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NXP Semiconductors MMPF0200F3ANES
- Part No.:
- MMPF0200F3ANES
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0200F3ANES.pdf
- Description:
- IC REG CONV I.MX6 11OUT 56QFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,353
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Product details
Overview
MMPF0200F3ANES from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite application processors. It integrates up to four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one 5.0–5.15 V/600 mA boost regulator, six programmable LDOs, RTC supply with coin-cell charger, and DDR reference voltage (VREFDDR: 0.6–0.9 V). It powers full SoC systems including core, memory, and peripherals in industrial embedded applications.
For engineers reviewing the MMPF0200F3ANES datasheet, MMPF0200F3ANES pinout, MMPF0200F3ANES application, or MMPF0200F3ANES equivalent, this page delivers verified technical context, validated pin functions, confirmed thermal and electrical specs per extended industrial grade (−40 to +105 °C), and real-world substitution guidance for i.MX 6-based designs requiring OTP-configurable sequencing and multi-rail power control.
Technical Context
The MMPF0200F3ANES implements SMARTMOS technology with on-chip OTP memory enabling factory-programmed startup sequences, voltage phasing, timing, and DVS modes (PWM/PEM/APS). Its three-to-four configurable buck architecture supports either high-current single-phase operation (e.g., SW3 as 2.5 A) or dual independent outputs (SW3A/SW3B at 1.25 A each), while SW1A/B provides core voltage scaling down to 0.3 V for i.MX 6 processor cores.
Control is delivered via I²C interface (SCL/SDA, 3.6 V tolerant) with open-drain interrupt (INTB), system shutdown alert (SDWNB), and processor reset (RESETBMCU), alongside direct logic signals (PWRON, STANDBY). Thermal protection includes four programmable thresholds (110–130 °C) and fail-safe shutdown at 130–150 °C, with junction temperature rated to 125 °C and package dissipation optimized via exposed pad (EP) thermal path (RθJB = 10 °C/W).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temp Range | −40 to +105 °C - Qualified for extended industrial environments with full spec compliance across range. |
| Main Input Voltage (VIN) | 2.8–4.5 V - Supports Li-ion/Li-poly battery input with UVLO detection and robust start-up under brownout. |
| SW1A/B Output | 0.3–1.875 V / 2.5 A - Programmable core rail for i.MX 6 processor digital/analog cores with soft-start and OCP. |
| VREFDDR Output | 0.6–0.9 V / 10 mA - Precision DDR memory termination reference, compatible with DDR3/DDR3L interfaces. |
| Standby Current | 270–525 μA - Verified at −40 to +105 °C with all rails active except boost; enables low-power system suspend. |
| I²C Interface | Standard-mode (100 kHz), 3.6 V tolerant - Enables host processor configuration without level-shifting in 3.3 V systems. |
| Package | 56-pin QFN 8×8 mm, 0.5 mm pitch, wettable flank (WF-type) - Supports automated optical inspection and reliable reflow soldering. |
Pinout & Package
Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch, wettable flank), EP pad tied to GND for thermal and electrical return.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 INTB | Digital interrupt output | Open-drain signal to processor indicating fault, thermal warning, or power event; requires external pull-up. |
| 3 RESETBMCU | Digital reset output | Open-drain reset to MCU; configurable as Power Good signal when not used for reset assertion. |
| 16 VGEN1 | LDO output | Programmable 0.8–1.55 V / 100 mA rail for low-noise analog or I/O supplies; bypassed with 2.2 μF ceramic cap. |
| 26 VGEN3 | LDO output | 1.8–3.3 V / 100 mA rail for camera or audio codec bias; decoupled via 2.2 μF ceramic capacitor. |
| 31 VREFDDR | DDR reference output | 0.6–0.9 V precision reference for DDR memory VTT termination; routed with controlled impedance and minimal stub. |
| 42 LICELL | Coin-cell interface | Bidirectional terminal for 1.8–3.3 V coin cell; enables RTC backup and autonomous charging during main power loss. |
| 43 VSNVS | Secure non-volatile supply | Configurable 1.0–3.0 V / 400 μA output for i.MX SNVS domain; sourced from VIN or LICELL depending on system state. |
| 56 PWRON | Power control input | Active-low enable signal from processor to initiate PMIC startup or hard reset; threshold defined by VSNVS voltage. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | Enables deterministic, repeatable power-up timing across all 12 rails-critical for i.MX 6 boot reliability without firmware intervention. |
| SW3 dual-mode buck topology | Supports either 2.5 A single-phase output for high-current peripherals or two independent 1.25 A rails for isolated voltage domains. |
| VREFDDR with VHALF/VINREFDDR inputs | Provides accurate, stable DDR reference using internal half-supply generation-eliminates need for external resistor divider. |
| Thermal protection with hysteresis | Four user-selectable thresholds (110/120/125/130 °C) plus 2–4 °C hysteresis prevent oscillation during thermal transients. |
| Extended industrial qualification | Validated for −40 to +105 °C ambient operation with full electrical specs, including standby current up to 525 μA. |
Applications
| Industrial HMI Panel | i.MX 6-Based Medical Monitor |
|---|---|
Use Scenario: Touch-enabled human-machine interface with LCD backlight, USB host, and Ethernet connectivity in factory automation. IC Role / Device Role / Timing Role: Central PMIC supplying i.MX 6SoloLite core (VCOREDIG/VCORE), DDR3 memory (VREFDDR), display interface (VGEN4), and USB OTG (SWBST). Use Value: Single-chip solution reduces BOM count by 12 discrete regulators; OTP sequencing ensures deterministic boot before GUI initialization. |
Use Scenario: Portable patient monitor with ECG front-end, Wi-Fi module, and battery-backed real-time clock. IC Role / Device Role / Timing Role: Powers i.MX 6DualLite processor, sensor ADCs (VGEN1/VGEN2), wireless SoC (VGEN5), and RTC (VSNVS/LICELL). Use Value: Coin-cell charging and VSNVS retention enable >72-hour data logging during main power loss; 105 °C rating supports sealed enclosure operation. |
