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NXP Semiconductors MMPF0200F4AEP
- Part No.:
- MMPF0200F4AEP
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0200F4AEP.pdf
- Description:
- IC REG CONV I.MX6 11OUT 56HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:260
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Product details
Overview
MMPF0200F4AEP from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite application processors. It integrates four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one 600 mA boost regulator (5.0–5.15 V), six programmable LDOs (VGEN1–VGEN6), RTC supply with coin-cell charger, and DDR reference voltage (VREFDDR: 0.6–0.9 V). It powers full system rails including processor cores, memory, and peripherals in industrial control and medical monitoring systems.
For engineers reviewing the MMPF0200F4AEP datasheet, MMPF0200F4AEP pinout, MMPF0200F4AEP application, or MMPF0200F4AEP equivalent, key selection criteria include OTP-programmed startup sequence for i.MX 6 compatibility, dynamic voltage scaling support across three buck regulators, I²C-configurable rail voltages and timing, and thermal protection thresholds at 110 °C, 120 °C, 125 °C, and 130 °C.
Technical Context
The MMPF0200F4AEP implements a SMARTMOS-based architecture with fully integrated power devices and minimal external components. Its configuration is stored in on-chip One Time Programmable (OTP) memory-this specific variant (F4) is pre-programmed for optimized operation with i.MX 6Solo and i.MX 6DualLite processors, including defined power-up sequencing, voltage phasing, and DVS profiles.
It supports three operating modes-PWM, PFM, and APS-with programmable soft-start, current limiting, and OCP fault interrupts per buck channel. The VSNVS rail operates as either an LDO (1.0–3.0 V, 400 µA) or bypass switch, powered from VIN or coin cell, enabling secure non-volatile storage and RTC backup during main supply interruption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V - defines minimum battery voltage for reliable operation with Li-ion or Li-poly sources in portable embedded systems. |
| Buck Regulator Count | Configurable 3–4 channels - SW1A/B (2.5 A), SW2 (1.5 A), SW3A/B (2.5 A total or split 1.25 A each) enables flexible core/peripheral rail partitioning. |
| Boost Output | 5.0–5.15 V @ 600 mA - supports USB OTG host functionality without external boost circuitry. |
| VREFDDR Output | 0.6–0.9 V @ 10 mA - provides precision DDR memory termination reference compliant with JEDEC DDR3/DDR3L standards. |
| Quiescent Current (Standby) | 270–525 µA - enables low-power retention mode for i.MX 6 processors during system suspend with all LDOs active. |
| Thermal Protection Threshold | 130–150 °C - hardware-level shutdown prevents permanent damage under sustained overload or poor PCB thermal design. |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) - allows real-time rail reconfiguration and fault monitoring without dedicated control pins. |
Pinout & Package
Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch), E-type (full-lead), exposed thermal pad (EP) connected to GND for enhanced thermal dissipation (RθJB = 10 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1AIN / SW1BIN | Buck 1 input supply | Accepts 4.8 V max input; requires local 4.7 µF + 0.1 µF decoupling for stable high-current switching. |
| SW1ALX / SW1BLX | Buck 1 switch node | High-frequency switching nodes requiring tight layout, Kelvin routing, and minimized loop area to reduce EMI. |
| VGEN1–VGEN6 | Programmable LDO outputs | Deliver 100–350 mA at user-defined voltages (e.g., VGEN2: 0.8–1.55 V); each requires specified ceramic output capacitance. |
| VREFDDR / VINREFDDR | DDR reference generation | VREFDDR (0.6–0.9 V) sourced from VINREFDDR input; half-supply bias (VHALF) required for accuracy. |
| SCL / SDA | I²C control interface | Open-drain digital interface (3.6 V tolerant); VDDIO supply required for level translation and noise immunity. |
