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NXP Semiconductors MMPF0100F3ANESR2

Part No.:
MMPF0100F3ANESR2
Manufacturer:
NXP Semiconductors
Category:
Special Purpose Regulators
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMMPF0100F3ANESR2.pdf
Description:
IC REG CONV I.MX6 12OUT 56QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,666

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Product details

Overview

MMPF0100F3ANESR2 from NXP Semiconductors is a 14-channel configurable power management IC (PMIC) designed for i.MX 6-based embedded platforms. It integrates six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–VGEN6), RTC supply, coin-cell charger, DDR termination reference (VREFDDR), and I²C programmable control logic. It operates from a 2.8–4.5 V main input and supports -40 °C to +105 °C industrial ambient temperature range.

For engineers reviewing the MMPF0100F3ANESR2 datasheet, MMPF0100F3ANESR2 pinout, MMPF0100F3ANESR2 application, or MMPF0100F3ANESR2 equivalent, key selection criteria include OTP-programmable power sequencing, DDR memory interface support (VREFDDR tracking), thermal protection thresholds (110–130 °C interrupts), and compatibility with i.MX 6SoloLite reference designs per NXP documentation.

Technical Context

The MMPF0100F3ANESR2 implements a hierarchical power tree with independent state machine control for startup, standby, and shutdown sequences. Its architecture includes dual-phase capable buck regulators (SW1A/B, SW3A/B), a dedicated DDR termination reference generator (VREFDDR), and an integrated Li-ion coin-cell charger (LICELL) with VSNVS LDO/switch output for always-on domain power.

Control is executed via I²C interface (SCL/SDA, 3.6 V tolerant) with register-mapped configuration of voltage levels, timing delays, and enable/disable states. OTP memory stores boot-time configuration, and thermal monitoring uses four interrupt-enabled thresholds (THERM110I–THERM130I) with 8 ms debounce to prevent false trips.

Key Specifications

ParameterValue and Actual Design Meaning
Main input voltage2.8–4.5 V - powers entire PMIC; requires external 4.7 µF + 0.1 µF decoupling at VIN
Buck converter count6 - SW1A/B/C (2.5 A/2.5 A/2.0 A), SW2 (2.0 A), SW3A/B (2.5 A/2.5 A), SW4 (1.0 A)
LDO count & outputs6 - VGEN1 (100 mA), VGEN2 (250 mA), VGEN3 (100 mA), VGEN4 (350 mA), VGEN5 (100 mA), VGEN6 (200 mA)
VREFDDR accuracy±1.5% - provides precise DDR memory termination reference voltage tracking half-supply (VHALF)
OTP memoryOne-time programmable - stores boot configuration including voltage, sequence, timing, and DVS settings
Thermal protectionFour interrupt thresholds (110/120/125/130 °C) - debounced 8 ms; triggers automatic shutdown above 130 °C
Operating temperature-40 °C to +105 °C - qualified for extended industrial applications (ANES suffix)

Pinout & Package

Package: 56-pin QFN, 8 mm × 8 mm, 0.5 mm pitch, wettable flank (WF-type), exposed thermal pad (EP).

Pin/TerminalCircuit RoleDesign Meaning
INTBOpen-drain interrupt outputSignals fault conditions (thermal, overvoltage, watchdog timeout) to host processor
SW1ALX / SW1BLX / SW1CLXBuck switch node outputsDrive external inductors for VCOREDIG, VCORE, and VGEN2 rails; require low-inductance PCB layout
VREFDDR / VHALF / VINREFDDRDDR termination reference subsystemVHALF sets midpoint reference; VINREFDDR supplies regulator; VREFDDR delivers stable 0.6–0.9 V DDR termination voltage
LICELL / VSNVSCoin-cell interface & always-on LDOLICELL accepts 1.8–3.6 V coin cell; VSNVS delivers regulated 3.0 V ±3% for RTC and backup domains
SCL / SDA / VDDIOI²C control interface3.6 V-tolerant bus; VDDIO powers I/O buffers; supports standard/fast-mode (100/400 kHz) communication
EPExposed thermal padMust be soldered to internal/external ground planes via ≥6 vias for thermal dissipation (RθJB = 10 °C/W)

