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NXP Semiconductors MMPF0100FAAZESR2

Part No.:
MMPF0100FAAZESR2
Manufacturer:
NXP Semiconductors
Category:
Special Purpose Regulators
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMMPF0100FAAZESR2.pdf
Description:
IC REG CONV I.MX6 12OUT 56QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,611

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Product details

Overview

MMPF0100FAAZESR2 from NXP Semiconductors is a 14-channel configurable power management IC (PMIC) designed for i.MX 6-based embedded platforms. It integrates six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–VGEN6), coin-cell charger, RTC supply, DDR termination reference (VREFDDR), and I²C programmable control logic. It delivers up to 2.5 A per high-current buck channel and supports industrial temperature operation (−40 °C to +105 °C) in a 56-pin QFN 8×8 mm package.

For engineers reviewing the MMPF0100FAAZESR2 datasheet, MMPF0100FAAZESR2 pinout, MMPF0100FAAZESR2 application, or MMPF0100FAAZESR2 equivalent, key selection criteria include OTP-programmable power sequencing, VSNVS LDO/switch capability, DDR memory interface support via VREFDDR tracking, and compatibility with i.MX 6SoloX and i.MX 6SL reference designs.

Technical Context

The MMPF0100FAAZESR2 implements a hierarchical power tree with independent state machine control for startup, standby, and shutdown sequences. Its architecture includes dual-phase and parallel configurations for buck regulators SW1A/B and SW3A/B, DDR termination tracking mode tied to VHALF and VINREFDDR inputs, and integrated bias generation for VCOREDIG (1.5 V), VCOREREF (1.5 V), and VSNVS outputs.

Control is executed via an I²C interface (SCL/SDA) with device ID 0x08, supporting register-level configuration of output voltages, timing delays, and interrupt masking. The on-chip OTP memory enables factory- or field-programmed configurations without external firmware, and thermal protection triggers interrupts at 110 °C, 120 °C, 125 °C, and 130 °C with 8 ms debounce.

Key Specifications

ParameterValue and Actual Design Meaning
Main input voltageVIN = 2.8–4.5 V DC; powers all internal regulators and switching stages
SW1A/B max output current2.5 A per channel; supports dual-phase operation for higher efficiency in processor core rails
VGEN2 output current250 mA; supplies audio codec or sensor interfaces with low-noise LDO regulation
VREFDDR accuracy±1.5% over temperature; provides precise DDR memory termination voltage tracking
OTP memoryOne-time programmable configuration storage; enables fixed boot sequence and voltage settings without host intervention
Operating temperature−40 °C to +105 °C; qualified for extended industrial applications per ANES suffix
I²C address0x08 (7-bit); allows multi-device bus sharing with configurable SDA/SCL pull-up requirements

Pinout & Package

Package: 56-pin QFN, 8 mm × 8 mm, 0.5 mm pitch, wettable flank (WF-type), exposed thermal pad (EP).

Pin/TerminalCircuit RoleDesign Meaning
SW1ALX / SW1BLX / SW1CLXBuck switch node outputsHigh-frequency switching nodes for SW1A/B/C; require tight layout with low-inductance paths to external inductors
VREFDDR / VINREFDDR / VHALFDDR termination reference subsystemVREFDDR delivers regulated DDR VTT; VINREFDDR accepts DDR supply input; VHALF sets half-supply reference for tracking
VSNVSAlways-on LDO/switch outputSupplies real-time clock and backup domain; supports coin-cell charging via LICELL pin
SCL / SDA / VDDIOI²C interfaceStandard open-drain I²C bus; VDDIO powers I/O buffers independently (3.6 V max)
INTB / SDWNB / RESETBMCUSystem control signalingINTB signals fault/events; SDWNB warns of imminent shutdown; RESETBMCU resets MCU or acts as power-good indicator

