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NXP Semiconductors MMPF0100NPANESR2
- Part No.:
- MMPF0100NPANESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0100NPANESR2.pdf
- Description:
- IC REG CONV I.MX6 12OUT 56QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,193
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Product details
Overview
MMPF0100NPANESR2 from NXP Semiconductors is a 14-channel configurable power management IC (PMIC) designed for i.MX 6-based embedded platforms. It integrates up to six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–6), RTC supply, coin-cell charger, DDR termination reference (VREFDDR), and I²C-controlled power sequencing. It operates from 2.8–4.5 V input and supports industrial temperature range (−40 °C to +105 °C).
For engineers reviewing the MMPF0100NPANESR2 datasheet, MMPF0100NPANESR2 pinout, MMPF0100NPANESR2 application, or MMPF0100NPANESR2 equivalent, this page delivers verified technical context, exact pin functions per QFN-56 package, real-world use cases in medical monitoring and factory automation, and two validated alternative PMICs with documented functional differences.
Technical Context
The MMPF0100NPANESR2 implements a hierarchical power tree with programmable startup sequencing, dynamic voltage scaling (DVS) control, and OTP-configurable regulator enable states, timing, and output voltages. Its internal block includes dedicated bias/reference generation (VCOREDIG at 1.5 V, VCOREREF at 1.5 V, VHALF for DDR tracking), thermal monitoring with four interrupt thresholds (110°C–130°C), and fail-safe thermal shutdown.
It features dual-phase or parallel operation capability on SW1A/B and SW3A/B, DDR termination tracking mode via VREFDDR (0.6–0.9 V), and a 600 mA boost regulator (SWBST) delivering 5.0 V. Control is exclusively via I²C (SCL/SDA, 3.6 V tolerant), with interrupt-driven event handling (INTB) and processor interface signals (PWRON, STANDBY, RESETBMCU, SDWNB).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V - powers entire system from single Li-ion or regulated DC source |
| Buck Regulators | 6 channels: SW1A/B (2.5 A each), SW1C (2 A), SW2 (2 A), SW3A/B (2.5 A each), SW4 (1 A) - supports multi-rail SoC core/peripheral rail requirements |
| LDO Regulators | 6 channels: VGEN1 (100 mA), VGEN2 (250 mA), VGEN3 (100 mA), VGEN4 (350 mA), VGEN5 (100 mA), VGEN6 (200 mA) - low-noise analog/IO supplies |
| VREFDDR Output | 0.6 V to 0.9 V - programmable DDR memory termination reference with tracking capability |
| Operating Temperature | −40 °C to +105 °C - qualified for extended industrial applications (ANES suffix) |
| Package | 56-pin QFN, 8 mm × 8 mm, 0.5 mm pitch, wettable flank (WF-type) - enables automated optical inspection and robust solder joint reliability |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) compatible - allows host processor configuration and real-time status monitoring |
Pinout & Package
Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch, WF-type with wettable flanks), exposed thermal pad (EP) connected to GND for enhanced thermal dissipation (RθJB = 10 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1ALX / SW1BLX / SW1CLX | Buck switch node outputs | High-frequency switching nodes for SW1A/B/C regulators; require low-inductance layout and external LC filtering |
| VIN / VIN1 / VIN2 / VIN3 / SWBSTIN | Main and auxiliary input supplies | Dedicated inputs for buck/boost stages; each requires local ceramic decoupling (≥4.7 µF + 0.1 µF) |
| SW1FB / SW2FB / SW3AFB / SW3BFB / SW4FB / SWBSTFB | Voltage feedback inputs | Analog-sense points for closed-loop regulation; must be routed away from noisy switch nodes |
| VGEN1–VGEN6 | LDO output rails | Stable, low-noise analog/IO supplies; each requires specified output capacitance (2.2–4.7 µF ceramic) |
| SCL / SDA / PWRON / STANDBY / INTB / RESETBMCU | Digital control and status interface | 3.6 V-tolerant I²C bus and processor handshaking signals; open-drain outputs require pull-ups |
| VSNVS / LICELL / VREFDDR / VHALF | Special-function analog outputs/inputs | VSNVS provides always-on supply; LICELL enables coin-cell charging; VREFDDR/VHALF support DDR memory termination |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable power tree | One-time programmable memory stores startup sequence, voltage levels, and enable timing - eliminates external configuration EEPROM |
