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NXP Semiconductors MMPF0100F3AEPR2
- Part No.:
- MMPF0100F3AEPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0100F3AEPR2.pdf
- Description:
- IC REG CONV I.MX6 12OUT 56HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,897
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Product details
Overview
MMPF0100F3AEPR2 from NXP Semiconductors is a 14-channel configurable power management IC (PMIC) designed for i.MX 6-based embedded platforms. It integrates six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–6), coin-cell charger, RTC supply, DDR termination reference (VREFDDR), and I²C interface. It delivers up to 2.5 A per high-current buck channel and supports programmable voltage sequencing for processors, memory, and peripherals in eReaders and industrial control systems.
For engineers reviewing the MMPF0100F3AEPR2 datasheet, MMPF0100F3AEPR2 pinout, MMPF0100F3AEPR2 application, or MMPF0100F3AEPR2 equivalent, key selection considerations include OTP-programmed F3 configuration for i.MX 6SoloLite compatibility, 56-pin QFN 8×8 mm package with wettable flanks, thermal protection thresholds at 110°C/120°C/125°C/130°C, and support for DDR termination tracking mode and dual-phase operation on select buck rails.
Technical Context
The MMPF0100F3AEPR2 implements a hierarchical power tree with independent state machine control for each regulator group, enabling precise startup/shutdown sequencing across core, memory, and I/O domains. Its OTP memory stores boot-time configuration including voltage setpoints, timing delays, and enable/disable states - eliminating external configuration components.
It features integrated bias generation for VCOREDIG (1.5 V), VCOREREF (1.5 V), and VHALF (half-supply reference for VREFDDR), plus dedicated analog ground references (GNDREF, GNDREF1) to isolate noise-sensitive feedback paths. The I²C interface operates at standard-mode (100 kHz) and fast-mode (400 kHz) with fixed slave address 0x08 and interrupt-driven status reporting via INTB.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Main input range | 2.8 V to 4.5 V - powers entire PMIC from single Li-ion or regulated system rail |
| SW1A/B output current | 2.5 A - supports dual-phase or parallel operation for processor core voltage (VCORE) |
| VREFDDR accuracy | ±1.5% - ensures compliant DDR3/DDR4 termination voltage tracking |
| I²C address | 0x08 - fixed 7-bit slave address enables deterministic multi-device bus design |
| OTP memory | One-time programmable - stores immutable boot configuration; F3 variant pre-programmed for i.MX 6SoloLite reference designs |
| Thermal shutdown | 130°C - debounced 8 ms protection prevents false triggers during transient overload |
| Package | 56-pin QFN 8×8 mm, 0.5 mm pitch, wettable flank (WF-type) - supports automated optical solder inspection |
Pinout & Package
Package: 56-pin QFN 8×8 mm, 0.5 mm pitch, wettable flank (WF-type), exposed thermal pad (EP). Thermal resistance RθJA = 15°C/W (8-layer board), RθJB = 10°C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB | Open-drain interrupt output | Signals fault conditions (thermal, overcurrent, POR timeout) to host processor; requires external pull-up |
| SCL / SDA | I²C interface | Configures regulators, reads status registers, and enables dynamic voltage scaling (DVS) control |
| SW1ALX / SW1BLX / SW1CLX | Buck switch nodes | Connect to external inductors; layout critical for EMI and efficiency - must be short, low-inductance traces |
| VREFDDR / VINREFDDR / VHALF | DDR termination reference | Provides precision 0.9 V ±1.5% reference; VHALF sets midpoint for tracking loop |
| LICELL / VSNVS | Coin-cell interface | LICELL accepts 1.8–3.6 V coin cell; VSNVS outputs regulated 3.0 V backup supply for RTC and non-volatile logic |
| EP | Exposed thermal pad | Must be connected to internal/external ground planes via ≥6 vias for thermal dissipation and EMI reduction |
Key Features
| Feature | Design Value |
|---|---|
| Pre-programmed OTP configuration (F3) | Validated for i.MX 6SoloLite EVK; eliminates firmware bring-up time for voltage sequencing and timing |
| Dual-phase buck capability (SW1A/B) | Enables 5 A total current delivery with reduced ripple and improved transient response for CPU core rails |
| DDR termination tracking mode | Automatically adjusts VREFDDR to match DDR I/O voltage (VDDQ), ensuring impedance matching without external components |
| Individual regulator enable/control | Each buck/LDO can be independently enabled, disabled, or placed in standby via I²C or hardware pins (PWRON, STANDBY) |
| Thermal monitoring with interrupts | Four discrete thresholds (110°C/120°C/125°C/130°C) trigger dedicated I²C interrupt flags for predictive thermal management |
Applications
| eReaders | IPTV Set-Top Boxes |
|---|---|
Use Scenario: Powering ARM-based SoC, E Ink display controller, NAND flash, and Wi-Fi module in battery-operated portable readers. IC Role / Device Role / Timing Role: Central PMIC managing full-system power sequencing, dynamic voltage scaling for CPU, and coin-cell-backed RTC. Use Value: Enables >1 week battery life via ultra-low quiescent current in standby and programmable LDO shutdown during sleep modes. | Use Scenario: Supplying multiple voltage domains (SoC core, DDR3, HDMI PHY, audio codec) in always-on entertainment devices. IC Role / Device Role / Timing Role: Configurable power tree coordinator with DDR termination tracking and I²C-controlled rail sequencing. Use Value: Eliminates discrete termination resistors and reduces BOM count by integrating six LDOs and six bucks in one 8×8 mm package. |
| Industrial Control Panels | Medical Monitoring Devices |
