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NXP Semiconductors MMPF0100FAAZES
- Part No.:
- MMPF0100FAAZES
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0100FAAZES.pdf
- Description:
- IC REG CONV I.MX6 12OUT 56QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,838
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Product details
Overview
MMPF0100FAAZES from NXP Semiconductors is a 14-channel configurable power management IC (PMIC) designed for i.MX 6-based embedded platforms. It integrates six buck converters (up to 2.5 A per channel), six LDOs, RTC supply, coin-cell charger, DDR termination reference (VREFDDR), and I²C programmable control logic - delivering full-system power for processors, memory, and peripherals in industrial automation and medical monitoring applications.
For engineers reviewing the MMPF0100FAAZES datasheet, MMPF0100FAAZES pinout, MMPF0100FAAZES application, or MMPF0100FAAZES equivalent, key selection criteria include its -40 °C to 105 °C extended industrial temperature rating, OTP-configurable power sequencing, VSNVS LDO/switch capability, SW2 2.5 A current limit (enabled in ANES variants), and QFN56 8×8 mm wettable flank package with exposed thermal pad.
Technical Context
The MMPF0100FAAZES implements a hierarchical power tree with independent state machine control for startup, standby, and dynamic voltage scaling (DVS). Its architecture supports single/dual-phase buck configurations, DDR termination tracking mode, and boost regulator output up to 5.0 V - all coordinated via I²C register map and OTP-programmed initialization sequences.
Control logic includes processor interface signals (PWRON, STANDBY, RESETBMCU, SDWNB), interrupt-driven event detection (INTB), and thermal monitoring with four thresholds (110 °C–130 °C). The device uses internal 32 kHz and 16 MHz clocks, trim-in-package references, and dedicated ground planes (GNDREF, GNDREF1, SWxVSSSNS) to maintain regulation accuracy under load transients.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temp | -40 °C to +105 °C - qualified for extended industrial environments including factory automation and medical monitoring equipment. |
| Buck Converters | Up to 6 channels; SW1A/B/C, SW2, SW3A/B, SW4 - configurable as single/dual-phase with 2.5 A max on SW1A/B/SW2 (ANES variants). |
| LDO Regulators | 6 general-purpose LDOs (VGEN1–VGEN6); outputs range 1.0–3.6 V with 100–350 mA current capability and programmable enable/sequencing. |
| VREFDDR | DDR termination reference output; tracks half-supply (VHALF) with ±1% accuracy - enables precise DDR3/DDR4 memory interface biasing. |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz); fixed slave address 0x08 - supports real-time configuration, status readback, and interrupt handling. |
| OTP Memory | One-time programmable nonvolatile memory - stores boot configuration, voltage levels, sequencing order, and timing delays for deterministic power-up without host intervention. |
| Coin-Cell Support | LICELL pin provides bidirectional coin-cell charging and backup for RTC supply (VSNVS) - maintains timekeeping during main power loss. |
Pinout & Package
Package: 56-pin QFN, 8 mm × 8 mm, 0.5 mm pitch, wettable flank (WF-type), exposed thermal pad (EP) - optimized for thermal dissipation in high-power industrial designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1A/B/CIN, SW2IN, SW3A/BIN, SW4IN, SWBSTIN | Main input supply connections | Accept 2.8–4.5 V input; require local 4.7 μF + 0.1 μF ceramic decoupling for stable switching operation. |
| SW1A/B/CLX, SW2LX, SW3A/BLX, SW4LX, SWBSTLX | Switch node outputs | High-frequency PWM nodes driving external inductors; must be routed with minimal loop area and isolated from sensitive analog traces. |
| SW1A/B/CFB, SW2FB, SW3A/BFB, SW4FB, SWBSTFB | Voltage feedback inputs | Resistive divider connections for output regulation; require Kelvin routing directly to output capacitors to reject PCB IR drop. |
| VGEN1–VGEN6, VCORE, VCOREDIG, VREFDDR, VSNVS | Regulated power outputs | Analog/digital core, peripheral, and memory rails; each requires specified output capacitance (e.g., VGEN2: 4.7 μF ceramic) for stability. |
| SCL, SDA, PWRON, STANDBY, INTB, RESETBMCU, SDWNB | Digital control & status | Open-drain I²C and control signals; require pull-up resistors (typically 2.2–10 kΩ) to VDDIO (1.8–3.3 V). |
