NXP Semiconductors MMPF0200F4ANESR2

Overview

MMPF0200F4ANESR2 from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite application processors. It integrates four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one 5.0–5.15 V / 600 mA boost regulator, six programmable LDOs (VGEN1–VGEN6), RTC supply with coin-cell charger, DDR reference (VREFDDR: 0.6–0.9 V), and I²C-controlled dynamic voltage scaling - enabling full-system power delivery in industrial control and medical monitoring applications.

For engineers reviewing the MMPF0200F4ANESR2 datasheet, MMPF0200F4ANESR2 pinout, MMPF0200F4ANESR2 application, or MMPF0200F4ANESR2 equivalent, key selection criteria include OTP-programmed startup sequence (F4 configuration), -40°C to +105°C extended industrial temperature rating, wettable-flank 56-QFN 8×8 mm package, and support for i.MX 6 processor-specific power sequencing and DDR memory termination.

Technical Context

The MMPF0200F4ANESR2 implements a SMARTMOS-based architecture with fully integrated power devices and minimal external components. Its three-to-four configurable buck channels support flexible core/peripheral rail partitioning: SW1A/B operates as dual-phase 2.5 A or independent 1.25 A outputs (0.3–1.875 V), SW2 delivers 1.5 A at 0.4–3.3 V, and SW3A/B is configurable as single-phase 2.5 A or split 1.25 A/1.25 A (0.4–3.3 V), all with programmable DVS modes (PWM/PEM/APS), soft-start, OCP, and frequency tuning.

Control logic centers on I²C register mapping with OTP-stored boot configuration (F4 variant), parallel GPIO interface (PWRON, STANDBY, RESETBMCU, SDWNB), and event-driven interrupt signaling (INTB). The device includes dedicated bias/reference blocks for 16 MHz master clock generation, trimmed bandgap (VCOREREF), VHALF-based VREFDDR regulation, and SNVS domain support via VSNVS (1.0–3.0 V, 400 µA) powered from VIN or LICELL with integrated coin-cell charging.

Key Specifications

Pinout & Package

Package: 56-pin QFN 8×8 mm with wettable flank (WF-type), 0.5 mm pitch, exposed thermal pad (EP) tied to GNDREF for enhanced thermal dissipation (R_θJB = 10 °C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with MMPF0200F0ANES and PF0100A0BNES, the MMPF0200F4ANESR2 uniquely supports i.MX 6DualLite's dual-core voltage sequencing, delivers 10 mA VREFDDR for DDR3L termination, and includes extended thermal thresholds (up to 130°C) essential for automotive cabin deployments.

Availability

MMPF0200F4ANESR2 is available at Aetrix Electronics and suitable for industrial control HMIs, medical vital signs monitors, home energy gateways, and i.MX 6-based in-vehicle infotainment systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MMPF0200F4ANESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.

The PF0200 product line delivers highly configurable, OTP-programmable PMICs optimized for NXP's i.MX 6 family of application processors - enabling complete system power delivery with minimal external components and processor-specific sequencing.

FAQ

What is the OTP configuration code for MMPF0200F4ANESR2, and how does it affect startup behavior?

The OTP configuration code "F4" in MMPF0200F4ANESR2 defines a pre-programmed startup sequence optimized for i.MX 6DualLite processors, including precise timing alignment between VCOREDIG and VGEN4 rails during power-up. This eliminates the need for external firmware initialization of power sequencing, reducing boot time by up to 120 ms compared to non-programmed variants. The F4 configuration also enables SW3A/B split-mode operation and locks thermal thresholds to THERM130I activation at 130°C.

Does MMPF0200F4ANESR2 support DDR3L memory termination, and what is the VREFDDR specification?

Yes, MMPF0200F4ANESR2 supports DDR3L memory termination via its integrated VREFDDR regulator, which delivers 0.6 V to 0.9 V with ±1% accuracy and 10 mA output current. This meets JEDEC JESD79-3F specifications for DDR3L VTT termination without external components. The VREFDDR block uses VHALF and VINREFDDR inputs to maintain stability under varying load conditions, and its output is directly connected to DDR memory VTT pins in reference designs for i.MX 6 platforms.

How does the coin-cell backup functionality work in MMPF0200F4ANESR2, and what is its quiescent current in that mode?

In MMPF0200F4ANESR2, the LICELL pin accepts 1.8–3.3 V coin-cell input to power the VSNVS rail (1.0–3.0 V selectable) for i.MX 6's SNVS domain during main supply loss. When VIN = 0 V and VSNVS is sourced from LICELL, the device draws only 4.0 µA typical quiescent current - verified across -40°C to +85°C. This enables >10-year RTC backup with standard CR2032 cells and supports secure boot persistence in medical and industrial alarm systems.

What thermal protection features are implemented in MMPF0200F4ANESR2, and how are they configured?

MMPF0200F4ANESR2 implements four programmable thermal thresholds (THERM110I, THERM120I, THERM125I, THERM130I) with 2–4°C hysteresis and 8 ms debounce. These are hard-coded in the F4 OTP configuration to activate at 110°C, 120°C, 125°C, and 130°C respectively. Threshold crossings generate interrupts readable via I²C register INTSENSE0, allowing host processors to throttle loads before reaching the 140°C thermal shutdown limit. The wettable flank QFN package ensures R_θJB = 10 °C/W for reliable heat transfer to PCB ground planes.

Can MMPF0200F4ANESR2 be used with processors other than i.MX 6, and what interface options are available for configuration?

While MMPF0200F4ANESR2 is optimized for i.MX 6SoloLite/Solo/DualLite processors, it can be used with other ARM-based SoCs via its standard I²C interface (100/400 kHz) and parallel GPIO control (PWRON, STANDBY, RESETBMCU). Configuration is performed through 256-byte I²C register map, supporting dynamic voltage scaling, rail enable/disable, fault masking, and mode selection. However, OTP-locked F4 startup sequence is i.MX 6-specific; non-i.MX designs require non-programmed NP variants or custom OTP programming to avoid timing conflicts.