| INTB / RESETBMCU | System interrupt/reset | Open-drain outputs (3.6 V max); INTB signals faults (OCP, thermal), RESETBMCU serves as MCU reset or power-good indicator. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | Enables deterministic, repeatable power-up timing for i.MX 6 processors without firmware intervention-critical for boot reliability. |
| Dual-mode buck regulation (PWM/PFM) | Reduces light-load quiescent current by >50% vs. PWM-only operation while maintaining transient response for burst-mode processing. |
| VSNVS rail with coin-cell charger | Provides uninterrupted 1.0–3.0 V supply to SNVS domain and RTC; integrated charger maintains backup battery at optimal voltage without external circuitry. |
| Per-rail programmable soft-start | Prevents inrush current and supply droop during power-up-configurable independently for each buck/LDO to match processor core and IO sequencing requirements. |
| Thermal warning interrupts (THERM110I–THERM130I) | Four discrete interrupt flags allow software to initiate throttling or cooling actions before reaching critical shutdown threshold (150 °C). |
Applications
| Industrial Control HMI | Medical Patient Monitor |
|---|---|
Use Scenario: Touchscreen-based PLC interface with i.MX 6DualLite processor, DDR3 memory, and CAN/Ethernet connectivity. IC Role / Device Role / Timing Role: MMPF0200F4AEP supplies VCOREDIG (1.5 V), VGEN4 (3.3 V for peripherals), VREFDDR (0.75 V), and VSNVS (1.2 V) with synchronized startup and DVS during CPU load changes. Use Value: Eliminates need for 7 discrete regulators and reduces BOM count by 60%, while OTP-programmed sequencing ensures deterministic boot within 120 ms. | Use Scenario: Portable vital signs monitor with ECG, SpO₂, and display subsystems operating from single Li-ion cell. IC Role / Device Role / Timing Role: MMPF0200F4AEP delivers regulated rails to analog front-end (VGEN3: 3.3 V), digital controller (VCORE: 3.6 V), and memory (VREFDDR: 0.75 V), with coin-cell backup for RTC during battery swap. Use Value: Coin-cell charging and VSNVS LDO enable >10-year RTC retention; thermal interrupts prevent sensor drift during extended operation at ambient 40 °C. |
| Home Energy Gateway | Automotive Infotainment Head Unit |
Use Scenario: Smart meter gateway aggregating Zigbee, Wi-Fi, and cellular data with i.MX 6Solo processor and NAND flash. IC Role / Device Role / Timing Role: MMPF0200F4AEP powers i.MX 6Solo core (VCOREDIG), DDR3 (VREFDDR), and communication modules (VGEN2: 1.2 V for Wi-Fi, VGEN6: 3.3 V for cellular) with independent enable control. Use Value: Configurable PFM mode cuts standby current to 270 µA, extending battery life in grid-out scenarios beyond 72 hours. | Use Scenario: Rear-seat infotainment unit with HDMI display, audio codec, and USB OTG in automotive cabin environment. IC Role / Device Role / Timing Role: MMPF0200F4AEP supplies VCORE (3.6 V), VGEN1 (1.1 V for GPU), SWBST (5.1 V for USB OTG), and VREFDDR (0.8 V) with thermal monitoring up to 105 °C ambient. Use Value: Integrated 600 mA boost eliminates external DC-DC for USB host; thermal interrupts trigger display dimming before junction exceeds 125 °C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMPF0200F6AEP | Pre-programmed for i.MX 6SX-SDB reference design; includes additional VGENx configurations and updated OTP timing for i.MX 6SoloX. | Targeted at newer i.MX 6SoloX-based designs requiring higher DDR bandwidth and dual-display support. | Select F6AEP only when migrating to i.MX 6SoloX; F4AEP remains optimal for i.MX 6Solo/DualLite with validated reference designs. |
| PF0100A0BNES | Lower channel count (6-channel), no boost regulator, no coin-cell charger; 48-pin QFN package. | Designed for cost-sensitive i.MX 53 applications with simpler power trees and no USB OTG or RTC backup needs. | Use PF0100A0BNES only in legacy i.MX 53 designs; lacks DDR reference, boost, and thermal warning interrupts required by i.MX 6 platforms. |
Compared with MMPF0200F6AEP and PF0100A0BNES, the MMPF0200F4AEP offers the precise OTP configuration, thermal interrupt granularity, and DDR reference accuracy needed for production i.MX 6Solo/DualLite systems-making it the most directly supported and validated option for those processors.
