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NXP Semiconductors MMPF0200F3ANESR2

Part No.:
MMPF0200F3ANESR2
Manufacturer:
NXP Semiconductors
Category:
Special Purpose Regulators
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMMPF0200F3ANESR2.pdf
Description:
IC REG CONV I.MX6 11OUT 56QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,388

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Product details

Overview

MMPF0200F3ANESR2 from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed for i.MX 6Solo, i.MX 6DualLite, and i.MX 6SoloLite application processors. It integrates four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one 5.0–5.15 V/600 mA boost regulator, six programmable LDOs (VGEN1–VGEN6), RTC supply with coin-cell charger, DDR reference (VREFDDR: 0.6–0.9 V), and I²C-controlled dynamic voltage scaling - enabling full-system power delivery in industrial tablets and medical monitoring devices.

For engineers reviewing the MMPF0200F3ANESR2 datasheet, MMPF0200F3ANESR2 pinout, MMPF0200F3ANESR2 application, or MMPF0200F3ANESR2 equivalent, this page delivers verified electrical parameters, OTP-configurable sequencing, thermal protection thresholds (THERM110I–THERM130I), standby current (270–525 µA), and precise pin-level design meaning for layout-critical nodes like SW1ALX, VREFDDR, and LICELL.

Technical Context

The MMPF0200F3ANESR2 implements a SMARTMOS-based architecture with fully integrated power stages and on-chip OTP memory for factory- or field-programmable startup sequences, voltage rails, timing, and DVS profiles. Its three-to-four-buck configuration supports either high-current single-phase operation (e.g., SW3 as 2.5 A) or dual independent outputs (SW3A/SW3B at 1.25 A each), while SW1A/B operates in synchronous dual-phase mode for core voltage regulation.

Control logic includes I²C register mapping (SCL/SDA), processor interface signals (PWRON, STANDBY, RESETBMCU, SDWNB), and fault-aware power control with thermal interrupts (THERM110I–THERM130I), overcurrent protection, and UVLO detection. The VSNVS rail provides selectable 1.0–3.0 V output from VIN or coin cell, enabling secure non-volatile storage and RTC backup during main supply loss.

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range2.8–4.5 V main supply (VIN); supports brown-out recovery down to 1.8 V with +50 µA quiescent penalty
Buck Regulator OutputsSW1A/B: 0.3–1.875 V / 2.5 A; SW2: 0.4–3.3 V / 1.5 A; SW3A/B: 0.4–3.3 V / 2.5 A total (configurable single/dual phase)
Boost RegulatorSWBST: 5.0–5.15 V / 600 mA, USB OTG-compliant with PFM/Auto mode and OCP interrupt
LDO OutputsVGEN1: 0.8–1.55 V / 100 mA; VGEN2: 0.8–1.55 V / 250 mA; VGEN3–VGEN6: 1.8–3.3 V / 100–350 mA
VREFDDR Output0.6–0.9 V / 10 mA, precision DDR termination reference with VINREFDDR input and VHALF half-supply bias
Quiescent CurrentStandby mode: 270–525 µA (–40 to +105 °C); Sleep mode: 122–250 µA; Coin Cell mode: 4–7 µA at 25 °C
Thermal ProtectionFour programmable thresholds: THERM110I (100–120 °C), THERM120I (110–130 °C), THERM125I (115–135 °C), THERM130I (120–140 °C); shutdown at ≥130–150 °C

Pinout & Package

Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch, wettable flank – WF-type), exposed thermal pad (EP) tied to GNDREF for junction-to-board thermal resistance of 10 °C/W.

Pin/Terminal Circuit Role Design Meaning
SW1ALX / SW1BLXSwitch node (buck phase A/B)High-frequency switching node for SW1A/B regulator; requires low-inductance PCB routing and external LC filter
VREFDDR / VINREFDDR / VHALFDDR reference generation inputs/outputsVREFDDR delivers stable 0.6–0.9 V DDR termination voltage; VINREFDDR supplies input; VHALF provides half-supply bias for internal reference accuracy
LICELL / VSNVSCoin-cell interface & SNVS supplyLICELL accepts 1.8–3.3 V coin cell; VSNVS outputs 1.0–3.0 V (OTP-selectable) to i.MX SNVS domain, enabling RTC and tamper-proof memory during main power loss
PWRON / STANDBY / RESETBMCUProcessor power-control interfacePWRON initiates PMIC startup; STANDBY enables low-power retention; RESETBMCU serves as open-drain reset or power-good signal to processor
SCL / SDA / VDDIOI²C communication interfaceSCL/SDA operate at 1.7–3.6 V logic levels; VDDIO powers I²C bus and must be bypassed with 0.1 µF capacitor near pin

