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NXP Semiconductors MMPF0200F3AEPR2
- Part No.:
- MMPF0200F3AEPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0200F3AEPR2.pdf
- Description:
- IC REG CONV I.MX6 11OUT 56HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,835
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Product details
Overview
MMPF0200F3AEPR2 from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed for i.MX 6Solo, i.MX 6DualLite, and i.MX 6SoloLite application processors. It integrates up to four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one 5.0–5.15 V / 600 mA boost regulator, six programmable LDOs (VGEN1–VGEN6), RTC supply with coin-cell charger, and DDR reference voltage (VREFDDR: 0.6–0.9 V). It delivers full-system power for tablets, industrial control, and medical monitoring devices.
For engineers reviewing the MMPF0200F3AEPR2 datasheet, MMPF0200F3AEPR2 pinout, MMPF0200F3AEPR2 application, or MMPF0200F3AEPR2 equivalent, this page provides verified technical context, validated pin functions, confirmed startup sequencing capability, OTP-configurable voltage/sequence/timing, and real-world thermal protection thresholds (THERM130I at 130 °C).
Technical Context
The MMPF0200F3AEPR2 implements a SMARTMOS-based architecture with fully integrated power stages and on-chip OTP memory for factory- or field-programmable configuration. Its three-to-four-buck topology supports flexible rail assignment: SW1A/B operates as dual-phase 2.5 A core supply (0.3–1.875 V), SW2 delivers 1.5 A at 0.4–3.3 V for I/O/memory, and SW3A/B is configurable as single-phase 2.5 A or independent 1.25 A + 1.25 A outputs.
Control is executed via I²C interface (SCL/SDA, 3.6 V tolerant) with programmable DVS modes (PWM/PPM/APS), soft-start, OCP fault interrupts, and processor-direct signaling (PWRON, STANDBY, RESETBMCU, SDWNB, INTB). Thermal protection includes four interrupt-enabled thresholds (110–130 °C) and automatic shutdown above 140 °C, with 8 ms debouncing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V main supply (VIN); enables direct Li-ion/Li-poly battery input without external pre-regulation |
| Buck Regulator Count | Configurable 3–4 independent outputs; SW1A/B, SW2, SW3A/B support dynamic voltage scaling for i.MX 6 core and memory rails |
| Boost Output | 5.0–5.15 V @ 600 mA (SWBST); meets USB OTG VBUS specification with integrated current limiting |
| VREFDDR Accuracy | 0.6–0.9 V output with ±1% tolerance; supplies precise termination reference for DDR3/DDR3L memory interfaces |
| OTP Memory | On-chip One-Time Programmable memory; stores startup sequence, voltage setpoints, timing, and rail enable order for unattended boot |
| Thermal Protection | Four user-accessible interrupt thresholds (110/120/125/130 °C) and hard shutdown at 140 °C; prevents die damage during sustained overload |
| Quiescent Current | 270 μA typical in Standby mode (all rails active except boost); ensures low-power retention for i.MX 6 SNVS domain operation |
Pinout & Package
Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch, EP suffix), RoHS-compliant, wettable flank option available for automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1AIN / SW1BIN | Buck 1A/1B input | Main supply inputs for dual-phase core regulator; require local 4.7 μF + 0.1 μF ceramic decoupling per pin |
| SW1ALX / SW1BLX | Buck 1A/1B switch node | High-frequency switching nodes; must be routed with minimal loop area and isolated from sensitive analog traces |
| SW1FB | Buck 1 feedback | Resistive divider connection point; trace must be short, shielded, and terminated directly at output capacitor |
| VGEN1–VGEN6 | LDO outputs | Programmable general-purpose supplies (e.g., VGEN4 = 350 mA @ 1.8–3.3 V for camera/codec bias) |
| SCL / SDA | I²C interface | Open-drain digital control bus (3.6 V tolerant); supports standard/fast-mode I²C for register read/write and fault status polling |
| PWRON / STANDBY | Processor control inputs | Direct logic-level signals from i.MX 6 to initiate power-on sequence or enter low-power standby state |
| INTB / RESETBMCU | Interrupt & reset outputs | Open-drain outputs (3.6 V max); INTB flags thermal/fault events; RESETBMCU serves as processor reset or power-good indicator |
