NXP Semiconductors MMPF0100F9AZES
- Part No.:
- MMPF0100F9AZES
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0100F9AZES.pdf
- Description:
- IC REG CONV I.MX6 12OUT 56QFN
- Quantity:
- Payment:

- Shipping:

Inventory:688
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MMPF0100F9AZES from NXP Semiconductors is a 14-channel configurable power management IC (PMIC) designed for i.MX 6-based embedded platforms. It integrates six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–VGEN6), coin-cell charger, RTC supply, DDR termination reference (VREFDDR), and I²C-controlled programmable sequencing - delivering full-system power for industrial automation, medical monitoring, and home energy management applications.
For engineers reviewing the MMPF0100F9AZES datasheet, MMPF0100F9AZES pinout, MMPF0100F9AZES application, or MMPF0100F9AZES equivalent, this page provides verified technical context, exact pin functions per QFN-56 8×8 mm package, confirmed OTP-programmable startup sequences, thermal protection thresholds up to 130 °C, and validated alternatives for industrial-grade PMIC replacement in extended-temperature designs.
Technical Context
The MMPF0100F9AZES implements a multi-rail power architecture with independent control of six buck regulators (SW1A/B/C, SW2, SW3A/B, SW4), each supporting programmable voltage, timing, and enable/disable states via I²C register map. Its on-chip OTP memory stores boot configuration including power-up sequence, voltage targets, and fault response behavior - eliminating external configuration components.
It features dedicated analog blocks: VREFDDR reference generator with VINREFDDR input and VHALF half-supply bias; VSNVS LDO/switch with 3.6 V output and enhanced current limit in industrial variants; and integrated coin-cell charging circuitry (LICELL pin) with charge control logic tied to RTC domain. All regulators support DVS control and thermal interrupt reporting (THERM110I–THERM130I).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VIN: 2.8–4.5 V DC - supports single-cell Li-ion or regulated 3.3 V system rail |
| Buck Regulator Count | 6 channels (SW1A/B/C, SW2, SW3A/B, SW4) - enables full SoC + memory + peripheral power tree |
| LDO Count & Output Current | 6 general-purpose LDOs: VGEN1 (100 mA), VGEN2 (250 mA), VGEN3 (100 mA), VGEN4 (350 mA), VGEN5 (100 mA), VGEN6 (200 mA) |
| OTP Memory | On-chip one-time programmable memory - stores boot configuration, sequencing, and voltage settings without external EEPROM |
| Thermal Protection | Four interrupt-enabled thresholds: 110 °C, 120 °C, 125 °C, 130 °C - triggers shutdown with 8 ms debounce |
| Ambient Temperature Range | −40 °C to +105 °C - qualified for extended industrial operation (ANES suffix) |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) compatible - supports dynamic reconfiguration and status polling |
Pinout & Package
Package: 56-pin QFN, 8 mm × 8 mm, 0.5 mm pitch, wettable flank (WF-type), exposed thermal pad (EP).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB | Open-drain interrupt output | Signals processor on fault events (thermal, overcurrent, POR timeout) - requires external pull-up |
| SDWNB | Open-drain shutdown warning | Asserts before forced shutdown due to thermal overload - allows graceful system save |
| RESETBMCU | Open-drain reset output | Drives MCU reset line low during brown-out or critical fault - configurable as power-good indicator |
| STANDBY | Digital input | Processor-initiated entry into low-power standby mode - disables non-essential rails while retaining VSNVS and RTC |
| SCL / SDA | I²C bus interface | Configurable control and monitoring interface - supports readback of thermal, voltage, and status registers |
| VIN | Main power input | Primary 2.8–4.5 V supply for all internal regulators - bypassed with ≥4.7 μF ceramic capacitor |
| EP | Exposed thermal pad | Ground return path for buck regulators - must be connected to inner/outer ground planes via multiple vias for thermal dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Buck Topology | SW1A/B supports dual-phase or parallel operation - improves transient response and reduces output ripple for core supplies |
| DDR Termination Reference | VREFDDR output tracks half-supply (VHALF) - enables precise DDR3/DDR4 termination voltage matching across temperature |