Key Features

Feature Design Value
OTP-configurable startup sequenceEnables deterministic, multi-rail power-up timing (e.g., VCORE before VGENx) without external sequencer hardware
Dual-mode buck regulators (PWM/PFM)SW1A/B, SW2, SW3A/B switch between high-efficiency PFM at light load and stable PWM at full load - critical for battery runtime in portable medical devices
VSNVS rail with coin-cell chargingProvides uninterrupted 1.0–3.0 V supply to i.MX SNVS domain and charges Li coin cells up to 3.3 V - essential for secure boot and RTC persistence
Integrated DDR reference (VREFDDR)Delivers ±1% accuracy 0.6–0.9 V reference directly to DDR memory termination, eliminating need for external resistor divider or dedicated reference IC
Thermal interrupt hierarchyFour independent THERMxxxI alerts (110–130 °C) allow staged system response - e.g., throttle CPU before initiating full shutdown
Configurable SW3 topologySingle 2.5 A phase for high-current core rails or split 1.25 A + 1.25 A for independent peripherals - maximizes flexibility across i.MX 6 variants

Applications

Industrial Tablet Power System Medical Patient Monitor

Use Scenario: Powering i.MX 6DualLite-based tablet with LCD display, Wi-Fi, and USB peripherals in factory automation environments.

IC Role / Device Role / Timing Role: MMPF0200F3ANESR2 delivers VCORE (1.2 V), VGEN4 (3.3 V for USB PHY), VREFDDR (0.75 V), and VSNVS (1.2 V) with synchronized startup and DVS-controlled core voltage scaling.

Use Value: Eliminates 8 discrete regulators and external sequencing logic; reduces BOM count by 60% and PCB area by 35% vs. discrete solution.

Use Scenario: Providing regulated, fail-safe power to i.MX 6SoloLite in bedside vital-sign monitors requiring continuous RTC and data logging during AC outage.

IC Role / Device Role / Timing Role: MMPF0200F3ANESR2 supplies VCOREDIG (1.5 V), VGEN2 (1.2 V for audio codec), VSNVS (3.0 V from coin cell), and VREFDDR (0.6 V for DDR3L) with thermal warning at 110 °C.

Use Value: Enables >72-hour coin-cell backup for SNVS domain and guarantees DDR integrity during brownouts via VREFDDR stability.

Home Energy Management Gateway Automotive Infotainment Cluster

Use Scenario: Powering i.MX 6Solo-based smart home hub with Zigbee, BLE, and Ethernet connectivity in uncontrolled ambient temperatures (–40 to +105 °C).

IC Role / Device Role / Timing Role: MMPF0200F3ANESR2 manages SW2 (1.8 V for Ethernet PHY), VGEN6 (3.3 V for RF module), and SWBST (5.0 V for USB host) with extended-temp qualified WF-package and thermal shutdown at 130 °C.

Use Value: Meets extended industrial temp grade without derating; eliminates need for external thermal sensor or fan control circuitry.

Use Scenario: Supplying i.MX 6DualLite in automotive cluster HUD with MIPI-DSI display, CAN interface, and audio amplifier - operating in under-dash thermal environment.

IC Role / Device Role / Timing Role: MMPF0200F3ANESR2 delivers VCORE (1.1 V), VGEN1 (1.0 V for GPU), VGEN3 (3.3 V for CAN transceiver), and SWBST (5.0 V for USB-C) with ESD-rated pins (±2 kV HBM) and wettable flank QFN for solder joint inspection.

Use Value: Supports automotive-grade reliability with validated 105 °C operation, robust ESD protection, and IPC-compliant solder joints.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative Part Technical Difference Application Difference Selection Advice
MMPF0200F4ANESPre-programmed OTP configuration optimized for i.MX 6Quad/Dual; different default VGENx voltages and sequencing orderTargeted at higher-core-count i.MX 6 variants requiring distinct VCORE ramp timing and VGEN4/VGEN6 current profilesSelect F4ANES only when using i.MX 6Quad/Dual with reference design i.MX6Q-SDB; F3ANES remains optimal for Solo/DualLite.
MMPF0200F0ANESBase OTP image with minimal pre-configuration; requires full custom programming via I²C before first useSuitable for designs needing unique rail combinations not covered by F3/F4 images - e.g., custom VREFDDR bias or SW3 dual-phase + SW2 PFM-only operationChoose F0ANES for maximum flexibility in prototyping or niche applications; F3ANES offers validated production-ready configuration for i.MX 6Solo/DualLite.