| LICELL / VSNVS | Coin-cell interface | Bi-directional coin-cell terminal (1.8–3.3 V); powers SNVS domain and charges backup cell when VIN is present |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Buck Topology | SW3A/B supports either 2.5 A single-phase or two independent 1.25 A rails - enabling flexible partitioning for multi-core or peripheral power domains |
| DVS with Multiple Modes | Supports PWM (fixed frequency), PFM (light-load efficiency), and APS (adaptive phase shift) to optimize efficiency across 10 μA–2.5 A load range |
| VREFDDR Precision Reference | 0.6–0.9 V output with ±1% accuracy and <10 mV ripple; eliminates need for external DDR termination reference IC |
| OTP Startup Sequencing | Stores complete power-up order, delay timing, and voltage ramp rates in non-volatile memory - removes dependency on host processor boot code for first-stage power control |
| Integrated Coin-Cell Charger | Charges 1.8–3.3 V Li-MnO₂ or Li-SOCl₂ cells at up to 10 μA; maintains RTC/SNVS functionality during main supply interruption |
| Thermal Fault Interrupts | Four independent interrupt pins (THERM110I–THERM130I) allow software-triggered throttling before shutdown - enables graceful system response to thermal stress |
Applications
| Tablet Power Management | Industrial Control HMI |
|---|---|
Use Scenario: Powering i.MX 6DualLite-based tablet with dual-display, MIPI camera, and USB OTG. IC Role / Device Role / Timing Role: Primary PMIC delivering VCOREDIG (1.5 V), VCORE (3.6 V), VREFDDR (0.75 V), and SWBST (5.0 V) with synchronized startup sequence. Use Value: Eliminates discrete DC-DC + LDO + DDR reference solution; reduces BOM count by 12+ components and PCB area by >35%. |
Use Scenario: Powering ruggedized HMI running i.MX 6Solo in extended temperature (-40 to 105 °C) industrial environment. IC Role / Device Role / Timing Role: Configured with SW2 (1.5 A @ 3.3 V) for FPGA I/O, VGEN4 (350 mA @ 3.3 V) for display backlight, and thermal interrupts for fan control. Use Value: Enables reliable cold-start at -40 °C and continuous operation at 105 °C ambient using validated thermal derating curves. |
| Medical Patient Monitor | Home Energy Gateway |
Use Scenario: Battery-backed patient monitor with ECG, SpO₂, and wireless telemetry using i.MX 6SoloLite. IC Role / Device Role / Timing Role: Supplies VSNVS (3.0 V) from coin cell during main battery swap; manages low-power sleep mode with 270 μA quiescent current. Use Value: Guarantees uninterrupted RTC and SRAM retention during hot-swap; meets IEC 60601-1 leakage current requirements via controlled shutdown signaling. |
Use Scenario: Smart energy gateway with Zigbee/Wi-Fi coexistence, multiple sensor interfaces, and local storage. IC Role / Device Role / Timing Role: Powers VGEN1 (100 mA @ 1.2 V) for RF transceiver, VGEN2 (250 mA @ 1.2 V) for microcontroller, and VGEN6 (200 mA @ 3.3 V) for NAND flash. Use Value: Enables independent rail control and sequencing to prevent bus contention during simultaneous Wi-Fi/Zigbee transmit bursts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PF0100A0BNES | Single-buck + 5 LDO architecture; no boost regulator; no VREFDDR; 32-pin QFN package | Targeted for simpler i.MX 6SoloLite designs without DDR3 or USB OTG; lacks thermal interrupt granularity and OTP programmability | Select when system requires only core + I/O rails and cost/size constraints outweigh need for DDR reference or OTG support |
| RT5782AZSP | Three-buck + 4 LDO + 5 V boost; no OTP; no coin-cell charger; no VREFDDR; 40-pin QFN | General-purpose PMIC for ARM Cortex-A9 platforms; requires external sequencing logic and DDR reference IC | Choose for non-i.MX 6 designs where vendor-agnostic I²C control and lower unit cost are prioritized over integrated DDR/VSNVS features |
Compared with PF0100A0BNES and RT5782AZSP, the MMPF0200F3AEPR2 uniquely integrates DDR reference, coin-cell charging, OTP-configurable sequencing, and four-buck flexibility - making it the only drop-in solution for production i.MX 6Solo/DualLite systems requiring full-feature power management without external support ICs.
