NXP Semiconductors MMPF0100NPZES
- Part No.:
- MMPF0100NPZES
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0100NPZES.pdf
- Description:
- IC REG CONV I.MX6 12OUT 56QFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MMPF0100NPZES from NXP Semiconductors is a 14-channel configurable automotive-grade PMIC (AEC-Q100 Grade 2) designed for i.MX 6 family processors. It integrates six buck converters (up to 2.5 A each), six LDOs, RTC supply, coin-cell charger, DDR termination reference (VREFDDR), and I²C programmable control logic - delivering full-system power for infotainment, digital clusters, and HUDs from a 2.8–4.5 V input.
For engineers reviewing the MMPF0100NPZES datasheet, MMPF0100NPZES pinout, MMPF0100NPZES application, or MMPF0100NPZES equivalent, key selection criteria include OTP-configurable startup sequencing, thermal shutdown thresholds (110–130 °C), wettable-flank QFN-56 package compatibility, and support for DDR memory interface biasing via VREFDDR.
Technical Context
The MMPF0100NPZES implements a hierarchical power tree with independent state machine control for each regulator domain, enabling precise power-up/down sequencing across VCOREDIG, VCORE, VGENx, SWx, and VSNVS rails. Its OTP memory stores configuration including voltage levels, timing delays, and enable/disable states - eliminating external configuration components.
It features dual-phase capability on SW1A/B, DDR termination tracking mode, boost regulator outputting 5.0 V at 600 mA, and integrated thermal monitoring with four interrupt-enabled thresholds (THERM110I–THERM130I). The device supports I²C register access for real-time status reads and dynamic reconfiguration during operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V main supply; supports 4.8 V max on buck/boost inputs - enables direct connection to automotive battery rail with minimal pre-regulation. |
| Buck Regulator Count & Max Current | Six configurable bucks: SW1A/B (2.5 A dual-phase), SW1C (2.0 A), SW2 (2.0 A), SW3A/B (2.5 A), SW4 (1.0 A) - powers multi-core SoCs and DDR memory subsystems. |
| LDO Count & Output Current | Six general-purpose LDOs: VGEN1 (100 mA), VGEN2 (250 mA), VGEN3 (100 mA), VGEN4 (350 mA), VGEN5 (100 mA), VGEN6 (200 mA) - supplies low-noise analog/peripheral rails. |
| VREFDDR Output | Programmable DDR termination reference (0.9–1.35 V) with tracking mode - ensures stable DDR3/DDR4 interface bias under load transients. |
| OTP Memory | On-chip one-time programmable memory storing startup configuration, sequencing, and voltage settings - enables factory-programmed variants without external EEPROM. |
| Thermal Protection | Four user-interruptible thresholds (110/120/125/130 °C) with 8 ms debounce - provides fail-safe shutdown while allowing system-level thermal management response. |
| Ambient Operating Range | -40 °C to +85 °C - qualified per AEC-Q100 Grade 2 for under-hood and cabin-mounted automotive electronics. |
Pinout & Package
Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch, wettable flank - WF-Type ES suffix). Exposed pad (EP) required for thermal dissipation and ground return path for high-current bucks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1ALX / SW1BLX / SW1CLX | Buck switch node outputs | High-frequency switching nodes for SW1A/B/C regulators - require tight layout with low-inductance paths to external inductors and ceramic capacitors. |
| SW1FB / SW2FB / SW3AFB / SW3BFB / SW4FB / SWBSTFB | Voltage feedback inputs | Analog feedback pins routed separately from high-current paths to avoid noise coupling - terminate directly at output capacitor for stable regulation. |
| VGEN1–VGEN6 | LDO regulated outputs | Low-noise analog power outputs with specified current ratings - each requires dedicated ceramic output capacitance (2.2–4.7 μF). |
| VREFDDR / VINREFDDR / VHALF | DDR termination reference circuit | Provides precision bias for DDR memory termination - VHALF serves as half-supply reference; VINREFDDR supplies internal VREFDDR LDO. |
| SCL / SDA / VDDIO | I²C interface | Standard open-drain I²C bus (3.3 V tolerant); VDDIO powers internal I²C logic - must be decoupled with 0.1 μF near pin. |
| INTB / SDWNB / RESETBMCU | System control signals | Open-drain interrupt/status outputs - INTB signals fault events; SDWNB warns of imminent shutdown; RESETBMCU can serve as reset or power-good indicator. |
