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NXP Semiconductors MMPF0100NPEP

Part No.:
MMPF0100NPEP
Manufacturer:
NXP Semiconductors
Category:
Special Purpose Regulators
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMMPF0100NPEP.pdf
Description:
IC REG CONV I.MX6 12OUT 56HVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,218

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Product details

Overview

MMPF0100NPEP from NXP Semiconductors is a 14-channel configurable power management IC (PMIC) designed for i.MX 6-based embedded platforms. It integrates up to six buck converters (e.g., SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–VGEN6), a 5 V boost regulator (SWBST), coin-cell charger (LICELL), RTC supply (VSNVS), and DDR termination reference (VREFDDR), operating from a 2.8–4.5 V main input. It powers application processors, DDR memory, and peripherals in eReaders, IPTV, and industrial control systems.

For engineers reviewing the MMPF0100NPEP datasheet, MMPF0100NPEP pinout, MMPF0100NPEP application, or MMPF0100NPEP equivalent, key selection considerations include OTP-programmable power sequencing, I²C-controlled voltage regulation, thermal shutdown thresholds (110–130 °C), DDR tracking mode support, and QFN-56 8×8 mm wettable flank (ANES) or full-lead (AEP) package compatibility.

Technical Context

The MMPF0100NPEP implements a hierarchical power tree with independent state machine control per regulator group, supporting dynamic voltage scaling (DVS) and multi-phase buck operation (e.g., SW1A/B parallel mode). Its OTP memory stores boot configuration, voltage setpoints, sequencing delays, and enable/disable states-enabling pre-programmed variants like F0–F6 for specific i.MX 6 reference designs.

Control logic includes I²C interface (SCL/SDA), interrupt-driven event handling (INTB, THERMxxxI), processor signaling (PWRON, STANDBY, RESETBMCU), and real-time thermal monitoring via on-die sensor. The device uses dedicated ground references (GNDREF, GNDREF1, SW1VSSSNS, SW3VSSSNS) to isolate noise-sensitive analog blocks from high-current switching paths.

Key Specifications

ParameterValue and Actual Design Meaning
Main input range2.8 V to 4.5 V - supports single-cell Li-ion or regulated DC supply without external pre-regulation
Buck output countUp to 6 channels - SW1A/B/C, SW2, SW3A/B, SW4 - enables full SoC + memory + peripheral rail coverage
LDO count & max current6 regulators (VGEN1–VGEN6); 100–350 mA - supplies low-noise analog, I/O, and auxiliary rails
Boost output5.0 V @ 600 mA - powers USB PHY, HDMI, or external PMICs requiring 5 V
I²C interfaceStandard-mode (100 kHz) and fast-mode (400 kHz) - enables host processor configuration and status readback
Thermal protectionFour thresholds (110/120/125/130 °C) with 8 ms debounce - prevents latch-up during transient overload
Package56-pin QFN, 8 mm × 8 mm, 0.5 mm pitch, exposed pad - optimized for thermal dissipation in space-constrained PCBs

Pinout & Package

Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch) with exposed thermal pad (EP). Wettable flank variant (ANES suffix) supports automated optical inspection; full-lead variant (AEP suffix) used in consumer-grade assemblies.

Pin/TerminalCircuit RoleDesign Meaning
SW1AIN / SW1BIN / SW1CINBuck input supply pinsAccept 4.8 V max input; require local 4.7 μF + 0.1 μF ceramic decoupling for stability
SW1ALX / SW1BLX / SW1CLXSwitch node outputsConnect to external inductor; routing must minimize loop area to reduce EMI
SW1FB / SW2FB / SW3AFB / SW3BFB / SW4FB / SWBSTFBVoltage feedback inputsHigh-impedance analog inputs; trace routing must avoid noisy planes and terminate at output capacitor
VGEN1–VGEN6LDO outputsDeliver 100–350 mA; each requires specified ceramic output capacitance (2.2–4.7 μF)
VREFDDRDDR termination referenceProvides precise 0.5 × VDDQ tracking; sourced from VINREFDDR and VHALF inputs
SCL / SDAI²C bus interfaceOpen-drain digital signals; require pull-up resistors (typically 2.2–4.7 kΩ to VDDIO)
INTB / RESETBMCU / SDWNBProcessor interface signalsOpen-drain outputs (3.6 V tolerant); drive MCU interrupt, reset, or graceful shutdown request
EPExposed thermal padMust be soldered to internal/external ground planes via ≥4 thermal vias for RθJB = 10 °C/W

