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NXP Semiconductors MMPF0200F6AEP
- Part No.:
- MMPF0200F6AEP
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0200F6AEP.pdf
- Description:
- IC REG CONV I.MX6 11OUT 56HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:635
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Product details
Overview
MMPF0200F6AEP from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed specifically for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite application processors. It integrates up to four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one 5.0–5.15 V/600 mA boost regulator, six programmable LDOs (VGEN1–VGEN6), RTC supply with coin-cell charger, and DDR reference voltage (VREFDDR: 0.6–0.9 V). It powers full system rails including processor cores, memory, and peripherals in industrial and consumer embedded systems.
For engineers reviewing the MMPF0200F6AEP datasheet, MMPF0200F6AEP pinout, MMPF0200F6AEP application, or MMPF0200F6AEP equivalent, this page delivers verified technical context, confirmed pin functions, pre-programmed i.MX6SX-SDB reference design alignment, OTP-configurable sequencing, and real-world thermal/current behavior under Sleep, Standby, and Coin Cell modes.
Technical Context
The MMPF0200F6AEP implements a SMARTMOS-based architecture with fully integrated power devices and minimal external components. Its three-to-four configurable buck channels support dynamic voltage scaling (DVS) across PWM, PFM, and APS modes, with programmable soft-start, current limit, switching frequency, and OCP fault interrupts. The device uses on-chip OTP memory pre-programmed for the i.MX6SX-SDB reference design, enabling validated startup sequencing without runtime I²C configuration.
Power control logic includes dedicated processor interface signals (PWRON, STANDBY, RESETBMCU, SDWNB, INTB), dual-clock domains (16 MHz master + 32 kHz RTC), and thermal protection thresholds at 110 °C, 120 °C, 125 °C, and 130 °C with 2–4 °C hysteresis. VSNVS operates as an LDO or switch-supply (1.0–3.0 V, 400 µA) for SNVS/SRTC circuitry, powered from VIN or LICELL with integrated coin-cell charging.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V main supply - supports Li-ion/Li-poly battery input with UVLO protection |
| Core Buck Regulators | SW1A/B: 0.3–1.875 V / 2.5 A; SW2: 0.4–3.3 V / 1.5 A; SW3A/B: 0.4–3.3 V / 2.5 A total - enables DVS for i.MX6 CPU/GPU cores |
| Boost Regulator | SWBST: 5.0–5.15 V / 600 mA - provides USB OTG VBUS supply with PFM/Auto mode and OCP interrupt |
| LDO Outputs | VGEN1–VGEN6: 6 independent regulators (100–350 mA); VGEN4 = 350 mA max - powers audio codecs, cameras, sensors, and IO peripherals |
| VREFDDR Output | 0.6–0.9 V / 10 mA - supplies precise DDR memory termination reference, compatible with LPDDR2/LPDDR3 |
| Quiescent Current | Standby mode: 270–525 µA; Coin Cell mode: 4.0–7.0 µA - enables >1-year battery backup for RTC/SNVS retention |
| Thermal Protection | Four thresholds (110/120/125/130 °C) with 2–4 °C hysteresis and 8 ms debounce - fail-safe shutdown prevents die damage above 130 °C |
Pinout & Package
Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch, E-type, exposed pad). Thermal resistance RθJA = 28 °C/W (natural convection, 4-layer board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 INTB | Digital interrupt output | Open-drain signal to processor indicating fault, thermal warning, or power event - requires external pull-up |
| 3 RESETBMCU | Digital reset/power-good output | Configurable as open-drain reset to i.MX6 POR_B or power-good indicator - supports internal pull-up to VSNVS |
| 16 VGEN1 | Analog LDO output | 0.8–1.55 V / 100 mA regulated rail - bypassed with 2.2 µF ceramic capacitor for core logic or low-noise analog circuits |
| 26 VGEN3 | Analog LDO output | 1.8–3.3 V / 100 mA rail - powers camera interfaces or microphones requiring stable mid-range voltage |
| 31 VREFDDR | Analog DDR reference output | 0.6–0.9 V / 10 mA precision reference - routed with controlled impedance to DDR memory VREF pins |
| 42 LICELL | Analog coin-cell I/O | Bidirectional connection for 1.8–3.3 V coin cell - enables RTC backup and automatic charging when VIN is present |
| 43 VSNVS | Analog SNVS supply | 1.0–3.0 V / 400 µA output - powers i.MX6 Secure Non-Volatile Storage and Real-Time Clock circuitry |
| 56 PWRON | Digital enable input | Processor-driven power-on/off control - active-high signal initiating full PMIC startup or graceful shutdown sequence |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured startup sequence | Pre-programmed for i.MX6SX-SDB reference design - eliminates need for external configuration EEPROM or boot-time I²C writes |
| Configurable buck topology | SW3 supports single-phase (2.5 A) or dual-output (1.25 A + 1.25 A) mode - adapts to system-level current vs. rail count trade-offs |
| VREFDDR accuracy and drive | 0.6–0.9 V output with ±1% tolerance and 10 mA drive - meets JEDEC LPDDR2/LPDDR3 VREF specification for reliable memory operation |
| Low-power retention modes | Coin Cell mode draws only 4–7 µA at 25 °C - sustains RTC and SNVS state for >1 year on CR2032 battery |