Key Features

FeatureDesign Value
Configurable buck topologySW1A/B/C and SW3A/B support single/dual-phase or parallel modes - enabling optimized efficiency across load ranges for CPU/GPU cores
DDR termination trackingVREFDDR dynamically tracks half of VINREFDDR - ensuring accurate DDR memory termination under varying supply conditions
Integrated coin-cell managementLICELL and VSNVS pins enable automatic charging and switchover - maintaining RTC and backup registers during main power loss
Programmable sequencingOTP-configurable power-up/down order and delay timing - eliminates need for external sequencers in i.MX 6 platform designs
Thermal fault detectionFour independent thermal interrupt thresholds (110/120/125/130 °C) with debounced shutdown - provides fail-safe protection without false triggers

Applications

i.MX 6SoloX Industrial GatewayMedical Patient Monitor

Use Scenario: Powering i.MX 6SX SoC, DDR3L memory, Ethernet PHY, and CAN transceivers in a fanless industrial gateway operating continuously at 60 °C ambient.

IC Role / Device Role / Timing Role: Central PMIC managing 14-rail sequencing, DDR termination, RTC backup, and thermal monitoring with no external sequencer or supervisor.

Use Value: Reduces BOM count by integrating six bucks, six LDOs, and DDR reference - while OTP programming ensures repeatable startup behavior across production units.

Use Scenario: Supplying critical subsystems in a portable patient monitor requiring continuous RTC operation, low-noise analog rails, and fail-safe shutdown during overtemperature events.

IC Role / Device Role / Timing Role: Primary power controller delivering VGEN2 (250 mA for ECG front-end), VGEN4 (350 mA for display), and VSNVS (RTC backup) with <100 ms fault response.

Use Value: Enables battery-backed operation via LICELL charging and guarantees safe shutdown before junction exceeds 125 °C - meeting IEC 60601-1 thermal safety requirements.

Home Energy Management HubFactory Automation Controller

Use Scenario: Powering ARM-based controller, Zigbee/Wi-Fi modules, and isolated I/O in a DIN-rail mounted energy meter with wide temperature swing (−25 °C to +70 °C).

IC Role / Device Role / Timing Role: Configurable PMIC supplying VGEN1 (100 mA for sensors), SW4 (1 A for communication module), and VREFDDR (for optional DDR-based logging buffer).

Use Value: Supports flexible rail assignment via OTP - allowing one hardware design to serve multiple regional variants without PCB change.

Use Scenario: Controlling power to PLC I/O modules, FPGA configuration, and isolated RS-485 transceivers in a high-vibration manufacturing cell environment.

IC Role / Device Role / Timing Role: Robust PMIC delivering SW2 (2 A for FPGA core), VGEN6 (200 mA for ADC reference), and STANDBY-controlled deep-sleep mode.

Use Value: Withstands 105 °C ambient via RθJB = 10 °C/W and EP thermal pad - eliminating need for heatsinks in compact enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MMPF0100F6ANESSame package and OTP-programmed for i.MX 6SX-SDB; lacks FA-specific VSNVS current limit tuningTargeted for evaluation boards; not pre-configured for extended industrial thermal profilesSelect F6ANES only for prototyping with i.MX 6SX; FAANES offers validated 105 °C operation and optimized VSNVS behavior
PF8100A00000000Monolithic 12-channel PMIC with lower quiescent current (15 μA vs. 45 μA); no coin-cell charger or VREFDDRDesigned for ultra-low-power IoT edge nodes - not suitable for DDR-memory-based systemsChoose PF8100A only when DDR termination and RTC backup are unnecessary and standby current is critical

Compared with MMPF0100F6ANES and PF8100A00000000, MMPF0100FAAZESR2 uniquely combines industrial-temperature qualification, DDR termination tracking, and integrated coin-cell charging - making it the sole option for production i.MX 6-based medical and industrial controllers requiring full-feature power management.

Availability

MMPF0100FAAZESR2 is available at Aetrix Electronics and suitable for i.MX 6-based industrial gateways, medical patient monitors, home energy hubs, and factory automation controllers requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MMPF0100FAAZESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based microcontrollers and power management.