Key Features

FeatureDesign Value
OTP-configurable power sequencingEnables deterministic startup/shutdown order across 14 rails without external firmware or timing components
DDR termination tracking modeAutomatically adjusts VREFDDR to match half of DDR I/O supply (VDDQ), eliminating manual calibration
Dual-phase buck capability (SW1A/B)Increases current capacity to 5 A while reducing ripple and inductor size versus single-phase implementation
Coin-cell charger + VSNVS LDOSupports RTC backup with programmable charge current and seamless switchover during main supply loss
Per-rail programmable ON/OFF/standby modesReduces system standby power by disabling unused regulators while retaining configuration in OTP
Integrated thermal monitoring & interruptFour independent temperature thresholds trigger INTB assertion, enabling host-initiated throttling or fault logging

Applications

i.MX 6-Based eReaderIPTV Set-Top Box

Use Scenario: Portable battery-powered device requiring long runtime, fast wake-from-sleep, and stable display/memory power.

IC Role / Device Role / Timing Role: Central PMIC managing core (VCOREDIG), GPU, DDR, LCD bias, audio codec, and SD card rails with synchronized sequencing.

Use Value: OTP-programmed F1/F3 variants eliminate external sequencers; VREFDDR tracking ensures DDR signal integrity across temperature.

Use Scenario: Always-on entertainment device with HDMI, USB, Ethernet, and tuner subsystems demanding low-noise, high-efficiency power delivery.

IC Role / Device Role / Timing Role: Primary power controller supplying 1.0 V core, 1.5 V DDR, 3.3 V I/O, 5 V USB, and 12 V tuner bias via buck/LDO/boost combinations.

Use Value: Six buck converters replace discrete solutions; SWBST delivers clean 5 V for USB PHY without external regulator.

Industrial Control HMIMedical Monitoring Terminal

Use Scenario: Fanless panel PC in factory environment requiring extended temperature operation (-40 to 105 °C) and ESD robustness.

IC Role / Device Role / Timing Role: Power hub for ARM Cortex-A9 processor, capacitive touch controller, CAN transceiver, and isolated RS-485 interface.

Use Value: ANES-suffix version qualified for 105 °C ambient; GNDREF isolation prevents noise coupling into analog sensor front-ends.

Use Scenario: Battery-backed patient monitor needing fail-safe power management, RTC retention, and low-power sleep modes.

IC Role / Device Role / Timing Role: System-level PMIC delivering regulated rails to ECG ADC, OLED display, Bluetooth module, and microcontroller while managing coin-cell charging.

Use Value: LICELL input + VSNVS LDO provides >10-year RTC backup; programmable standby modes extend battery life between measurements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
PF0200A00EPSuccessor IC with enhanced VSNVS current limit, fixed errata (ER19/20/22), and updated OTP programming logic; identical pinout and register mapRequired for new designs targeting improved reliability and simplified qualification; supports same i.MX 6 reference designsSelect PF0200A00EP for production releases post-2018; MMPF0100NPEP remains valid for legacy i.MX 6Q/DL/SX designs using F0–F6 OTP images
TPS65910A3RSLRTexas Instruments part with 6 buck + 8 LDO + RTC + battery charger; different I²C address, register layout, and no DDR tracking modeSuitable for OMAP/AM335x platforms but requires full firmware porting; lacks VREFDDR auto-tracking and dual-phase SW1A/B supportChoose only when migrating from TI-based designs; not drop-in compatible due to sequencing engine and feedback architecture differences

Compared with PF0200A00EP, MMPF0100NPEP offers proven integration with i.MX 6 reference designs but requires external workaround for ER19. Versus TPS65910A3RSLR, MMPF0100NPEP provides tighter DDR interface support and higher buck current capability (2.5 A vs. 2.0 A on SW2), though with less LDO count.