| Industrial OTP Variant | F9 programming code - pre-configured for i.MX 6SoloX and extended-temp industrial use with SW2 rated at 2.5 A |
| VSNVS LDO/switch | 3.6 V output with configurable current limit - powers always-on domains including real-time clock and backup registers |
| Integrated Coin-Cell Charger | LICELL pin supports trickle-charge mode - maintains RTC and SRAM retention during main power loss |
Applications
| Medical Monitoring Device | Industrial Control Panel |
|---|---|
Use Scenario: Portable ECG monitor with i.MX 6SoloLite SoC, OLED display, and wireless BLE module requiring stable multi-rail power under battery and AC adapter operation. IC Role / Device Role / Timing Role: MMPF0100F9AZES delivers VCOREDIG (1.5 V), VGEN4 (3.3 V for BLE), VREFDDR (1.5 V for DDR3), and VSNVS (3.6 V for RTC/SRAM retention) with synchronized startup sequencing. Use Value: Eliminates discrete LDOs and sequencers; OTP-programmed F9 variant ensures repeatable boot behavior across production units without firmware dependency. | Use Scenario: DIN-rail mounted PLC HMI with i.MX 6QuadPlus, capacitive touchscreen, CAN interface, and isolated I/O - operating continuously at 85 °C ambient. IC Role / Device Role / Timing Role: MMPF0100F9AZES powers processor cores (SW1A/B/C), DDR3 memory (VREFDDR + SW2), peripherals (VGEN2/VGEN4), and backup domain (VSNVS + LICELL) with thermal interrupts routed to watchdog controller. Use Value: −40 °C to +105 °C qualification and SW2 2.5 A capability (per Note 4) ensure reliable operation in uncooled enclosures; wettable flank QFN aids automated optical inspection. |
| Home Energy Gateway | Factory Automation Sensor Hub |
Use Scenario: Smart metering gateway aggregating Zigbee, Z-Wave, and Ethernet data - powered by solar-charged LiFePO₄ battery with 3.6 V nominal output. IC Role / Device Role / Timing Role: MMPF0100F9AZES regulates VIN (3.0–4.2 V) to generate VCORE (1.2 V), VGEN1 (2.5 V for sensors), VGEN5 (3.3 V for radio), and charges backup coin cell via LICELL during mains availability. Use Value: Integrated coin-cell charger and VSNVS LDO maintain timekeeping and configuration during grid outages; I²C allows runtime adjustment of rail voltages for power optimization. | Use Scenario: IP67-rated wireless vibration sensor node using i.MX 6ULL, MEMS accelerometer, LoRa transceiver, and supercapacitor backup - deployed in high-EMI factory environments. IC Role / Device Role / Timing Role: MMPF0100F9AZES supplies VCOREDIG (1.5 V), VGEN2 (2.5 V for ADC), VGEN6 (3.3 V for LoRa), and VREFDDR (1.5 V for internal memory) with ESD-hardened pins (±2000 V HBM). Use Value: QFN-56 WF package with wettable flanks ensures solder joint reliability under thermal cycling; programmable sequencing prevents supply contention during cold start from supercap. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMPF0100F6ANES | Same package and OTP architecture; F6 variant configured for i.MX 6SX with different VGENx voltage setpoints and SW2 current limit (2.0 A default) | Targeted for i.MX 6SoloX reference designs (MCIMX6SX-SDB); lacks SW2 2.5 A rating enabled in F9 | Select F6 only if i.MX 6SX compatibility and lower SW2 load current are sufficient |
| PF0100A | Revised silicon revision (SILICON REV = 0x21); fixes errata ER19/ER20/ER22; higher VSNVS current limit; no XOR-based POR fuse logic | Pin-compatible upgrade path; requires updated OTP programming flow and validation of thermal interrupt behavior | Choose PF0100A for new designs requiring errata fixes and improved robustness; not drop-in for legacy F9 firmware |
Compared with MMPF0100F9AZES, MMPF0100F6ANES offers identical industrial temperature range but reduced SW2 capability and different reference design alignment, while PF0100A delivers errata-corrected silicon with enhanced VSNVS drive and simplified OTP programming - both require validation of OTP configuration and thermal interrupt handling in target systems.
Availability
MMPF0100F9AZES is available at Aetrix Electronics and suitable for industrial control panels, medical monitoring devices, home energy gateways, and factory automation sensor hubs requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MMPF0100F9AZES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The PF0100 product line delivers highly configurable, OTP-programmable PMICs optimized for NXP's i.MX application processors - enabling compact, low-BOM-count power architectures for cost-sensitive and thermally constrained embedded systems.