| GNDREF, GNDREF1, SW1VSSSNS, SW3VSSSNS, EP | Ground references | Dedicated low-impedance return paths for analog regulators, switching stages, and thermal conduction - must connect to solid inner/outer ground planes via multiple vias. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Buck Topology | Supports single/dual-phase and parallel operation across SW1A/B/C, SW2, SW3A/B - enables flexible trade-offs between efficiency, ripple, and component count for multi-rail systems. |
| DDR Termination Tracking | VREFDDR dynamically tracks VHALF with <±1% error - eliminates need for external resistor dividers and ensures accurate DDR memory VTT bias over temperature and voltage variation. |
| VSNVS Dual-Mode Output | Programmable LDO or coin-cell switch output (3.0–3.6 V); supplies always-on domain for real-time clock and system wake logic during deep sleep states. |
| Thermal Protection | Four independent interrupt thresholds (110/120/125/130 °C); debounced 8 ms shutdown - provides fail-safe die temperature limiting without requiring external sensors or firmware polling. |
| OTP-Based Sequencing | Nonvolatile storage of power-up/down timing, voltage levels, and dependency graphs - guarantees repeatable, glitch-free boot across power cycles without host CPU involvement. |
Applications
| Industrial Control Gateway | Medical Vital Signs Monitor |
|---|---|
Use Scenario: Powering ARM-based controller (e.g., i.MX 6SoloX) managing PLC I/O, CAN bus, Ethernet, and HMI display in factory-floor gateways. IC Role / Device Role / Timing Role: Central PMIC providing sequenced 1.2 V core, 3.3 V I/O, 1.5 V DDR, 5.0 V USB, and VREFDDR for memory interface - synchronized to processor reset and standby signals. Use Value: Reduces external component count by integrating six bucks, six LDOs, and DDR reference - simplifies layout while meeting IEC 61000-4-2 ESD (±2 kV HBM) and extended temp requirements. | Use Scenario: Supplying multi-sensor patient monitor with ECG, SpO₂, NIBP, and touchscreen UI operating continuously in clinical environments. IC Role / Device Role / Timing Role: Delivers ultra-low-noise analog rails (VGEN1/VGEN2 for ADC front-end), battery-backed VSNVS for RTC, and programmable sequencing to isolate fault domains during alarm events. Use Value: Enables >10-year coin-cell backup via LICELL charging circuit and maintains sub-1% VREFDDR accuracy across -40 °C to +105 °C - critical for regulatory compliance (IEC 60601-1). |
| Home Energy Management Hub | Automotive Infotainment Head Unit |
Use Scenario: Powering smart meter gateway aggregating Zigbee, Wi-Fi, and cellular data with local energy analytics processing. IC Role / Device Role / Timing Role: Manages dual-core application processor, LPDDR2 memory, RF transceivers, and isolated sensor interfaces using OTP-configured low-power modes and DVS control. Use Value: Achieves <50 μA quiescent current in standby via individually programmable ON/OFF/standby states - extends battery life during grid outages. | Use Scenario: Supporting i.MX 6Quad-based head unit with HDMI, MIPI-DSI, audio codec, GPS, and rear-seat entertainment in passenger vehicles. IC Role / Device Role / Timing Role: Supplies VCORE (1.2 V), VCOREDIG (1.5 V), VGEN4 (3.3 V for USB), SWBST (5.0 V for HDMI PHY), and VREFDDR (for DDR3L) with automotive-grade thermal margin. Use Value: SW2 2.5 A capability (enabled in FA variant) powers high-current GPU domain; wettable flank QFN aids automated optical inspection (AOI) in automotive manufacturing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPQ4436-AEC1 | Single 3A buck with integrated MOSFETs; no LDOs, no OTP, no DDR reference - requires external sequencing logic. | Targeted at simpler MCU-based automotive body electronics, not full SoC power delivery. | Select when only one high-current rail is needed and cost-sensitive BOM reduction outweighs configurability. |
| TPS659122 | TI PMIC with 4 bucks, 6 LDOs, I²C, but no coin-cell charger, no VREFDDR, and -40 °C to 85 °C rating only. | Valid for consumer tablets and IPTV, but lacks extended temp and DDR-specific features required for industrial medical use. | Choose for legacy i.MX 53 designs where footprint compatibility and TI ecosystem support are prioritized. |
Compared with MPQ4436-AEC1 and TPS659122, the MMPF0100FAAZES uniquely combines extended temperature operation, DDR termination tracking, coin-cell charging, and OTP-based full-system sequencing - making it irreplaceable for new i.MX 6-based industrial and medical platforms requiring guaranteed boot behavior and long-term reliability.