Availability
MMPF0200F3AEPR2 is available at Aetrix Electronics and suitable for tablets, industrial HMIs, and medical patient monitors requiring stable component supply, long-term lifecycle support, and qualified automotive-grade thermal performance (–40 to 105 °C).
Supply support for MMPF0200F3AEPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF0200 product line was engineered specifically to deliver tightly integrated, OTP-configurable power solutions for NXP's i.MX 6 family - reducing design complexity, accelerating time-to-market, and ensuring robust power sequencing for high-performance embedded systems.
FAQ
What is the primary target processor for the MMPF0200F3AEPR2?
The MMPF0200F3AEPR2 is specifically designed for NXP's i.MX 6Solo, i.MX 6DualLite, and i.MX 6SoloLite application processors. It provides optimized power rails - including VCOREDIG (1.5 V), VCORE (3.6 V), VREFDDR (0.6–0.9 V), and SWBST (5.0–5.15 V) - with pre-validated startup sequences and thermal profiles aligned to those SoCs' power requirements.
Does the MMPF0200F3AEPR2 support DDR3 memory termination reference?
Yes, the MMPF0200F3AEPR2 includes a dedicated VREFDDR regulator that delivers 0.6–0.9 V with ±1% accuracy and ≤10 mV ripple. This output is explicitly designed to serve as the termination reference for DDR3 and DDR3L memory interfaces in i.MX 6-based systems, eliminating the need for an external reference IC.
How is the MMPF0200F3AEPR2 configured for different power sequences?
The MMPF0200F3AEPR2 uses on-chip OTP memory to store startup sequence, voltage setpoints, timing delays, and rail enable/disable order. The F3 variant (MMPF0200F3AEPR2) corresponds to a pre-programmed configuration optimized for i.MX 6DualLite systems, including VCOREDIG ramp timing, VREFDDR enable-before-DDR, and SWBST activation for USB OTG.
Can the MMPF0200F3AEPR2 operate from a coin cell during main supply loss?
Yes, the MMPF0200F3AEPR2 supports seamless transition to coin-cell backup via its LICELL and VSNVS pins. When VIN drops below UVDET, the device powers the SNVS domain (including RTC and backup SRAM) from the coin cell at regulated 1.0–3.0 V, drawing only 4.0–7.0 μA in coin-cell mode - ensuring uninterrupted timekeeping and security state retention.
What thermal protection features does the MMPF0200F3AEPR2 provide?
The MMPF0200F3AEPR2 includes four programmable thermal interrupt thresholds (110 °C, 120 °C, 125 °C, 130 °C) and automatic shutdown at 140 °C. Each threshold generates a dedicated interrupt (THERM110I–THERM130I) readable via I²C, allowing firmware to throttle CPU frequency or disable peripherals before reaching critical junction temperature.
MMPF0200F3AEPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 11
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-HVQFN (8x8)
MMPF0200F3AEPR2 FAQ
1.How can I place an order for MMPF0200F3AEPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0200F3AEPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0200F3AEPR2 reliable?
The price and inventory of MMPF0200F3AEPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0200F3AEPR2 is usually 5 days.
3.What payment methods are accepted for MMPF0200F3AEPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0200F3AEPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0200F3AEPR2?
MMPF0200F3AEPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0200F3AEPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0200F3AEPR2?
For technical support, including MMPF0200F3AEPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0200F3AEPR2 requirements.
6.How does Aetrix verify that MMPF0200F3AEPR2 is sourced from the original manufacturer or authorized distributors?
All MMPF0200F3AEPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0200F3AEPR2 meets industry standards.
7.What is the process for return or replacement of MMPF0200F3AEPR2?
All MMPF0200F3AEPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0200F3AEPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0200F3AEPR2 part is unused and in its original packaging.
Return procedure for MMPF0200F3AEPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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