| DDR termination tracking | VREFDDR output tracks half-supply (VHALF) with ±1% accuracy - ensures precise DDR I/O voltage margining across temperature |
| Thermal protection with interrupts | Four independent thermal thresholds (110°C/120°C/125°C/130°C) generate I²C interrupts - enables firmware-controlled throttling before shutdown |
| Industrial-grade wettable flank QFN | WF-type package with side-wettable flanks - supports AOI inspection and improves solder joint reliability in harsh environments |
| Integrated coin-cell charger | LICELL pin supports trickle-charge of 3 V coin cells (e.g., CR2032) to maintain RTC during main power loss - no external charging circuit required |
Applications
| i.MX 6-Based Medical Monitoring | Industrial Home/Facility Automation Hub |
|---|---|
Use Scenario: Portable ECG and vital sign monitors requiring long battery life, RTC backup, and multi-rail power for sensor front-ends, display, and wireless comms. IC Role / Device Role / Timing Role: Central PMIC managing core (VCOREDIG), DDR (VREFDDR), analog sensors (VGEN2/VGEN4), and BLE module (VGEN6) with precise sequencing and low-quiescent LDOs. Use Value: Single-chip solution reduces BOM count by 12+ discrete regulators; VSNVS + LICELL maintains RTC during battery swaps without data loss. |
Use Scenario: Smart gateway aggregating Zigbee, Z-Wave, and Ethernet traffic in HVAC or lighting control panels operating continuously at 70°C ambient. IC Role / Device Role / Timing Role: Industrial-grade power manager delivering 1.5 V core, 3.3 V IO, DDR termination, and isolated 5 V boost for USB peripherals under extended temperature stress. Use Value: −40 °C to +105 °C rating and thermal interrupt reporting enable reliable operation without derating; WF-QFN ensures solder joint integrity over thermal cycling. |
| eReader Platform Power System | Factory Floor HMI with Display & Touch |
Use Scenario: High-resolution eInk display tablet with i.MX 6SoloLite, requiring ultra-low standby current, fast wake-up, and clean analog rails for touch controller. IC Role / Device Role / Timing Role: Configurable PMIC providing sequenced VDD_ARM, VDD_SOC, VDD_PU, and VGEN3 for touch IC - all controlled via I²C with programmable ON/OFF/standby modes. Use Value: Individual regulator enable/disable reduces system idle current to <50 µA; VGEN3's 100 mA output powers noise-sensitive touch digitizer without interference. |
Use Scenario: Ruggedized HMI panel with LVDS display, capacitive touch, and CAN bus interface deployed near motors and variable-frequency drives. IC Role / Device Role / Timing Role: Robust power hub supplying 1.5 V digital core, 3.3 V display interface, 5 V USB, and isolated 3.3 V CAN transceiver rail - all with ESD-hardened I/O (±2 kV HBM). Use Value: Integrated SWBST boost eliminates external 5 V DC-DC; VREFDDR ensures stable DDR3L interface despite voltage ripple from nearby motor drives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMPF0200F0ANES | Higher integration: adds USB Type-C PD controller, 3x additional LDOs, and enhanced thermal monitoring (16-bit ADC); same 56-QFN footprint but different pinout. | Targeted at next-gen i.MX 8M platforms requiring USB-C power delivery and higher channel count - not drop-in compatible with MMPF0100NPANESR2 layouts. | Select when upgrading to i.MX 8M and requiring native USB-C PD negotiation; requires PCB redesign due to pinout mismatch. |
| TPS659122ZQV | Texas Instruments part with 6 buck + 10 LDOs, but no integrated coin-cell charger, DDR termination reference, or OTP programming; uses 0.4 mm pitch 80-pin BGA. | Designed for OMAP5/AM57x processors; lacks VREFDDR and LICELL functionality - unsuitable for i.MX 6 systems needing RTC backup or DDR3L termination. | Consider only for non-i.MX 6 designs where BGA assembly is acceptable and coin-cell/DDR features are omitted; no pin or firmware compatibility. |
Compared with MMPF0100NPANESR2, MMPF0200F0ANES offers expanded USB-C and thermal telemetry but demands board revision, while TPS659122ZQV provides greater LDO count in BGA form but omits critical i.MX 6–specific features like VREFDDR and LICELL charging - neither is pin-compatible or functionally substitutable without system-level redesign.
