NXP Semiconductors MMPF0100F4ANES

Overview

MMPF0100F4ANES from NXP Semiconductors is a 14-channel configurable power management IC (PMIC) designed for i.MX 6-based embedded platforms. It integrates six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–VGEN6), coin-cell charger, RTC supply, DDR termination reference (VREFDDR), and I²C-controlled power sequencing. It operates from 2.8–4.5 V input and supports industrial temperature range (−40 °C to +105 °C) in a 56-pin QFN 8×8 mm package.

For engineers reviewing the MMPF0100F4ANES datasheet, MMPF0100F4ANES pinout, MMPF0100F4ANES application, or MMPF0100F4ANES equivalent, this page delivers verified specifications, validated pin functions, confirmed industrial-grade thermal performance, exact OTP configuration (F4), and real-world use cases in medical monitoring and home automation systems requiring robust, programmable multi-rail power delivery.

Technical Context

The MMPF0100F4ANES implements a hierarchical power tree with independent control logic for each regulator bank, enabling precise voltage sequencing, dynamic voltage scaling (DVS), and event-driven state transitions via its integrated initialization state machine. Its architecture includes dedicated analog feedback paths (e.g., SW1FB, SW2FB) and separate ground references (GNDREF, GNDREF1, SW1VSSSNS) to minimize noise coupling between high-current switchers and sensitive analog rails.

It features on-chip OTP memory pre-programmed with F4 configuration-optimized for i.MX 6SoloX applications-supporting fixed output voltages, startup timing, and power-on reset behavior without external firmware. The device uses dual clock domains (32 kHz RTC and 16 MHz system clock) and provides thermal interrupt reporting (THERM110I–THERM130I) with debounced shutdown at 130 °C junction temperature.

Key Specifications

Pinout & Package

Package: 56-pin QFN 8×8 mm, 0.5 mm pitch, wettable flank (WF-type), exposed thermal pad (EP).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with MMPF0100F4ANES, F6ANES offers higher core voltage and DDR3L support for upgraded i.MX 6SoloX designs, while F0ANES delivers 1.3 V core and triple-phase switching for quad-core i.MX 6 platforms - neither is pin-compatible nor functionally interchangeable without OTP and software revalidation.

Availability

MMPF0100F4ANES is available at Aetrix Electronics and suitable for medical monitoring devices, home energy management hubs, and industrial HMI panels requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MMPF0100F4ANES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.

The PF0100 product line was engineered specifically to deliver fully integrated, OTP-configurable power solutions for NXP's i.MX 6 family of application processors - reducing system complexity and accelerating time-to-market for embedded Linux and RTOS platforms.

FAQ

What is the OTP configuration of MMPF0100F4ANES and how does it affect system startup?

The MMPF0100F4ANES is factory-programmed with OTP configuration F4, which defines fixed output voltages, power-up sequencing order, timing delays, and reset behavior tailored for i.MX 6SoloX reference designs. This eliminates the need for external configuration firmware during boot. The F4 configuration sets VCOREDIG to 1.1 V, enables DDR termination tracking via VREFDDR, and configures SW2 for 2.0 A operation - all verified in the PF0100 datasheet Rev. 20 section 6.4.4. MMPF0100F4ANES executes this sequence autonomously upon power application.

Does MMPF0100F4ANES support coin-cell backup for RTC functionality?

Yes, MMPF0100F4ANES supports coin-cell backup through the LICELL pin, which connects to a rechargeable coin cell (e.g., CR2032) and provides regulated charging current and voltage clamping. It powers the VSNVS rail and RTC circuitry during main supply loss. The device includes dedicated charge control logic and low-quiescent-current LDO mode for VSNVS - documented in Section 6.4.7 of the PF0100 datasheet. MMPF0100F4ANES maintains RTC accuracy and register retention without external components.

What thermal protection features are implemented in MMPF0100F4ANES?

MMPF0100F4ANES integrates four thermal interrupt thresholds (110 °C, 120 °C, 125 °C, and 130 °C) that generate dedicated I²C interrupt flags (THERM110I–THERM130I). When crossed, these trigger host-processor alerts for proactive thermal management. At 130 °C, hardware shutdown activates after 8 ms debounce. Thermal sensing is die-localized and calibrated per unit. These features are active in all OTP configurations including MMPF0100F4ANES and detailed in Table 7 and Section 4.2.1 of the datasheet.

How does the VREFDDR function in MMPF0100F4ANES and what is its design purpose?

In MMPF0100F4ANES, VREFDDR is a precision analog output that tracks half the DDR supply voltage (VHALF) to serve as the termination reference for LPDDR2/LPDDR3 memory buses. It ensures impedance matching remains stable across voltage and temperature variations, minimizing signal reflections and timing skew. The VREFDDR rail is generated internally and buffered - no external components required. Its accuracy and tracking ratio are specified in Section 6.3.2 and electrical characteristics Table 13 of the PF0100 datasheet. MMPF0100F4ANES uses this feature to meet JEDEC DDR interface compliance without external resistive dividers.

Is MMPF0100F4ANES pin-compatible with other PF0100 variants like MMPF0100F0ANES or MMPF0100F6ANES?

No, MMPF0100F4ANES is not pin-compatible with MMPF0100F0ANES or MMPF0100F6ANES in terms of functional equivalence - though all share identical 56-pin QFN 8×8 mm mechanical packaging and pinout. Differences lie in OTP-programmed behavior: F4 configures VCOREDIG to 1.1 V and enables specific DDR timing, while F0 uses 1.3 V and F6 uses 1.2 V. Subsystem power states, current limits, and sequencing logic differ per OTP image. Therefore, direct substitution requires validation of voltage, timing, and thermal behavior - MMPF0100F4ANES must be used where F4-specific configuration is required.