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NXP Semiconductors MMPF0200F0AEPR2
- Part No.:
- MMPF0200F0AEPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0200F0AEPR2.pdf
- Description:
- IC REG CONV I.MX6 11OUT 56HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,120
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Product details
Overview
MMPF0200F0AEPR2 from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite application processors. It integrates up to four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one boost regulator (5.0–5.15 V, 600 mA), six programmable LDOs (VGEN1–VGEN6), RTC supply with coin-cell charger, and DDR reference voltage (VREFDDR: 0.6–0.9 V). It powers full system rails including processor cores, memory, and peripherals in industrial tablets and embedded control systems.
For engineers reviewing the MMPF0200F0AEPR2 datasheet, MMPF0200F0AEPR2 pinout, MMPF0200F0AEPR2 application, or MMPF0200F0AEPR2 equivalent, key selection criteria include OTP-configurable startup sequencing, I²C-programmable voltage/soft-start/timing, thermal protection thresholds (110–130 °C), and support for coin-cell backup with <7 µA quiescent current in coin-cell mode.
Technical Context
The MMPF0200F0AEPR2 implements a SMARTMOS-based architecture with fully integrated power devices and minimal external components. Its three-to-four-channel buck configuration supports either high-current single-phase operation (e.g., SW3 as 2.5 A) or dual independent outputs (SW3A/SW3B at 1.25 A each), enabling flexible rail allocation for processor core, IO, and memory domains.
Control logic includes OTP-mapped startup sequence, dynamic voltage scaling (PWM/PFM/APS modes), and real-time fault detection (OCP, thermal interrupts THERM110I–THERM130I). The I²C interface (SCL/SDA, 3.6 V tolerant) enables runtime reconfiguration of output voltages, timing, and power modes-Standby, Sleep, and Off-with dedicated signals (PWRON, STANDBY, RESETBMCU, SDWNB).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V main supply (VIN); supports brown-out recovery down to 1.8 V with +50 µA quiescent penalty |
| Buck Regulator Outputs | Up to 4 channels: SW1A/B (0.3–1.875 V, 2.5 A), SW2 (0.4–3.3 V, 1.5 A), SW3A/B (0.4–3.3 V, configurable 2.5 A or 1.25 A ×2) |
| Boost Regulator | SWBST: 5.0–5.15 V, 600 mA, USB OTG-capable with PFM/Auto mode and OCP interrupt |
| LDO Outputs | 6 programmable LDOs: VGEN1 (0.8–1.55 V, 100 mA), VGEN2 (0.8–1.55 V, 250 mA), VGEN3–VGEN6 (1.8–3.3 V, 100–350 mA) |
| VREFDDR & VSNVS | VREFDDR: 0.6–0.9 V, 10 mA DDR termination reference; VSNVS: 1.0–3.0 V, 400 µA SNVS/SRTC supply with coin-cell charging |
| Quiescent Current | 7.0 µA max in coin-cell mode (VIN = 0 V); 525 µA max in Standby mode (all rails active, no boost load) |
| Thermal Protection | Four programmable thresholds: THERM110I (100–120 °C), THERM120I (110–130 °C), THERM125I (115–135 °C), THERM130I (120–140 °C); shutdown at 130–150 °C |
Pinout & Package
Package: 56-pin QFN 8×8 mm, 0.5 mm pitch, EP suffix (E-type), wettable flank not applicable - this variant uses standard QFN with exposed thermal pad (EP) tied to GNDREF for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 INTB | Digital interrupt output | Open-drain signal to processor indicating fault or status event (e.g., thermal warning, OCP) |
| 3 RESETBMCU | Digital reset/power-good output | Open-drain reset to MCU; configurable as Power Good when pulled up to VSNVS |
| 14 SW1VSSSNS | Analog ground reference | Ground return for SW1A/B buck regulators; must connect externally to GNDREF via board plane |
| 32 SW3VSSSNS | Analog ground reference | Ground return for SW3A/B buck regulators; connects externally to GNDREF |
| 48 GNDREF | Main analog ground reference | Reference for bandgap, VCOREREF, and internal bias; ties to PCB ground plane |
| 56 PWRON | Digital enable input | Processor-driven power-on/off control; VIH ≥ 0.8×VSNVS, VIL ≤ 0.2×VSNVS |
| EP | Thermal ground pad | Exposed pad functions as ground return for all buck regulators; requires vias to inner/external GND planes |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | One-Time Programmable memory stores power-up order, timing delays, and voltage ramp rates-enables deterministic boot without host firmware intervention |