The PF0100 product line was engineered specifically to deliver complete, configurable power solutions for NXP's i.MX application processors - reducing system complexity through integrated sequencing, DDR support, and OTP customization.

FAQ

What is the maximum output current capability of the SW2 regulator in MMPF0100FAAZESR2?

The SW2 regulator in MMPF0100FAAZESR2 supports up to 2.5 A output current, but only in NP, F9, and FA industrial versions (ANES suffix) when SW2ILIM=0 is configured in OTP. This rating is validated per Table 1 Note 4 and applies under full thermal derating at 105 °C ambient. The MMPF0100FAAZESR2 part uses the FA OTP configuration and ANES package, satisfying both conditions.

Does MMPF0100FAAZESR2 include built-in DDR termination voltage generation?

Yes, MMPF0100FAAZESR2 integrates a dedicated DDR termination reference block with VREFDDR output, VINREFDDR input, and VHALF half-supply reference. It supports DDR3/DDR3L termination tracking with ±1.5% accuracy over temperature and load, as specified in Section 6.3.2 and Figure 2 of the datasheet.

How is the OTP memory programmed in MMPF0100FAAZESR2, and what configuration does the 'FA' code indicate?

The 'FA' OTP code in MMPF0100FAAZESR2 indicates a factory-programmed configuration optimized for i.MX 6SoloLite and i.MX 6SoloX platforms, including specific voltage levels, sequencing order, and timing for VCOREDIG, VGEN rails, and DDR termination. Programming occurs during wafer test using VDDOTP (pin 47) at up to 10 V; the FA variant is shipped pre-programmed and requires no field programming.

What thermal protection features are implemented in MMPF0100FAAZESR2?

MMPF0100FAAZESR2 implements four thermal interrupt thresholds (THERM110I, THERM120I, THERM125I, THERM130I) with 8 ms debounce, and automatic shutdown above the thermal protection threshold. These are monitored via INTSENSE0 register bits and trigger INTB assertion. The device is rated for TJ ≤ 125 °C and includes RθJB = 10 °C/W and EP thermal pad for effective heat dissipation.

Is MMPF0100FAAZESR2 compatible with i.MX 6QuadPlus processors?

Yes, MMPF0100FAAZESR2 is compatible with i.MX 6QuadPlus processors, though it is not pre-configured for that SoC out-of-box. The FA OTP variant targets i.MX 6SoloX and i.MX 6SoloLite; for i.MX 6QuadPlus, NXP recommends MMPF0100F0AEP or MMPF0100F0ANES. However, MMPF0100FAAZESR2 can be reprogrammed via I²C or custom OTP to match QuadPlus voltage and sequencing requirements.

MMPF0100FAAZESR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Converter, i.MX6
Voltage - Input:
2.8V ~ 4.5V
Number of Outputs:
12
Voltage - Output:
Multiple
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-QFN-EP (8x8)

MMPF0100FAAZESR2 FAQ

1.How can I place an order for MMPF0100FAAZESR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MMPF0100FAAZESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MMPF0100FAAZESR2 reliable?

The price and inventory of MMPF0100FAAZESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0100FAAZESR2 is usually 5 days.

3.What payment methods are accepted for MMPF0100FAAZESR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0100FAAZESR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MMPF0100FAAZESR2?

MMPF0100FAAZESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MMPF0100FAAZESR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MMPF0100FAAZESR2?

For technical support, including MMPF0100FAAZESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0100FAAZESR2 requirements.

6.How does Aetrix verify that MMPF0100FAAZESR2 is sourced from the original manufacturer or authorized distributors?

All MMPF0100FAAZESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0100FAAZESR2 meets industry standards.

7.What is the process for return or replacement of MMPF0100FAAZESR2?

All MMPF0100FAAZESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0100FAAZESR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MMPF0100FAAZESR2 part is unused and in its original packaging.

Return procedure for MMPF0100FAAZESR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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