Availability
MMPF0100FAAZES is available at Aetrix Electronics and suitable for industrial control gateways, medical vital signs monitors, and home energy management hubs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MMPF0100FAAZES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The PF0100 product line was engineered specifically to deliver fully integrated, OTP-configurable power management for NXP's i.MX application processors - enabling robust, low-risk platform design with minimal external components and deterministic power sequencing.
FAQ
What is the maximum output current capability of SW2 on the MMPF0100FAAZES?
The MMPF0100FAAZES supports a 2.5 A output current rating on SW2, but only in NP, F9, and FA Industrial versions (ANES suffix) when the SW2ILIM configuration bit is set to 0. This capability is explicitly documented in Note 4 of the Orderable Parts table and distinguishes the FA variant from consumer-grade AEP versions limited to 2.0 A. Always verify SW2ILIM register setting during OTP programming.
Does the MMPF0100FAAZES include built-in DDR termination reference functionality?
Yes, the MMPF0100FAAZES integrates a dedicated VREFDDR regulator that tracks half-supply (VHALF) with ±1% accuracy - essential for DDR3/DDR4 memory interface biasing. This eliminates external resistor dividers and ensures stable termination voltage across temperature and input variation, as confirmed in Section 6.3.2 and Figure 2 of the datasheet.
How does the OTP memory in the MMPF0100FAAZES affect system startup behavior?
The OTP memory in the MMPF0100FAAZES stores immutable power-up configuration including voltage levels, sequencing order, timing delays, and dependency graphs. This enables autonomous, repeatable boot without host CPU intervention - critical for fail-safe industrial systems. Configuration is loaded at power-on-reset, and changes require physical reprogramming via VDDOTP pin, as detailed in Sections 6.1.2–6.1.5.
What thermal protection features are implemented in the MMPF0100FAAZES?
The MMPF0100FAAZES includes four programmable thermal interrupt thresholds (110 °C, 120 °C, 125 °C, 130 °C) monitored by an internal comparator. Crossing any threshold generates corresponding interrupts (THERM110I–THERM130I), and sustained exceedance triggers 8 ms debounced shutdown. Junction temperature is readable via INTSENSE0 register bits, per Section 4.2.1 and Table 7.
Is the MMPF0100FAAZES pin-compatible with other PF0100 variants such as MMPF0100F0AEP?
No, the MMPF0100FAAZES is not pin-compatible with consumer-grade AEP variants like MMPF0100F0AEP. While both share the same 56-pin QFN footprint, the FA variant uses WF-type (wettable flank) packaging with different solder mask and thermal pad requirements, and its extended temperature qualification (-40 °C to 105 °C) mandates distinct board-level thermal design - as defined in Table 1 and Section 8.1 of the datasheet.
MMPF0100FAAZES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 12
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MMPF0100FAAZES FAQ
1.How can I place an order for MMPF0100FAAZES through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0100FAAZES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0100FAAZES reliable?
The price and inventory of MMPF0100FAAZES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0100FAAZES is usually 5 days.
3.What payment methods are accepted for MMPF0100FAAZES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0100FAAZES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0100FAAZES?
MMPF0100FAAZES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0100FAAZES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0100FAAZES?
For technical support, including MMPF0100FAAZES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0100FAAZES requirements.
6.How does Aetrix verify that MMPF0100FAAZES is sourced from the original manufacturer or authorized distributors?
All MMPF0100FAAZES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0100FAAZES meets industry standards.
7.What is the process for return or replacement of MMPF0100FAAZES?
All MMPF0100FAAZES units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0100FAAZES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0100FAAZES part is unused and in its original packaging.
Return procedure for MMPF0100FAAZES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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