| Dual-mode buck regulation (PWM/PFM) | Enables high-efficiency light-load operation (PFM) and low-noise full-load performance (PWM); headroom ≥300 mV required for PFM stability |
| VREFDDR with VHALF/VINREFDDR inputs | Provides precision 0.6–0.9 V DDR termination reference; accepts half-supply (VHALF) or direct input (VINREFDDR) for flexible system-level sourcing |
| Coin-cell charger with VSNVS switchover | Automatically switches SNVS domain to coin cell during main supply loss; charges Li-cell at regulated current while maintaining <7 µA standby draw |
| I²C register-mapped control | Full configuration of voltages, sequencing, fault masks, and thermal thresholds via standard I²C (SCL/SDA, 3.6 V tolerant, open-drain) |
| Thermal interrupt granularity | Four independent thermal alerts (THERM110I–THERM130I) allow staged system response-e.g., throttle CPU before shutdown |
Applications
| i.MX 6-Based Industrial Tablet | Medical Monitoring Device |
|---|---|
|
Use Scenario: Portable tablet running i.MX 6SoloLite with LCD display, Wi-Fi, audio codec, and battery-backed RTC. IC Role / Device Role / Timing Role: Central PMIC supplying VCOREDIG (1.5 V), VCORE (3.6 V), VREFDDR (0.75 V), VGEN2 (1.2 V for audio), and VGEN4 (3.3 V for Wi-Fi), with sequenced startup and coin-cell backup. Use Value: Enables single-chip power solution eliminating discrete DC-DC/LDO count; OTP programming ensures repeatable boot timing across production units. |
Use Scenario: Battery-powered ECG monitor requiring ultra-low-power sleep mode and reliable RTC wake-up during patient monitoring. IC Role / Device Role / Timing Role: Provides VSNVS (1.2 V) from coin cell during main battery removal, maintains DDR retention via VREFDDR, and delivers <7 µA coin-cell quiescent current. Use Value: Guarantees >1-year RTC backup life on CR2032; thermal interrupts prevent sensor drift during extended operation in warm environments. |
| Home Energy Management Gateway | Automotive Infotainment Cluster |
|
Use Scenario: Wall-mounted gateway with Zigbee, Ethernet, and local storage, operating continuously in residential environments (-40 to 85 °C). IC Role / Device Role / Timing Role: Powers i.MX 6DualLite core (VCOREDIG/VCORE), NAND flash (VGEN1), Ethernet PHY (VGEN4), and DDR (VREFDDR), with thermal protection at 125 °C junction limit. Use Value: RθJA = 15 °C/W (8-layer board) enables passive cooling; Standby current of 525 µA extends battery backup duration during grid outages. |
Use Scenario: HUD/instrument cluster using i.MX 6Solo with MIPI-DSI display, CAN interface, and audio amplifiers. IC Role / Device Role / Timing Role: Supplies SWBST (5.0 V for USB OTG diagnostics), VGEN3 (3.3 V for CAN transceiver), VGEN6 (3.3 V for audio amp), and VREFDDR for LPDDR2. Use Value: Boost regulator meets USB OTG spec without external circuitry; I²C reconfiguration allows firmware updates to rail voltages without hardware change. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMPF0200F3AEPR2 | Pre-programmed for i.MX 6SX-SDB reference design; different OTP startup sequence and default VGENx voltages | Optimized for i.MX 6SoloX, not i.MX 6SoloLite/DualLite; lacks F0-specific timing for legacy i.MX 6 boot ROM | Select only if targeting i.MX 6SoloX-based designs with identical 56-QFN footprint and thermal profile |
| MMPF0200F0ANESR2 | Same OTP configuration (F0) but WF-type QFN (wettable flank) package; rated for -40 to 105 °C ambient | Extended temperature range suits under-hood automotive or industrial enclosures; identical electrical specs and pinout | Choose for applications requiring >85 °C ambient operation; no PCB redesign needed beyond solder paste profile adjustment |
Compared with MMPF0200F3AEPR2, the MMPF0200F0AEPR2 provides guaranteed compatibility with i.MX 6SoloLite/DualLite boot ROM sequences, while MMPF0200F0ANESR2 extends thermal capability without altering functionality-making the latter ideal for harsh-environment drop-in upgrades.