Use Scenario: Powering Cortex-M7 MCU, capacitive touch controller, CAN transceiver, and isolated sensors in factory HMIs. IC Role / Device Role / Timing Role: Robust power supervisor with thermal fault reporting, wide-input tolerance (2.8–4.5 V), and extended temperature rating (−40°C to 105°C). Use Value: Ensures reliable startup under brown-out conditions and provides fail-safe shutdown before junction temperature exceeds 125°C. | Use Scenario: Delivering clean, sequenced power to patient-connected analog front-ends, low-power MCU, and Bluetooth LE radio in portable diagnostics. IC Role / Device Role / Timing Role: Medical-grade power manager with coin-cell backup (LICELL/VSNVS), low-noise LDOs (VGEN1–6), and ESD-hardened I/O (±2 kV HBM). Use Value: Maintains RTC and critical memory during main power loss and meets IEC 60601-1 creepage/clearance requirements via isolated ground references. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMPF0100F0AEPR2 | Pre-programmed for i.MX 6Quad/DualLite reference designs; different voltage setpoints and sequencing order | Targeted at higher-performance i.MX 6Quad platforms requiring 1.2 V core and 1.5 V GPU rails | Select F0 only when migrating from MCIMX6Q-SDP; F3 provides optimized settings for i.MX 6SoloLite's lower power envelope |
| MMPF0100F6AEPR2 | OTP configured for i.MX 6SoloX; includes additional security boot features and different VGENx assignments | Required for i.MX 6SoloX-based secure boot applications with cryptographic acceleration | F6 is mandatory for SoloX designs; F3 lacks required OTP fuse settings for secure ROM execution flow |
Compared with MMPF0100F0AEPR2 and MMPF0100F6AEPR2, the MMPF0100F3AEPR2 offers voltage setpoints and sequencing tailored specifically for i.MX 6SoloLite's 1.0–1.2 V core domain and 3.3 V I/O, with no unused regulator channels - optimizing efficiency and reducing idle current in cost-sensitive industrial edge nodes.
Availability
MMPF0100F3AEPR2 is available at Aetrix Electronics and suitable for eReaders, industrial control panels, and medical monitoring devices requiring stable component supply, long-term lifecycle support, and guaranteed OTP configuration consistency across production batches.
Supply support for MMPF0100F3AEPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.
The PF0100 product line was engineered to deliver fully integrated, OTP-configurable power solutions for NXP's i.MX application processor family - reducing external component count while enabling flexible, software-defined power architecture for embedded edge devices.
FAQ
What is the operating temperature range for the MMPF0100F3AEPR2?
The MMPF0100F3AEPR2 is qualified for industrial operation from −40°C to +105°C ambient temperature. This rating applies to the ANES-suffix variants (e.g., MMPF0100F3ANES); the EPR2 tape-and-reel version of MMPF0100F3AEPR2 retains this extended temperature grade. Thermal protection activates at 110°C, 120°C, 125°C, and 130°C junction thresholds.
Does the MMPF0100F3AEPR2 support DDR3 or DDR4 memory termination?
Yes, the MMPF0100F3AEPR2 supports both DDR3 and DDR4 termination via its VREFDDR output, which delivers a precision 0.9 V ±1.5% reference. When configured in tracking mode, it dynamically follows VDDQ (I/O voltage) using the VHALF and VINREFDDR inputs - meeting JEDEC JESD79-3F and JESD79-4 requirements for DDR3/DDR4 compliance.
How is the OTP memory programmed in the MMPF0100F3AEPR2?
The MMPF0100F3AEPR2 ships with factory-programmed OTP fuses defining voltage setpoints, sequencing order, and timing for i.MX 6SoloLite platforms. Programming occurs during wafer test using VDDOTP (pin 47) at up to 10 V. Once programmed, OTP contents are immutable; no field reprogramming is supported. Configuration details are documented in Table 10 of the PF0100 datasheet.
Can the MMPF0100F3AEPR2 replace the MMPF0100F1AEPR2 in an existing design?
No - the MMPF0100F3AEPR2 is not a drop-in replacement for MMPF0100F1AEPR2. While both share the same pinout and package, their OTP configurations differ significantly: F1 targets i.MX 6SoloLite EVK but uses alternate voltage sequencing, and F3 is explicitly recommended in NXP documentation as the preferred option for new i.MX 6SoloLite designs due to optimized power-up timing and lower idle current.
What are the key differences between MMPF0100F3AEPR2 and MMPF0100F3AEP?
The MMPF0100F3AEPR2 is the tape-and-reel packaging variant of MMPF0100F3AEP, with identical electrical specifications, OTP content, and thermal characteristics. The "R2" suffix denotes 2,000-piece reel packaging per JEDEC standard J-STD-033; no functional or parametric differences exist between the two part numbers.
MMPF0100F3AEPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 12
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-HVQFN (8x8)
MMPF0100F3AEPR2 FAQ
1.How can I place an order for MMPF0100F3AEPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0100F3AEPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0100F3AEPR2 reliable?
The price and inventory of MMPF0100F3AEPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0100F3AEPR2 is usually 5 days.
3.What payment methods are accepted for MMPF0100F3AEPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0100F3AEPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0100F3AEPR2?
MMPF0100F3AEPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0100F3AEPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0100F3AEPR2?
For technical support, including MMPF0100F3AEPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0100F3AEPR2 requirements.
6.How does Aetrix verify that MMPF0100F3AEPR2 is sourced from the original manufacturer or authorized distributors?
All MMPF0100F3AEPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0100F3AEPR2 meets industry standards.
7.What is the process for return or replacement of MMPF0100F3AEPR2?
All MMPF0100F3AEPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0100F3AEPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0100F3AEPR2 part is unused and in its original packaging.
Return procedure for MMPF0100F3AEPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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