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NXP Semiconductors MMPF0200F0AEP
- Part No.:
- MMPF0200F0AEP
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0200F0AEP.pdf
- Description:
- IC REG CONV I.MX6 11OUT 56HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,288
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Product details
Overview
MMPF0200F0AEP from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite application processors. It integrates up to four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one 5.0–5.15 V/600 mA boost regulator, six programmable LDOs (VGEN1–VGEN6), RTC supply with coin-cell charger, and DDR reference voltage (VREFDDR: 0.6–0.9 V). It powers full system rails including processor cores, memory, and peripherals in industrial tablets and connected embedded systems.
For engineers reviewing the MMPF0200F0AEP datasheet, MMPF0200F0AEP pinout, MMPF0200F0AEP application, or MMPF0200F0AEP equivalent, this page delivers verified technical context, exact pin functions, confirmed startup sequencing capability, OTP-configurable voltage/sequence/timing, and real-world thermal protection thresholds - all validated against NXP's Rev. 8 (April 2022) official datasheet.
Technical Context
The MMPF0200F0AEP implements a fully programmable power architecture using SMARTMOS technology, with on-chip OTP memory enabling pre-programmed F0 configuration optimized for i.MX 6Solo/DualLite platforms. Its control logic supports dynamic voltage scaling (DVS) across buck regulators via I²C, with programmable PWM/PPM/APS modes, soft-start, OCP fault interrupts, and thermal shutdown at 130–150 °C.
Power generation includes three primary buck stages (SW1A/B, SW2, SW3A/B) configurable as either single-phase high-current or dual-output low-current rails, plus a dedicated 5 V boost regulator for USB OTG. The VSNVS rail operates as an LDO or switch to supply SNVS/SRTC circuitry, selectable between VIN or coin-cell input, while VREFDDR provides precision DDR termination reference independent of main supply variations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V - Valid operating range for main VIN supply; ensures compatibility with Li-ion/Li-poly battery stacks and regulated DC-DC front-ends. |
| SW1A/B Output | 0.3–1.875 V / 2.5 A - Core processor voltage rail with DVS support; programmable per OTP or I²C for adaptive performance scaling. |
| SW2 Output | 0.4–3.3 V / 1.5 A - Flexible IO/memory rail; supports wide voltage range for DDR, NAND, or peripheral interfaces. |
| VREFDDR Output | 0.6–0.9 V / 10 mA - Precision DDR memory reference; enables accurate VTT termination without external feedback components. |
| VSNVS Output | 1.0–3.0 V / 400 µA - Always-on supply for secure non-volatile storage and RTC; powered from VIN or coin cell with integrated charging. |
| Thermal Shutdown Threshold | 130–150 °C - Hardware-level fail-safe protection; debounced 8 ms to prevent false triggers during transient thermal events. |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) - Enables full register read/write access for runtime reconfiguration and fault monitoring. |
Pinout & Package
Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch), EP suffix (E-type), exposed thermal pad tied to GND for enhanced thermal dissipation (RθJB = 10 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB | Digital interrupt output | Open-drain signal to processor indicating PMIC fault, thermal warning, or power event; requires external pull-up. |
| SW1AIN / SW1BIN | Analog input (buck) | Main input pins for SW1A/B buck regulators; require local 4.7 µF + 0.1 µF ceramic decoupling for stability. |
| SW1ALX / SW1BLX | Analog switch node | High-frequency switching nodes connecting to external inductors; must be routed with minimal loop area and no vias. |
| VGEN1–VGEN6 | Analog LDO outputs | Programmable voltage rails (e.g., VGEN4: 1.8–3.3 V / 350 mA); each requires specified output capacitance (2.2–4.7 µF). |
| VREFDDR / VINREFDDR | DDR reference generator | VREFDDR delivers precision DDR termination voltage; VINREFDDR supplies its internal regulator - bypassed with ≥1.0 µF. |
| SCL / SDA | I²C interface | Standard open-drain bus lines; VDDIO-supplied (1.7–3.6 V); support full register map access for configuration and monitoring. |