| VIN / VDDOTP / LICELL / VSNVS | Power inputs/outputs | VIN: main 2.8–4.5 V supply; VDDOTP: 10 V max for OTP programming; LICELL: bidirectional coin-cell interface; VSNVS: always-on LDO output for RTC/sleep domain. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Buck Architecture | Supports single/dual-phase and parallel configurations on SW1A/B - enables flexible trade-off between efficiency, ripple, and PCB area for core voltage rails. |
| DDR Termination Tracking Mode | Automatically adjusts VREFDDR in proportion to VDDQ - maintains optimal DDR signal integrity across temperature and load variations without host software intervention. |
| Integrated Coin-Cell Charger | Charges backup battery via LICELL pin with programmable charge current and end-of-charge detection - sustains RTC and VSNVS during main power loss. |
| OTP-Based Startup Configuration | Eliminates boot-time I²C writes by storing complete power tree initialization in on-chip fuses - reduces boot latency and firmware dependency. |
| Thermal Monitoring with Interrupts | Four discrete overtemperature thresholds generate dedicated I²C interrupts - allows host processor to initiate throttling or graceful shutdown before hardware protection triggers. |
Applications
| Auto Infotainment Head Unit | Digital Instrument Cluster (DIC) |
|---|---|
|
Use Scenario: Central multimedia unit integrating navigation, audio, Bluetooth, and vehicle data display in premium vehicles. IC Role / Device Role / Timing Role: Primary PMIC supplying i.MX 6QuadPlus processor cores, DDR3 memory, HDMI/LVDS display interfaces, and audio codec. Use Value: Single-chip solution replaces >10 discrete regulators; OTP sequencing ensures deterministic boot across temperature; VREFDDR tracking maintains DDR signal integrity at 800 MHz. |
Use Scenario: Real-time driver information display with graphics acceleration, CAN bus integration, and safety-critical warning overlays. IC Role / Device Role / Timing Role: Power manager for i.MX 6SoloX MCU, providing isolated domains for safety-critical (ASIL-B) and non-safety functions. Use Value: Independent enable/control of VGENx rails enables functional safety partitioning; thermal interrupts allow early warning before junction exceeds 125 °C. |
| Heads-Up Display (HUD) | Rear Seat Entertainment System |
|
Use Scenario: Compact optical projection module projecting speed, ADAS alerts, and navigation onto windshield with minimal EMI impact. IC Role / Device Role / Timing Role: High-efficiency power source for laser diode drivers, image processing SoC, and analog front-end sensors. Use Value: Low-noise LDOs (VGEN2/VGEN4) power sensitive analog circuits; buck regulators operate in forced PWM mode to suppress audible noise in cabin environment. |
Use Scenario: In-vehicle media hub powering dual displays, USB peripherals, Wi-Fi/BT modules, and storage interfaces for rear passengers. IC Role / Device Role / Timing Role: Multi-rail controller managing power states for video decode engine, MIPI-CSI camera input, and SATA/NAND flash storage. Use Value: Programmable standby modes reduce quiescent current to <50 μA; SW4 (1 A buck) powers USB PHY independently for selective wake-up capability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMPF0100F9AZES | Pre-programmed OTP variant with SW2 rated for 2.5 A; ambient range extended to -40 °C to +105 °C; fixes errata ER19/ER20/ER22. | Targeted for i.MX 6QPlusAICPU3 reference design; supports higher ambient temperature in engine bay proximity. | Select when requiring guaranteed startup configuration and extended temperature qualification - avoids OTP programming step but lacks field reconfigurability. |
| PF0100AZ | Revised silicon revision (SILICON REV = 0x21); increased VSNVS current limit; removes XOR-based POR fuse loading requirement. | Drop-in replacement for PF0100Z in new designs; not compatible with legacy PF0100Z OTP programming tools due to fuse logic change. | Choose for new automotive designs needing errata fixes and improved VSNVS drive - verify OTP toolchain compatibility before migration. |
Compared with MMPF0100NPZES, MMPF0100F9AZES offers factory-validated configuration and extended temperature rating but forfeits field programmability, while PF0100AZ delivers silicon-level reliability improvements and simplified OTP flow at the cost of backward tooling compatibility.
