as half-supply reference - maintains optimal signal integrity across voltage/temperature drift |
| Integrated coin-cell charger | LICELL pin supports trickle-charge of backup battery while regulating VSNVS output - enables RTC retention during main power loss without discrete charger IC |
| Multi-domain ground isolation | Dedicated GNDREF (for bandgap/VCORE) and GNDREF1 (for SW2/SW4) minimize noise coupling between analog, digital, and power-switching domains |
Applications
| Auto Infotainment Head Unit | Digital Instrument Cluster (DIC) |
|---|---|
Use Scenario: Central multimedia system powering i.MX6Q processor, HDMI display, audio codec, USB peripherals, and GPS module. IC Role / Device Role / Timing Role: Primary PMIC supplying all core, memory, and peripheral rails with synchronized startup and DVS-controlled core voltage scaling. Use Value: Reduces BOM count by integrating six bucks, six LDOs, DDR reference, and RTC backup - validated on MCIMX6Q-SDP reference design. | Use Scenario: Real-time driver information display with TFT LCD, CAN interface, and sensor fusion (IMU, ambient light). IC Role / Device Role / Timing Role: Provides isolated, low-noise VGEN2/VGEN4 for display timing controller and VREFDDR for DDR memory termination in safety-critical cluster. Use Value: GNDREF1 separation prevents switching noise from SW2/SW4 from corrupting analog sensor inputs or display data lines. |
| Heads-Up Display (HUD) | Rear Seat Entertainment |
Use Scenario: Compact optical projection unit requiring compact power solution with minimal external components and strict EMI control. IC Role / Device Role / Timing Role: Delivers tightly regulated VCOREDIG (1.5 V) and VCORE (3.6 V) for laser driver and image processor, with thermal interrupts for lens-cooling fan control. Use Value: Interleaved SW1A/B operation lowers peak input current and conducted EMI - critical for automotive EMC compliance in HUD placement near dashboard electronics. | Use Scenario: Dual-display rear-seat system with MIPI DSI interface, stereo audio amplifier, and SD card reader. IC Role / Device Role / Timing Role: Supplies VGEN3/VGEN5 for MIPI PHY, VGEN6 for audio amp bias, and SW4 for SD card VCC - all sequenced to avoid inrush current conflicts. Use Value: Programmable sequencing ensures display backlight enables only after panel power stabilizes - preventing visual artifacts during cold start. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMPF0100NPAZES | Non-programmed OTP; requires customer programming for custom sequencing/voltage targets | Used where flexible configuration is needed across multiple i.MX6 variants (e.g., MCIMX6SAICPU1, MCIMX6DLAICPU1) | Select when full customization of startup behavior is required; not drop-in for F0's pre-programmed MCIMX6Q-SDP configuration |
| MMPF0100F9AZES | Same OTP configuration as F0 but supports 2.5 A on SW2 (vs. 2.0 A in F0) when SW2ILIM=0 | Targeted at higher-power i.MX6QPlus-based systems (MCIMX6QPlusAICPU3) needing extra current headroom on SW2 rail | Select for upgraded i.MX6QPlus designs requiring >2 A on SW2; otherwise functionally identical to F0 in standard configurations |
Compared with MMPF0100NPAZES, the MMPF0100F0AZES offers immediate plug-and-play integration with MCIMX6Q-SDP, while MMPF0100F9AZES extends SW2 current capability - making F0 optimal for cost-sensitive, volume-qualified i.MX6Q head units where no SW2 upgrade is needed.
Availability
MMPF0100F0AZES is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and heads-up displays requiring stable component supply, AEC-Q100 qualification, and reference-design compatibility.
Supply support for MMPF0100F0AZES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The PF0100Z product line delivers highly configurable, AEC-Q100-compliant power management for NXP's i.MX application processors - enabling full-system power integration with minimal external components and robust thermal/fault management.
FAQ
What is the primary application target for the MMPF0100F0AZES?
The MMPF0100F0AZES is specifically pre-programmed for use with NXP's i.MX 6Quad and i.MX 6DualLite reference designs (MCIMX6Q-SDP and MCIMX6DL-SDP). It delivers full-system power - including core, memory, peripherals, and DDR termination - for automotive infotainment head units and digital instrument clusters meeting AEC-Q100 Grade 2 requirements. Its OTP configuration matches the default startup sequence and voltage targets defined in those reference platforms.
Does the MMPF0100F0AZES support DDR memory termination?
Yes, the MMPF0100F0AZES integrates a dedicated VREFDDR regulator with ±1.5% accuracy over temperature, plus VHALF and VINREFDDR pins to enable DDR termination voltage tracking. This allows adaptive adjustment of the DDR VTT reference based on system supply variations - critical for signal integrity in high-speed memory interfaces used in i.MX6-based automotive displays.
How does the MMPF0100F0AZES handle thermal protection?
The MMPF0100F0AZES monitors die temperature and asserts four distinct interrupt flags - THERM110I, THERM120I, THERM125I, and THERM130I - when crossing corresponding junction thresholds. These are debounced for 8 ms to prevent false triggers. The thresholds are readable via INTSENSE0 register bits, allowing host software to implement graduated thermal mitigation (e.g., reduce CPU frequency before shutdown).
Can the MMPF0100F0AZES be reprogrammed after initial OTP configuration?
No, the OTP (one-time programmable) memory in the MMPF0100F0AZES is permanently written during manufacturing and cannot be altered in the field. The F0 variant contains factory-programmed configuration for MCIMX6Q-SDP/MCIMX6DL-SDP. For custom configurations, NXP offers the non-programmed MMPF0100NPAZES variant, which requires customer OTP programming prior to deployment.
What is the role of the VSNVS pin on the MMPF0100F0AZES?
The VSNVS pin on the MMPF0100F0AZES provides a dedicated always-on power rail derived from either the main input (VIN) or an external coin cell connected to LICELL. It functions as an LDO output or switchable source - enabling RTC retention, non-volatile memory backup, and wake-up circuitry even during main power loss, without requiring additional discrete backup power components.
MMPF0100F0AZES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 12
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MMPF0100F0AZES FAQ
1.How can I place an order for MMPF0100F0AZES through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0100F0AZES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0100F0AZES reliable?
The price and inventory of MMPF0100F0AZES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0100F0AZES is usually 5 days.
3.What payment methods are accepted for MMPF0100F0AZES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0100F0AZES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0100F0AZES?
MMPF0100F0AZES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0100F0AZES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0100F0AZES?
For technical support, including MMPF0100F0AZES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0100F0AZES requirements.
6.How does Aetrix verify that MMPF0100F0AZES is sourced from the original manufacturer or authorized distributors?
All MMPF0100F0AZES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0100F0AZES meets industry standards.
7.What is the process for return or replacement of MMPF0100F0AZES?
All MMPF0100F0AZES units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0100F0AZES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0100F0AZES part is unused and in its original packaging.
Return procedure for MMPF0100F0AZES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MMPF0100F0AZES Tags

-
TPS51206DSQR
Texas Instruments

-
TPS51200DRCR
Texas Instruments

-
TPS51200DRCT
Texas Instruments

-
TPS62740DSSR
Texas Instruments

-
TPS51100DGQR
Texas Instruments
-
NCP51200MNTXG
onsemi
-
NCP51400MNTXG
onsemi

-
RT9026GSP
Richtek USA Inc.

-
LP2998MRX/NOPB
Texas Instruments

-
TPS51200QDRCRQ1
Texas Instruments

-
DPA423GN-TL
Power Integrations

-
LM10011SD/NOPB
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