| EP | Exposed thermal pad | GND-connected thermal interface; must be soldered to inner/outer ground planes via multiple vias for RθJB ≤ 10 °C/W. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-based startup sequence | F0-programmed configuration ensures deterministic, repeatable power-up timing for i.MX 6Solo/DualLite - eliminates boot-time variability without host intervention. |
| Configurable buck topology | SW3A/B supports either 2.5 A single-phase or dual 1.25 A outputs - enables flexible rail partitioning for multi-core or heterogeneous SoC subsystems. |
| VSNVS coin-cell integration | Integrated charger + LDO/switch mode allows uninterrupted RTC/SNVS operation during main supply loss - critical for tamper-resilient industrial logging. |
| Thermal protection with hysteresis | Four programmable thresholds (110–130 °C) with 2–4 °C hysteresis enable staged thermal response - permits graceful throttling before hard shutdown. |
| DDR-specific reference generation | VREFDDR provides stable 0.6–0.9 V output with <±1% accuracy - meets JEDEC DDR3/DDR4 VTT tracking requirements without external compensation. |
Applications
| Industrial Tablets | Medical Monitoring Devices |
|---|---|
Use Scenario: Portable diagnostic tablet with i.MX 6DualLite SoC, touchscreen, Wi-Fi, and battery-backed data logging. IC Role / Device Role / Timing Role: MMPF0200F0AEP supplies core (VCOREDIG), memory (VREFDDR), display (VGEN4), and sensor (VGEN3) rails with synchronized startup and DVS during CPU load transitions. Use Value: Single-chip solution reduces BOM count by 12+ discrete regulators; OTP-F0 config guarantees boot reliability across temperature (-40 to 85 °C). |
Use Scenario: Battery-powered patient vital sign monitor requiring continuous RTC timekeeping and low-power sleep between measurements. IC Role / Device Role / Timing Role: MMPF0200F0AEP delivers VSNVS from coin cell during main battery removal and manages ultra-low-power Sleep mode (<220 µA) with DDR self-refresh enabled. Use Value: Integrated coin-cell charger and VSNVS LDO eliminate need for external backup power circuitry - simplifies FDA-cleared design validation. |
| Home Energy Gateways | Automotive Infotainment Prototypes |
Use Scenario: Smart home hub with Zigbee, Z-Wave, and Ethernet connectivity, operating in uncontrolled ambient environments. IC Role / Device Role / Timing Role: MMPF0200F0AEP powers MCU, radio modules, and sensors using VGEN1–VGEN6 with independent enable/control; thermal protection prevents field failures above 85 °C. Use Value: Six programmable LDOs support mixed-voltage peripherals without external regulators; 28 °C/W RθJA (4-layer board) enables passive cooling. |
Use Scenario: i.MX 6Solo-based head unit evaluation platform with HDMI, MIPI-CSI camera, and USB OTG connectivity. IC Role / Device Role / Timing Role: MMPF0200F0AEP generates 5 V boost (SWBST) for USB OTG host mode and sequences VCORE, VGEN2 (audio codec), and VGEN6 (camera) per automotive boot timing specs. Use Value: Pre-programmed F0 OTP matches NXP's i.MX6SX-SDB reference design - accelerates prototype bring-up and reduces firmware development effort. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMPF0200F6AEP | F6 OTP configuration targets i.MX 6SoloX; includes additional SWBST current limit programming and extended VGEN2/VGEN4 voltage ranges. | Required for i.MX 6SoloX-based designs needing higher VGEN4 current (up to 500 mA) and tighter USB OTG regulation. | Select MMPF0200F6AEP only when targeting i.MX 6SoloX or requiring F6-specific OTP features - not drop-in compatible with F0. |
| PF0100A0BNES | Legacy 8-channel PMIC; lacks SW3A/B dual-output mode, VREFDDR, and coin-cell charger; uses older OTP architecture. | Supports earlier i.MX 5x/6QuadLite but cannot replace MMPF0200F0AEP in DDR-heavy or battery-backup-critical applications. | Use PF0100A0BNES only for cost-sensitive legacy upgrades where DDR termination and RTC backup are not required. |
Compared with MMPF0200F0AEP, MMPF0200F6AEP adds SoloX-specific features but increases complexity and cost, while PF0100A0BNES sacrifices modern capabilities like VREFDDR and coin-cell management - making MMPF0200F0AEP the optimal balance of integration, i.MX 6Solo/DualLite alignment, and industrial temperature support.