Availability
MMPF0100NPZES is available at Aetrix Electronics and suitable for auto infotainment head units, digital instrument clusters, heads-up displays, and rear seat entertainment systems requiring stable component supply across automotive production lifecycles.
Supply support for MMPF0100NPZES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based SoCs and power management.
The PF0100Z product line was engineered specifically to deliver scalable, configurable power for NXP's i.MX 6 family of applications processors - emphasizing AEC-Q100 compliance, thermal robustness, and seamless integration with reference hardware.
FAQ
What is the primary function of the MMPF0100NPZES in an automotive system?
The MMPF0100NPZES serves as a fully integrated, configurable power management IC that delivers all required voltages - including core, memory, I/O, and peripheral rails - for NXP i.MX 6 family processors. It replaces multiple discrete regulators with a single AEC-Q100 Grade 2 device featuring OTP-programmable sequencing, thermal monitoring, and DDR termination support - enabling compact, reliable power delivery in infotainment and digital cluster applications.
Does the MMPF0100NPZES support DDR memory interface biasing?
Yes, the MMPF0100NPZES includes a dedicated VREFDDR regulator with programmable output (0.9–1.35 V) and DDR termination tracking mode. This feature dynamically adjusts VREFDDR relative to VDDQ to maintain optimal signal integrity for DDR3/DDR4 memory interfaces - critical for high-speed data transfer in automotive infotainment and instrument cluster systems using the MMPF0100NPZES.
How does the OTP memory in the MMPF0100NPZES affect system design?
The OTP memory in the MMPF0100NPZES stores startup configuration, voltage levels, sequencing order, and timing parameters - eliminating the need for external configuration EEPROM or boot-time I²C writes. This reduces BOM count, improves boot reliability, and enables deterministic power-up behavior across temperature and voltage corners - a key advantage for automotive systems where repeatable initialization is mandatory.
What thermal protection mechanisms does the MMPF0100NPZES provide?
The MMPF0100NPZES incorporates four user-accessible thermal thresholds (110 °C, 120 °C, 125 °C, 130 °C) that generate dedicated I²C interrupts (THERM110I–THERM130I). These allow the host processor to initiate thermal throttling or controlled shutdown before the hardware-level thermal protection engages. The device also includes an 8 ms debounce to prevent false triggers from transient spikes - enhancing system stability in demanding automotive environments.
Is the MMPF0100NPZES pin-compatible with other PF0100Z variants?
Yes, all PF0100Z variants - including MMPF0100NPZES, MMPF0100F9AZES, and MMPF0100FAAZES - share identical 56-pin QFN (8×8 mm, 0.5 mm pitch, wettable flank) packaging and pinout. This enables hardware reuse across different OTP configurations and reference designs, such as MCIMX6Q-SDP or MCIMX6QPlusAICPU3, while maintaining mechanical and thermal compatibility in automotive PCB layouts.
MMPF0100NPZES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 12
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MMPF0100NPZES FAQ
1.How can I place an order for MMPF0100NPZES through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0100NPZES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0100NPZES reliable?
The price and inventory of MMPF0100NPZES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0100NPZES is usually 5 days.
3.What payment methods are accepted for MMPF0100NPZES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0100NPZES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0100NPZES?
MMPF0100NPZES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0100NPZES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0100NPZES?
For technical support, including MMPF0100NPZES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0100NPZES requirements.
6.How does Aetrix verify that MMPF0100NPZES is sourced from the original manufacturer or authorized distributors?
All MMPF0100NPZES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0100NPZES meets industry standards.
7.What is the process for return or replacement of MMPF0100NPZES?
All MMPF0100NPZES units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0100NPZES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0100NPZES part is unused and in its original packaging.
Return procedure for MMPF0100NPZES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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