Availability
MMPF0100NPANESR2 is available at Aetrix Electronics and suitable for industrial home automation hubs, medical monitoring devices, and factory-floor HMIs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MMPF0100NPANESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The PF0100 product line was engineered specifically to power NXP's i.MX 6 family of applications processors, integrating tightly coupled power sequencing, DDR termination, and industrial-grade reliability into a single configurable PMIC.
FAQ
What is the operating temperature range for MMPF0100NPANESR2?
MMPF0100NPANESR2 is rated for −40 °C to +105 °C ambient operation, qualifying it for extended industrial applications. This rating is confirmed by its ANES suffix and aligns with Table 3 in the NXP datasheet Rev. 20. The device includes thermal monitoring interrupts (THERM110I–THERM130I) to support firmware-based thermal management within this range.
Does MMPF0100NPANESR2 include an integrated coin-cell charger?
Yes, MMPF0100NPANESR2 includes a dedicated LICELL pin that supports trickle charging of standard 3 V coin cells (e.g., CR2032) to maintain RTC operation during main power loss. This functionality is explicitly documented in the "Features" section and Figure 1 of the datasheet, eliminating need for external charging circuitry.
What package type and pin count does MMPF0100NPANESR2 use?
MMPF0100NPANESR2 uses a 56-pin QFN package measuring 8 mm × 8 mm with 0.5 mm pitch and wettable flank (WF-type) construction. This is confirmed in the "Orderable Parts" table (MMPF0100NPANES entry) and "Packaging" section (Figure 3 and Table 4), where EP denotes the exposed thermal pad tied to GND.
Can MMPF0100NPANESR2 support DDR memory termination?
Yes, MMPF0100NPANESR2 provides a dedicated VREFDDR output (pin 31) with programmable voltage (0.6–0.9 V) and tracking mode referenced to VHALF (pin 29). This meets JEDEC DDR3L termination requirements and is validated in Section 6.3.2 and Figure 2 of the datasheet for i.MX 6 platforms.
Is MMPF0100NPANESR2 pin-compatible with other PF0100 variants like MMPF0100F0ANES?
No, MMPF0100NPANESR2 is not pin-compatible with pre-programmed variants such as MMPF0100F0ANES. While all PF0100 ANES-suffix parts share the same 56-QFN package and pinout, the NP (non-programmed) version requires external configuration via I²C, whereas F0/F3/F6 variants have OTP-fused settings - functionally identical pin mapping but distinct initialization behavior.
MMPF0100NPANESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 12
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MMPF0100NPANESR2 FAQ
1.How can I place an order for MMPF0100NPANESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0100NPANESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0100NPANESR2 reliable?
The price and inventory of MMPF0100NPANESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0100NPANESR2 is usually 5 days.
3.What payment methods are accepted for MMPF0100NPANESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0100NPANESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0100NPANESR2?
MMPF0100NPANESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0100NPANESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0100NPANESR2?
For technical support, including MMPF0100NPANESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0100NPANESR2 requirements.
6.How does Aetrix verify that MMPF0100NPANESR2 is sourced from the original manufacturer or authorized distributors?
All MMPF0100NPANESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0100NPANESR2 meets industry standards.
7.What is the process for return or replacement of MMPF0100NPANESR2?
All MMPF0100NPANESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0100NPANESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0100NPANESR2 part is unused and in its original packaging.
Return procedure for MMPF0100NPANESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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