Availability
MMPF0200F0AEPR2 is available at Aetrix Electronics and suitable for industrial tablets, medical monitoring devices, and home energy gateways requiring stable component supply, long-term lifecycle support, and pre-validated i.MX 6 power sequencing.
Supply support for MMPF0200F0AEPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.
The PF0200 product line was engineered specifically to deliver complete, OTP-configurable power solutions for NXP's i.MX 6 family-reducing external component count, ensuring boot reliability, and enabling rapid system integration through reference designs and factory-programmed variants.
FAQ
What is the primary processor family supported by the MMPF0200F0AEPR2?
The MMPF0200F0AEPR2 is explicitly designed for NXP's i.MX 6 series, with pre-validated support for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite processors. Its OTP configuration (F0) matches the power sequencing and voltage requirements defined in the i.MX 6 reference boot flow, ensuring deterministic initialization without host software intervention. This makes the MMPF0200F0AEPR2 unsuitable as a generic PMIC for non-i.MX 6 platforms without extensive reprogramming and validation.
Does the MMPF0200F0AEPR2 require external components for basic operation?
Yes-the MMPF0200F0AEPR2 requires external passive components for stable operation: input/output ceramic capacitors (e.g., 4.7 µF + 0.1 µF on SWxIN pins, 2.2–4.7 µF on VGENx outputs), inductors for each buck channel, and feedback resistors for adjustable regulators. The datasheet specifies minimum values per pin (e.g., 4.7 µF on SW1AIN), and omitting these compromises regulation accuracy, transient response, and thermal performance. No external clock or programming hardware is needed-the 16 MHz internal oscillator and OTP eliminate those dependencies.
How does the coin-cell backup function in the MMPF0200F0AEPR2?
In the MMPF0200F0AEPR2, the LICELL pin accepts a 1.8–3.3 V coin cell (e.g., CR2032) and charges it via an internal linear charger. When main supply (VIN) drops below UVDET (~2.65 V), the device automatically switches VSNVS output to the coin cell, sustaining RTC and SNVS domain operation. Quiescent current in this mode is ≤7.0 µA at 25 °C, enabling multi-year backup life. Critical note: RESETBMCU pull-up to VSNVS adds up to 30 µA-external switching is recommended for i.MX 6 designs to avoid excess drain.
Can the MMPF0200F0AEPR2 be reprogrammed after initial OTP configuration?
No-the OTP (One-Time Programmable) memory in the MMPF0200F0AEPR2 is permanently written during factory programming and cannot be altered in the field. The F0 suffix indicates a fixed configuration optimized for i.MX 6SoloLite/DualLite boot sequences. For prototyping or custom sequencing, NXP offers non-programmed variants (e.g., MMPF0200NPAEP) that support "Try Before Buy" I²C-based configuration testing prior to final OTP burn. Once programmed, the MMPF0200F0AEPR2 operates with immutable startup behavior.
What thermal protection features are implemented in the MMPF0200F0AEPR2?
The MMPF0200F0AEPR2 integrates four programmable thermal interrupt thresholds-THERM110I (100–120 °C), THERM120I (110–130 °C), THERM125I (115–135 °C), and THERM130I (120–140 °C)-each generating dedicated interrupt signals to the host processor. A final thermal shutdown activates at 130–150 °C with 8 ms debounce. These thresholds are monitored via the INTSENSE0 register and enable staged system responses (e.g., CPU throttling at THERM120I, forced shutdown at THERM130I), protecting both the PMIC and downstream silicon.
MMPF0200F0AEPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 11
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-HVQFN (8x8)
MMPF0200F0AEPR2 FAQ
1.How can I place an order for MMPF0200F0AEPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0200F0AEPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0200F0AEPR2 reliable?
The price and inventory of MMPF0200F0AEPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0200F0AEPR2 is usually 5 days.
3.What payment methods are accepted for MMPF0200F0AEPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0200F0AEPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0200F0AEPR2?
MMPF0200F0AEPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0200F0AEPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0200F0AEPR2?
For technical support, including MMPF0200F0AEPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0200F0AEPR2 requirements.
6.How does Aetrix verify that MMPF0200F0AEPR2 is sourced from the original manufacturer or authorized distributors?
All MMPF0200F0AEPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0200F0AEPR2 meets industry standards.
7.What is the process for return or replacement of MMPF0200F0AEPR2?
All MMPF0200F0AEPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0200F0AEPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0200F0AEPR2 part is unused and in its original packaging.
Return procedure for MMPF0200F0AEPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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