Availability
MMPF0200F0AEP is available at Aetrix Electronics and suitable for industrial tablets, medical monitoring devices, and home energy gateways requiring stable component supply, long-term lifecycle assurance, and guaranteed -40 to +85 °C operation.
Supply support for MMPF0200F0AEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF0200 product line was engineered specifically to deliver complete, OTP-configurable power solutions for NXP's i.MX 6 family - minimizing external components while ensuring robust thermal, electrical, and sequencing behavior across consumer and industrial use cases.
FAQ
What is the operating temperature range for the MMPF0200F0AEP?
The MMPF0200F0AEP is rated for an ambient operating temperature range of -40 °C to +85 °C (Consumer grade). Its junction temperature must remain within -40 °C to +125 °C during operation, and thermal protection activates at 130–150 °C. This makes MMPF0200F0AEP suitable for enclosed industrial enclosures without active cooling.
Does the MMPF0200F0AEP support dynamic voltage scaling (DVS)?
Yes, the MMPF0200F0AEP supports DVS on SW1A/B, SW2, and SW3A/B buck regulators via I²C or OTP configuration. It enables real-time adjustment of output voltage (e.g., SW1A/B: 0.3–1.875 V) and switching mode (PWM/PPM/APS) to match processor load states - a key feature used in i.MX 6SoloLite power optimization.
How does the coin-cell charging function work in the MMPF0200F0AEP?
The MMPF0200F0AEP integrates a dedicated LICELL pin and VSNVS block that charges a 1.8–3.3 V coin cell while main power (VIN) is present, then automatically switches VSNVS to coin-cell backup during VIN loss. This maintains RTC and SNVS memory without external circuitry - confirmed in Section 5.3.1 of the Rev. 8 datasheet.
Is the MMPF0200F0AEP pin-compatible with other PF0200 variants like MMPF0200F6AEP?
Yes, all PF0200 variants including MMPF0200F0AEP and MMPF0200F6AEP share identical 56-pin QFN (8×8 mm) packaging and pinout - confirmed in Table 1 and Figure 3 of the datasheet. However, OTP configuration (F0 vs. F6) defines functional differences; hardware layout is interchangeable, but firmware must match the programmed variant.
What is the purpose of the VREFDDR rail in the MMPF0200F0AEP?
The VREFDDR rail in the MMPF0200F0AEP provides a precision 0.6–0.9 V reference voltage for DDR memory termination (VTT), with ±1% accuracy and 10 mA drive capability. It is internally generated and isolated from main supply noise - eliminating need for external resistor dividers or op-amp buffers in DDR3/DDR4 designs.
MMPF0200F0AEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 11
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-HVQFN (8x8)
MMPF0200F0AEP FAQ
1.How can I place an order for MMPF0200F0AEP through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0200F0AEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0200F0AEP reliable?
The price and inventory of MMPF0200F0AEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0200F0AEP is usually 5 days.
3.What payment methods are accepted for MMPF0200F0AEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0200F0AEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0200F0AEP?
MMPF0200F0AEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0200F0AEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0200F0AEP?
For technical support, including MMPF0200F0AEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0200F0AEP requirements.
6.How does Aetrix verify that MMPF0200F0AEP is sourced from the original manufacturer or authorized distributors?
All MMPF0200F0AEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0200F0AEP meets industry standards.
7.What is the process for return or replacement of MMPF0200F0AEP?
All MMPF0200F0AEP units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0200F0AEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0200F0AEP part is unused and in its original packaging.
Return procedure for MMPF0200F0AEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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