Key Features

FeatureDesign Value
Configurable power sequencingProgrammable startup/shutdown order and timing delays across all 14 channels via OTP or I²C registers
DDR memory interface supportDedicated VREFDDR generator with tracking mode ensures stable DDR termination voltage matching VDDQ/2
Integrated coin-cell managementLICELL input with charge control and VSNVS LDO output enables seamless RTC and backup power without external circuitry
Thermal safety with interrupt reportingFour independent temperature thresholds feed status bits to INTB and register-accessible interrupt flags for system-level thermal response
Industrial-grade reliabilityQualified for -40 °C to +105 °C operation (ANES suffix); includes ESD protection (HBM ±2 kV, CDM ±500 V)

Applications

i.MX 6SoloLite Embedded ControlIndustrial Medical Monitoring

Use Scenario: Powering i.MX 6SoloLite SoC in portable medical devices requiring low-power standby and fast wake-up.

IC Role / Device Role / Timing Role: MMPF0100F3ANESR2 delivers VCOREDIG (1.5 V), VCORE (1.5 V), VGEN2 (2.5 V), and VREFDDR (0.75 V) with synchronized sequencing and DDR tracking.

Use Value: Eliminates discrete regulators and sequencing ICs; reduces BOM count by ≥12 components while meeting IEC 60601-1 thermal limits.

Use Scenario: Supplying multi-rail power to patient-worn sensors, display, and wireless transceivers in battery-operated monitors.

IC Role / Device Role / Timing Role: MMPF0100F3ANESR2 powers VGEN1 (1.8 V), VGEN3 (3.3 V), VGEN4 (3.3 V), and LICELL-backed VSNVS (3.0 V) with ultra-low quiescent current in standby.

Use Value: Enables >72-hour battery life in continuous monitoring mode using programmable low-power states and coin-cell backup.

Home Energy Management HubFactory Automation Gateway

Use Scenario: Centralized power for Zigbee/Z-Wave radios, MCU, and LCD in smart home energy gateways.

IC Role / Device Role / Timing Role: MMPF0100F3ANESR2 generates VGEN5 (3.3 V), VGEN6 (3.3 V), SWBST (5.0 V boost), and VREFDDR (for optional DDR-based UI controller).

Use Value: Single-chip solution replaces 8+ discrete DC/DC and LDOs; supports firmware-updatable rail configurations for field-deployed units.

Use Scenario: Powering ARM-based gateway SoCs, CAN transceivers, and isolated I/O in harsh factory environments.

IC Role / Device Role / Timing Role: MMPF0100F3ANESR2 delivers SW2 (2.0 A), VGEN2 (2.5 V), VGEN4 (3.5 V), and robust thermal shutdown (130 °C limit) per EN 61000-6-2.

Use Value: Maintains operation up to +105 °C ambient; eliminates need for external thermal sensors or fan control logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MMPF0100F0ANESR2Pre-programmed for i.MX 6Quad/DualLite reference designs; lacks F3-specific VGEN2/VGEN4 sequencing optimized for SoloLiteTargeted at higher-performance i.MX 6Quad systems; not validated for SoloLite's lower-current core rail requirementsSelect only if migrating from MCIMX6Q-SDP hardware; requires revalidation of startup timing and DDR termination stability
PF8100A00000000Higher integration: adds USB-C PD controller, 3x more GPIOs, and enhanced OTP security; no VREFDDR blockDesigned for next-gen i.MX 8M platforms; incompatible with i.MX 6 pinout and register mapNot drop-in; requires full schematic and firmware redesign; suitable only for new i.MX 8M-based designs

Compared with MMPF0100F0ANESR2 and PF8100A00000000, the MMPF0100F3ANESR2 uniquely balances i.MX 6SoloLite compatibility, DDR termination support, and industrial temperature rating-making it the only validated option for cost-sensitive, thermally demanding embedded control applications requiring VREFDDR.