FAQ
What is the operating temperature range for the MMPF0100F9AZES?
The MMPF0100F9AZES is qualified for extended industrial operation from −40 °C to +105 °C ambient temperature. This rating is enabled by its ANES suffix (WF-type QFN package) and F9 OTP configuration, which includes thermal protection thresholds up to 130 °C and SW2 current capability of 2.5 A - verified per Note 4 in the official NXP orderable parts table.
Does the MMPF0100F9AZES support DDR memory termination?
Yes, the MMPF0100F9AZES provides a dedicated DDR termination reference via the VREFDDR output, which tracks half-supply (VHALF) with tight regulation. The VREFDDR pin delivers a stable 1.5 V reference for DDR3/DDR4 memory interfaces, with input supplied through VINREFDDR and bias provided by VHALF - all confirmed in the functional block diagram and pin definitions section of the datasheet.
How is the MMPF0100F9AZES programmed for custom power sequencing?
The MMPF0100F9AZES uses on-chip OTP memory to store power sequencing parameters. Programming is performed once using NXP's recommended tools and fuse map (Table 10 in the datasheet). The F9 variant comes pre-programmed for i.MX 6SoloX industrial use, but non-programmed versions (NP) allow full customization of voltage targets, ramp rates, and inter-rail timing dependencies via I²C register writes prior to OTP lock.
What is the function of the LICELL pin on the MMPF0100F9AZES?
The LICELL pin on the MMPF0100F9AZES serves as a bidirectional coin-cell interface: it accepts 0–3.6 V input from a backup battery and provides regulated trickle-charge current to maintain RTC operation and SRAM retention during main power loss. Its behavior is controlled by OTP-configured charge parameters and monitored via I²C registers - explicitly defined in Section 6.4.7 and Table 4 of the datasheet.
Is the MMPF0100F9AZES pin-compatible with other PF0100 variants?
Yes, all PF0100 variants - including MMPF0100F9AZES - share identical 56-pin QFN 8×8 mm mechanical packaging and pinout. The F9, F6, FC, and NP versions differ only in OTP content and qualification grade (ANES vs AEP), not physical layout or electrical pin functions. This allows hardware reuse across designs targeting different i.MX processors or temperature grades.
MMPF0100F9AZES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 12
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MMPF0100F9AZES FAQ
1.How can I place an order for MMPF0100F9AZES through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0100F9AZES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0100F9AZES reliable?
The price and inventory of MMPF0100F9AZES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0100F9AZES is usually 5 days.
3.What payment methods are accepted for MMPF0100F9AZES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0100F9AZES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0100F9AZES?
MMPF0100F9AZES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0100F9AZES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0100F9AZES?
For technical support, including MMPF0100F9AZES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0100F9AZES requirements.
6.How does Aetrix verify that MMPF0100F9AZES is sourced from the original manufacturer or authorized distributors?
All MMPF0100F9AZES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0100F9AZES meets industry standards.
7.What is the process for return or replacement of MMPF0100F9AZES?
All MMPF0100F9AZES units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0100F9AZES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0100F9AZES part is unused and in its original packaging.
Return procedure for MMPF0100F9AZES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MMPF0100F9AZES Tags

-
TPS51206DSQR
Texas Instruments

-
TPS51200DRCR
Texas Instruments

-
TPS51200DRCT
Texas Instruments

-
TPS62740DSSR
Texas Instruments

-
TPS51100DGQR
Texas Instruments
-
NCP51200MNTXG
onsemi
-
NCP51400MNTXG
onsemi

-
RT9026GSP
Richtek USA Inc.

-
LP2998MRX/NOPB
Texas Instruments

-
TPS51200QDRCRQ1
Texas Instruments

-
DPA423GN-TL
Power Integrations

-
LM10011SD/NOPB
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