Compared with MMPF0200F4ANES and MMPF0200F0ANES, the MMPF0200F3ANESR2 provides out-of-box support for i.MX 6SoloLite/DualLite with optimized VCORE/VGEN2 sequencing, lower standby current (270 µA vs. 310 µA typical), and pre-validated DDR termination - reducing bring-up time by 3+ weeks.

Availability

MMPF0200F3ANESR2 is available at Aetrix Electronics and suitable for industrial tablets, medical monitoring systems, and home energy gateways requiring stable component supply across extended temperature ranges (–40 to +105 °C) and long-term lifecycle continuity.

Supply support for MMPF0200F3ANESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.

The PF0200 product line was engineered specifically to deliver complete, scalable power solutions for NXP's i.MX 6 family - integrating core, memory, peripheral, and backup rails into a single SMARTMOS PMIC with OTP configurability and industrial-grade thermal performance.

FAQ

What is the operating temperature range for the MMPF0200F3ANESR2?

The MMPF0200F3ANESR2 is rated for an extended industrial ambient temperature range of –40 °C to +105 °C, validated per Table 4 in the NXP PF0200 datasheet Rev. 8. This rating applies to the WF-type QFN package (wettable flank) and supports reliable operation in medical monitors and industrial gateways without thermal derating.

Does the MMPF0200F3ANESR2 support dynamic voltage scaling (DVS) for processor cores?

Yes, the MMPF0200F3ANESR2 supports DVS for VCOREDIG and VCORE rails via I²C-controlled PWM frequency, output voltage, and soft-start adjustment. DVS profiles are stored in OTP and executed during startup or runtime, enabling real-time core voltage adaptation for i.MX 6SoloLite/DualLite power optimization.

How does the coin-cell charging function work on the MMPF0200F3ANESR2?

The MMPF0200F3ANESR2 uses the LICELL pin to charge 1.8–3.3 V coin cells at up to 10 µA, powering the VSNVS rail (1.0–3.0 V, OTP-selectable) for i.MX SNVS domain backup. Charging occurs only when VIN is present and LICELL voltage is below threshold; VSNVS remains active during VIN loss to preserve RTC and secure memory.

What is the purpose of the VREFDDR, VINREFDDR, and VHALF pins on the MMPF0200F3ANESR2?

VREFDDR delivers a precision 0.6–0.9 V DDR termination reference; VINREFDDR supplies its input; VHALF provides a half-supply bias to stabilize internal reference generation. Together, they ensure ±1% VREFDDR accuracy across temperature and load - eliminating external components required in discrete DDR reference designs.

Can the MMPF0200F3ANESR2 be used with processors other than i.MX 6 series?

While the MMPF0200F3ANESR2 is optimized for i.MX 6SoloLite/DualLite (with pre-programmed sequencing and rail voltages), it can power other ARM-based SoCs if their voltage, current, sequencing, and interface requirements align. However, OTP configuration and I²C register mapping must be validated independently - no official support exists outside the i.MX 6 ecosystem.

MMPF0200F3ANESR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Converter, i.MX6
Voltage - Input:
2.8V ~ 4.5V
Number of Outputs:
11
Voltage - Output:
Multiple
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-QFN-EP (8x8)

MMPF0200F3ANESR2 FAQ

1.How can I place an order for MMPF0200F3ANESR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MMPF0200F3ANESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MMPF0200F3ANESR2 reliable?

The price and inventory of MMPF0200F3ANESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0200F3ANESR2 is usually 5 days.

3.What payment methods are accepted for MMPF0200F3ANESR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0200F3ANESR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MMPF0200F3ANESR2?

MMPF0200F3ANESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MMPF0200F3ANESR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MMPF0200F3ANESR2?

For technical support, including MMPF0200F3ANESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0200F3ANESR2 requirements.

6.How does Aetrix verify that MMPF0200F3ANESR2 is sourced from the original manufacturer or authorized distributors?

All MMPF0200F3ANESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0200F3ANESR2 meets industry standards.

7.What is the process for return or replacement of MMPF0200F3ANESR2?

All MMPF0200F3ANESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0200F3ANESR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MMPF0200F3ANESR2 part is unused and in its original packaging.

Return procedure for MMPF0200F3ANESR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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