Availability

MMPF0100F3ANESR2 is available at Aetrix Electronics and suitable for industrial medical monitoring, home energy management hubs, and factory automation gateways requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MMPF0100F3ANESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, IoT, and mobile applications.

The PF0100 product line was engineered specifically to consolidate power delivery for NXP's i.MX application processors-reducing external component count while enabling flexible, field-programmable power architectures for embedded edge devices.

FAQ

What is the primary function of the MMPF0100F3ANESR2 in an i.MX 6-based design?

The MMPF0100F3ANESR2 serves as the central power management IC for i.MX 6SoloLite platforms, delivering and sequencing all required voltage rails-including VCOREDIG (1.5 V), VCORE (1.5 V), VGEN2 (2.5 V), VGEN4 (3.5 V), and VREFDDR (0.75 V)-while integrating coin-cell charging and thermal protection. Its OTP configuration is pre-validated for SoloLite reference designs, eliminating manual sequencing setup.

Does the MMPF0100F3ANESR2 support DDR memory termination, and how is it implemented?

Yes, the MMPF0100F3ANESR2 includes a dedicated DDR termination reference generator. It uses three pins-VHALF (half-supply reference), VINREFDDR (input), and VREFDDR (output)-to produce a precise, trackable termination voltage (typically 0.75 V) that follows VDDQ/2. This implementation meets JEDEC DDR3/DDR4 specifications without external resistors or op-amps.

What thermal protection features does the MMPF0100F3ANESR2 provide, and how are they signaled?

The MMPF0100F3ANESR2 provides four programmable thermal interrupt thresholds (110 °C, 120 °C, 125 °C, 130 °C), each generating a dedicated flag (THERM110I–THERM130I) accessible via I²C register INTSENSE0. An open-drain INTB pin asserts on any threshold breach, and automatic shutdown occurs above 130 °C with 8 ms debounce to prevent noise-induced trips.

Can the MMPF0100F3ANESR2 be used with coin-cell backup, and what rails does it support?

Yes, the MMPF0100F3ANESR2 supports coin-cell backup via the LICELL pin (1.8–3.6 V input) and delivers regulated power through the VSNVS LDO output (3.0 V ±3%). This rail powers always-on domains such as RTC, backup SRAM, and wake-up logic-enabling zero-power retention during main supply loss without external charging circuitry.

How does the OTP programming of the MMPF0100F3ANESR2 differ from non-programmed variants like MMPF0100NPANESR2?

The MMPF0100F3ANESR2 contains factory-programmed OTP fuses defining voltage levels, sequencing order, timing delays, and DVS settings specific to i.MX 6SoloLite. In contrast, MMPF0100NPANESR2 ships unprogrammed-requiring customer OTP programming or runtime I²C configuration. F3 OTP eliminates boot-time register writes and ensures deterministic power-up behavior out-of-box.

MMPF0100F3ANESR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Converter, i.MX6
Voltage - Input:
2.8V ~ 4.5V
Number of Outputs:
12
Voltage - Output:
Multiple
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-QFN-EP (8x8)

MMPF0100F3ANESR2 FAQ

1.How can I place an order for MMPF0100F3ANESR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MMPF0100F3ANESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MMPF0100F3ANESR2 reliable?

The price and inventory of MMPF0100F3ANESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0100F3ANESR2 is usually 5 days.

3.What payment methods are accepted for MMPF0100F3ANESR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0100F3ANESR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MMPF0100F3ANESR2?

MMPF0100F3ANESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MMPF0100F3ANESR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MMPF0100F3ANESR2?

For technical support, including MMPF0100F3ANESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0100F3ANESR2 requirements.

6.How does Aetrix verify that MMPF0100F3ANESR2 is sourced from the original manufacturer or authorized distributors?

All MMPF0100F3ANESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0100F3ANESR2 meets industry standards.

7.What is the process for return or replacement of MMPF0100F3ANESR2?

All MMPF0100F3ANESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0100F3ANESR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MMPF0100F3ANESR2 part is unused and in its original packaging.

Return procedure for MMPF0100F3ANESR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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