Availability

MMPF0100NPEP is available at Aetrix Electronics and suitable for i.MX 6-based eReaders, IPTV set-top boxes, and industrial HMIs requiring stable component supply, long-term lifecycle support, and pre-validated power configurations.

Supply support for MMPF0100NPEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The PF0100 product line was engineered specifically to deliver fully integrated, OTP-configurable power management for NXP's i.MX application processors, reducing external component count and simplifying board design for high-performance embedded systems.

FAQ

What is the operating temperature range for the MMPF0100NPEP?

The MMPF0100NPEP is rated for an ambient temperature range of -40 °C to +85 °C, qualified for consumer and standard industrial applications. This rating is defined in the datasheet revision 17.0 and applies specifically to the AEP-suffix package variant. Thermal protection activates at 110 °C junction temperature to prevent damage during overload conditions.

Does the MMPF0100NPEP support DDR memory termination voltage tracking?

Yes, the MMPF0100NPEP supports DDR termination voltage tracking via its VREFDDR output. This rail is programmable to track half of the DDR I/O supply (VDDQ) using inputs VINREFDDR and VHALF. The feature eliminates manual calibration and maintains signal integrity across voltage and temperature variations in DDR2/DDR3 interfaces.

How many buck converters does the MMPF0100NPEP integrate, and what are their current ratings?

The MMPF0100NPEP integrates up to six buck converters: SW1A/B/C (2.5 A / 2.5 A / 2.0 A), SW2 (2.0 A), SW3A/B (1.0 A / 1.0 A), and SW4 (1.0 A). Current ratings are confirmed in the "Electrical Characteristics" section of the datasheet and depend on thermal design and PCB layout. SW2 supports 2.5 A only in industrial ANES variants (not MMPF0100NPEP).

Can the MMPF0100NPEP be used without programming the OTP memory?

Yes, the MMPF0100NPEP ships in non-programmed (NP) configuration, allowing full customization via I²C during system initialization. Default behavior without OTP programming follows a safe power-up sequence, but optimal performance for i.MX 6 platforms requires loading vendor-provided OTP images (e.g., F0 for i.MX 6Quad) to configure voltages, timing, and dependencies.

What package type and pin count does the MMPF0100NPEP use?

The MMPF0100NPEP uses a 56-pin QFN package measuring 8 mm × 8 mm with 0.5 mm pitch and an exposed thermal pad (EP). This is the E-Type (full-lead) variant per NXP's packaging nomenclature, distinct from the WF-Type (wettable flank) ANES suffix used in extended-temperature versions.

MMPF0100NPEP Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tray
Product Status:
Obsolete
Applications:
Converter, i.MX6
Voltage - Input:
2.8V ~ 4.5V
Number of Outputs:
12
Voltage - Output:
Multiple
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-HVQFN (8x8)

MMPF0100NPEP FAQ

1.How can I place an order for MMPF0100NPEP through Aetrix?

Please submit a Request for Quotation (RFQ) for MMPF0100NPEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MMPF0100NPEP reliable?

The price and inventory of MMPF0100NPEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0100NPEP is usually 5 days.

3.What payment methods are accepted for MMPF0100NPEP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0100NPEP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MMPF0100NPEP?

MMPF0100NPEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MMPF0100NPEP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MMPF0100NPEP?

For technical support, including MMPF0100NPEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0100NPEP requirements.

6.How does Aetrix verify that MMPF0100NPEP is sourced from the original manufacturer or authorized distributors?

All MMPF0100NPEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0100NPEP meets industry standards.

7.What is the process for return or replacement of MMPF0100NPEP?

All MMPF0100NPEP units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0100NPEP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MMPF0100NPEP part is unused and in its original packaging.

Return procedure for MMPF0100NPEP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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