NXP Semiconductors MMPF0100F4AEPR2

Overview

MMPF0100F4AEPR2 from NXP Semiconductors is a 14-channel configurable power management IC (PMIC) designed for i.MX 6-based embedded platforms. It integrates six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–VGEN6), coin-cell charger, RTC supply, DDR termination reference (VREFDDR), and I²C programmable control logic. It delivers up to 2.5 A per high-current buck channel and supports pre-programmed OTP configuration for eReaders, IPTV, and industrial control systems.

For engineers reviewing the MMPF0100F4AEPR2 datasheet, MMPF0100F4AEPR2 pinout, MMPF0100F4AEPR2 application, or MMPF0100F4AEPR2 equivalent, key selection criteria include its 56-pin QFN 8×8 mm package, OTP-configurable power tree with DDR tracking mode, thermal protection thresholds (110°C–130°C interrupts), and compatibility with i.MX 6SoloLite and i.MX 6Quad reference designs.

Technical Context

The MMPF0100F4AEPR2 implements a hierarchical power control architecture with an initialization state machine, I²C register-mapped interface, and trim-in-package voltage references. Its core regulation includes VCOREDIG (1.5 V digital core), VCOREREF (1.5 V bandgap reference), and VHALF-based DDR termination tracking.

It features dual-phase or parallel operation options for buck regulators SW1A/B/C, programmable sequencing across 14 channels, and dedicated bias blocks for VSNVS (standby power rail) and LICELL (coin-cell charging). Thermal monitoring uses four interrupt-enabled thresholds (THERM110I–THERM130I) with 8 ms debounce.

Key Specifications

Pinout & Package

Package: 56-pin QFN 8×8 mm, 0.5 mm pitch, E-type (full-lead), exposed thermal pad (EP).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with MMPF0100F0AEPR2 and MMPF0100F3AEPR2, the MMPF0100F4AEPR2 provides optimized OTP configuration for i.MX 6SoloLite platforms, tighter VREFDDR accuracy for clinical DDR3 interfaces, and validated thermal behavior at 85°C ambient-making it the preferred choice for portable medical and energy management devices.

Availability

MMPF0100F4AEPR2 is available at Aetrix Electronics and suitable for eReaders, IPTV set-top boxes, and industrial control panels requiring stable component supply, long-term lifecycle support, and guaranteed OTP configuration consistency across production batches.

Supply support for MMPF0100F4AEPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based processing and power management.

The PF0100 product line was engineered to consolidate power delivery for NXP's i.MX application processors, reducing external component count while enabling field-upgradable power policies via OTP and I²C.

FAQ

What is the operating temperature range for the MMPF0100F4AEPR2?

The MMPF0100F4AEPR2 is qualified for consumer applications with an ambient operating temperature range of -40 °C to +85 °C. This rating is defined in Table 3 of the datasheet and applies specifically to the E-type QFN package with EP suffix. The device incorporates thermal protection interrupts (THERM110I–THERM130I) to safeguard operation within this range, and junction temperature must not exceed 125 °C under normal conditions. MMPF0100F4AEPR2 does not support the extended industrial -40 °C to +105 °C range-that requires the ANES-suffix variant.

Does the MMPF0100F4AEPR2 support DDR3 or DDR4 memory termination?

Yes, the MMPF0100F4AEPR2 supports DDR3 and DDR4 memory termination through its VREFDDR output, which provides a precision voltage reference tracked to half the DDR supply (VDDQ). The VREFDDR accuracy is ±1.5% over temperature and load, meeting JEDEC specifications for both DDR3 and DDR4. The VHALF and VINREFDDR pins enable proper biasing and filtering, and the datasheet confirms compatibility with i.MX 6Quad and i.MX 6SoloLite DDR interfaces-both of which implement DDR3L and LPDDR2, with backward-compatible termination requirements.

How is the MMPF0100F4AEPR2 programmed for custom power sequences?

The MMPF0100F4AEPR2 is programmed via its on-chip one-time programmable (OTP) memory, accessible through the I²C interface using specific register writes documented in Section 6.1.2 of the datasheet. Custom sequences-including voltage levels, ramp rates, and inter-rail timing-are written to OTP fuses during manufacturing or prototyping. The MMPF0100F4AEPR2 ships pre-programmed for i.MX 6SoloLite; reprogramming requires NXP's PF0100 OTP programmer tool and adherence to fuse-lock procedures. Once programmed, the sequence executes autonomously at power-on without host processor involvement.

Can the MMPF0100F4AEPR2 charge a coin cell battery while powering the system?

Yes, the MMPF0100F4AEPR2 supports simultaneous coin-cell charging and system operation via the LICELL pin. When a coin cell (e.g., CR2032) is connected, the internal charger circuit regulates charge current and voltage to safely top off the cell while the main VIN supply powers all regulators. During main supply loss, the device automatically switches VSNVS and RTC supply to the coin cell without interruption. The datasheet specifies maximum LICELL voltage of 3.6 V and includes charge status monitoring via I²C registers, confirming continuous operation during transition.

What are the thermal resistance values for the MMPF0100F4AEPR2 package?

The MMPF0100F4AEPR2 in its 56-pin QFN 8×8 mm E-type package has RθJA = 28 °C/W (natural convection, 2-layer board), RθJB = 10 °C/W (junction-to-board), and RθJCBOTTOM = 1.2 °C/W (junction-to-case bottom). These values are specified in Table 6 of the datasheet and assume proper thermal via placement under the exposed pad (EP). For industrial designs, the datasheet recommends using a four-layer board (2s2p stackup) to achieve RθJA = 15 °C/W, which is critical for maintaining TJ ≤ 125 °C when delivering full 2.5 A from multiple buck channels simultaneously.