Availability
MMPF0200F4AEP is available at Aetrix Electronics and suitable for industrial control HMIs, medical patient monitors, home energy gateways, and automotive infotainment head units requiring stable component supply, long-term lifecycle assurance, and NXP-validated power sequencing.
Supply support for MMPF0200F4AEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.
The PF0200 product line was engineered specifically to deliver complete, OTP-configurable power solutions for NXP's i.MX 6 family-enabling simplified system design, reduced validation effort, and guaranteed compatibility with reference hardware and BSPs.
FAQ
What is the operating temperature range for the MMPF0200F4AEP?
The MMPF0200F4AEP is rated for -40 °C to +85 °C ambient operation (Consumer qualification tier). Its junction temperature must remain within -40 °C to +125 °C, with thermal shutdown activating above 130–150 °C depending on configuration. This range supports deployment in enclosed industrial enclosures and medical devices without forced airflow.
Does the MMPF0200F4AEP require external programming after soldering?
No. The MMPF0200F4AEP is shipped with factory-programmed OTP memory configured for i.MX 6Solo and i.MX 6DualLite processors. No post-soldering programming is needed-startup sequence, rail voltages, timing, and DVS profiles are fixed and verified per NXP's F4 reference design.
Can the MMPF0200F4AEP support DDR3L memory voltage requirements?
Yes. The MMPF0200F4AEP's VREFDDR output is programmable from 0.6 V to 0.9 V at 10 mA, covering DDR3L standard VREF = 0.6 × VDDQ (e.g., 0.75 V for 1.35 V DDR3L). Its internal half-supply bias (VHALF) and VINREFDDR input ensure ±1% accuracy over temperature and load-meeting JEDEC DDR3L specification.
How does the coin-cell charger in the MMPF0200F4AEP operate?
The MMPF0200F4AEP's LICELL pin supports trickle charging of 1.8–3.3 V coin cells (e.g., CR2032) when main VIN is present. Charging current is internally limited and temperature-compensated; VSNVS output remains stable at user-selected voltage (1.0–3.0 V) to power i.MX 6's SNVS domain and RTC even during VIN removal-enabling seamless timekeeping during battery swaps.
Is the MMPF0200F4AEP pin-compatible with other PF0200 variants like MMPF0200F0AEP?
Yes. All PF0200 variants-including MMPF0200F4AEP, MMPF0200F0AEP, and MMPF0200F6AEP-share identical 56-pin QFN (8×8 mm) mechanical and electrical pinouts. Differences are confined to OTP content; no PCB redesign is required when substituting between F0/F4/F6 variants for i.MX 6 platform migration or qualification.
MMPF0200F4AEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 11
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-HVQFN (8x8)
MMPF0200F4AEP FAQ
1.How can I place an order for MMPF0200F4AEP through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0200F4AEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0200F4AEP reliable?
The price and inventory of MMPF0200F4AEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0200F4AEP is usually 5 days.
3.What payment methods are accepted for MMPF0200F4AEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0200F4AEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0200F4AEP?
MMPF0200F4AEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0200F4AEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0200F4AEP?
For technical support, including MMPF0200F4AEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0200F4AEP requirements.
6.How does Aetrix verify that MMPF0200F4AEP is sourced from the original manufacturer or authorized distributors?
All MMPF0200F4AEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0200F4AEP meets industry standards.
7.What is the process for return or replacement of MMPF0200F4AEP?
All MMPF0200F4AEP units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0200F4AEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0200F4AEP part is unused and in its original packaging.
Return procedure for MMPF0200F4AEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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