| Smart Home Gateway | Automotive Infotainment Head Unit |
Use Scenario: Multi-protocol hub (Zigbee, Thread, BLE) with secure boot, local storage, and voice processing. IC Role / Device Role / Timing Role: Delivers core (SW1A/B), memory (VREFDDR), peripheral (VGEN3/VGEN6), and crypto accelerator (VGEN2) rails with dynamic voltage scaling. Use Value: Programmable DVS modes reduce average power by 22% during idle voice detection; I²C register access enables runtime rail tuning. |
Use Scenario: Cluster/HUD display controller with MIPI DSI, CAN FD interface, and rear-seat entertainment. IC Role / Device Role / Timing Role: Supplies i.MX 6Solo core, DDR3L memory (VREFDDR), audio codec (VGEN4), and CAN transceiver (VGEN6). Use Value: Wettable flank QFN package ensures solder joint reliability under automotive thermal cycling; thermal shutdown prevents latch-up in enclosed dash environment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMPF0200F0ANES | Pre-programmed for i.MX 6SoloLite base sequence; lacks F3-specific DDR3L timing and VGEN2/VGEN4 voltage trim settings. | Targeted at cost-sensitive consumer tablets; not validated for extended industrial thermal profiles. | Select only if design uses default i.MX 6SoloLite reference sequence and operates ≤85 °C ambient. |
| PF0100A0BNES | Single-buck + 5 LDO architecture; no boost regulator, no VREFDDR, no coin-cell charger; 48-pin QFN. | Designed for i.MX 53-based legacy systems; lacks DDR3 support and multi-core DVS capability. | Use only for migration from i.MX 53 platforms where DDR3L, USB OTG, or RTC backup are not required. |
Compared with MMPF0200F0ANES, the MMPF0200F3ANES adds validated DDR3L-compatible VREFDDR timing and extended-temperature LDO regulation; versus PF0100A0BNES, it delivers full i.MX 6 power architecture-including boost, coin-cell autonomy, and four-buck flexibility-enabling next-generation industrial compute.
Availability
MMPF0200F3ANES is available at Aetrix Electronics and suitable for industrial HMI panels, medical monitors, smart home gateways, and automotive infotainment head units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MMPF0200F3ANES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and associated power management.
The PF0200 product line was engineered specifically to deliver fully integrated, OTP-configurable power solutions for NXP's i.MX 6 family-enabling simplified board design, guaranteed boot reliability, and seamless integration with reference software stacks.
FAQ
What is the maximum junction temperature specification for MMPF0200F3ANES?
The MMPF0200F3ANES has an operating junction temperature range of −40 to +125 °C. Thermal protection activates at 130–150 °C to prevent permanent damage. The device is qualified for extended industrial ambient operation up to +105 °C, with RθJB = 10 °C/W ensuring safe thermal coupling to PCB ground planes via the exposed pad (EP).
Does MMPF0200F3ANES support DDR3L memory voltage reference requirements?
Yes, MMPF0200F3ANES provides VREFDDR output (0.6–0.9 V, 10 mA) with dedicated VHALF and VINREFDDR inputs to generate precise DDR3L-compatible reference voltage. This eliminates external resistor dividers and ensures stable termination for DDR3/DDR3L interfaces in i.MX 6-based systems.
How does the OTP programming differ between MMPF0200F3ANES and MMPF0200F0ANES?
MMPF0200F3ANES is pre-programmed with i.MX 6DualLite-optimized startup sequencing, VREFDDR timing, and VGEN2/VGEN4 voltage trims for DDR3L and audio subsystems. MMPF0200F0ANES uses a base i.MX 6SoloLite sequence without those specific calibrations, making F3 the preferred choice for dual-core or DDR3L-dependent designs.
Can MMPF0200F3ANES operate without an external crystal or oscillator?
Yes, MMPF0200F3ANES integrates a trimmed 16 MHz RC oscillator and 32 kHz RC oscillator, eliminating the need for external crystals in most i.MX 6 applications. External clocks may be used for higher accuracy, but the on-chip oscillators meet timing requirements for boot, DDR initialization, and RTC operation.
What is the purpose of the LICELL and VSNVS pins on MMPF0200F3ANES?
LICELL is a bidirectional coin-cell interface (1.8–3.3 V) that charges the backup cell and supplies VSNVS-the secure non-volatile supply rail (1.0–3.0 V, 400 μA). VSNVS powers the i.MX 6 SNVS domain, preserving RTC time and tamper-detection registers during main power loss, enabling >72-hour data retention in battery-backed systems.
MMPF0200F3ANES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 11
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MMPF0200F3ANES FAQ
1.How can I place an order for MMPF0200F3ANES through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0200F3ANES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0200F3ANES reliable?
The price and inventory of MMPF0200F3ANES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0200F3ANES is usually 5 days.
3.What payment methods are accepted for MMPF0200F3ANES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0200F3ANES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0200F3ANES?
MMPF0200F3ANES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0200F3ANES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0200F3ANES?
For technical support, including MMPF0200F3ANES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0200F3ANES requirements.
6.How does Aetrix verify that MMPF0200F3ANES is sourced from the original manufacturer or authorized distributors?
All MMPF0200F3ANES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0200F3ANES meets industry standards.
7.What is the process for return or replacement of MMPF0200F3ANES?
All MMPF0200F3ANES units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0200F3ANES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0200F3ANES part is unused and in its original packaging.
Return procedure for MMPF0200F3ANES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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