| I²C register accessibility | Fully accessible I²C interface (SCL/SDA, 3.3 V tolerant) - enables runtime reconfiguration of voltages, sequencing, and fault responses |
| Thermal monitoring granularity | Four discrete interrupt thresholds (THERM110I–THERM130I) with status bits in INTSENSE0 - supports tiered thermal management in OS drivers |
Applications
| i.MX6-Based Industrial HMI | Medical Patient Monitor |
|---|---|
|
Use Scenario: Touchscreen HMI in factory automation panel with i.MX6Solo processor, Ethernet, CAN, and display interface. IC Role / Device Role / Timing Role: MMPF0200F6AEP supplies VCOREDIG (1.5 V), VCORE (3.6 V), VGEN4 (3.3 V for CAN transceiver), VREFDDR (0.75 V), and VSNVS (1.2 V) with synchronized startup timing per i.MX6SX-SDB spec. Use Value: Pre-programmed OTP eliminates firmware dependency for power sequencing; VGEN4's 350 mA rating ensures robust CAN bus termination under ESD stress. |
Use Scenario: Portable patient monitor with ECG, SpO₂, and LCD display powered by i.MX6DualLite, operating 24/7 on battery + AC adapter. IC Role / Device Role / Timing Role: MMPF0200F6AEP delivers VCORE (3.6 V), VGEN2 (1.2 V for ADC), VGEN6 (3.3 V for display driver), and VSNVS (3.0 V) with coin-cell backup during AC loss. Use Value: Coin Cell mode current ≤7 µA extends RTC/SNVS retention beyond 18 months; VGEN2's 250 mA capacity supports simultaneous analog sensor acquisition. |
| Smart Home Gateway | Automotive Infotainment Head Unit |
|
Use Scenario: Wi-Fi/Zigbee gateway using i.MX6SoloLite, running Linux with multiple peripheral interfaces and cloud connectivity. IC Role / Device Role / Timing Role: MMPF0200F6AEP powers VGEN1 (1.1 V for Wi-Fi SoC), VGEN3 (3.3 V for Zigbee module), VGEN5 (3.3 V for USB PHY), and VREFDDR (0.6 V) with independent enable control. Use Value: Six LDOs eliminate need for discrete regulators; VGEN1's 100 mA output meets IEEE 802.11n RF front-end bias requirements. |
Use Scenario: Rear-seat infotainment unit with i.MX6DualLite, HDMI output, MIPI-CSI camera input, and audio amplifier. IC Role / Device Role / Timing Role: MMPF0200F6AEP supplies SW1A/B (1.2 V CPU core), SW2 (3.3 V HDMI PHY), VGEN4 (3.3 V audio amp), and SWBST (5.1 V USB OTG) with thermal interrupts routed to MCU. Use Value: SWBST's 600 mA OTG capability powers USB storage devices; thermal interrupts at 120 °C trigger fan control before reaching critical junction temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMPF0200F0AEP | Same package and pinout; OTP programmed for generic i.MX6SoloLite reference design (no i.MX6SX-SDB alignment) | Lacks pre-validated timing for i.MX6SX-SDB; requires custom OTP programming or I²C initialization for same use case | Select when designing new i.MX6SoloLite platforms not tied to i.MX6SX-SDB layout or timing constraints |
| PF0100A0BNES | Legacy NXP PMIC; 5-channel (3 buck + 2 LDO), no VREFDDR, no coin-cell charger, WF-type QFN package | Insufficient rail count and missing DDR reference for i.MX6 family; limited to simpler i.MX53 or legacy designs | Only suitable for cost-sensitive, non-i.MX6 applications where DDR memory and RTC backup are not required |
Compared with MMPF0200F0AEP, the MMPF0200F6AEP offers out-of-box compatibility with i.MX6SX-SDB timing and layout; compared with PF0100A0BNES, it adds DDR reference, coin-cell charging, and two additional LDOs essential for modern i.MX6 system power integrity.
Availability
MMPF0200F6AEP is available at Aetrix Electronics and suitable for industrial HMI, medical monitoring, smart home gateways, automotive infotainment, and portable computing applications requiring stable component supply, long-term lifecycle support, and pre-validated i.MX6 power sequencing.
Supply support for MMPF0200F6AEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The PF0200 product line was engineered to deliver complete, scalable power management for NXP's i.MX 6 application processors, integrating high-efficiency conversion, flexible sequencing, and robust system-level protection in a single QFN package.
FAQ
What is the primary target processor for the MMPF0200F6AEP?
The MMPF0200F6AEP is specifically pre-programmed for the i.MX6SX-SDB reference design and optimized for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite application processors. Its OTP configuration matches the exact power-up sequence, voltage levels, and timing requirements defined in the i.MX6SX-SDB schematics and layout guidelines - ensuring plug-and-play integration without runtime I²C initialization. This makes MMPF0200F6AEP distinct from other PF0200 variants like F0AEP or F4AEP.
Does the MMPF0200F6AEP include DDR memory reference voltage support?
Yes, the MMPF0200F6AEP integrates a dedicated VREFDDR regulator delivering 0.6–0.9 V at up to 10 mA with ±1% accuracy. This output is explicitly designed to meet JEDEC specifications for LPDDR2 and LPDDR3 memory termination and is electrically isolated from other LDOs to minimize noise coupling. In the MMPF0200F6AEP, VREFDDR is configured via OTP to match i.MX6SX-SDB DDR interface requirements, including proper routing through VINREFDDR and VHALF reference inputs.
How does the coin-cell backup function in the MMPF0200F6AEP?
The MMPF0200F6AEP supports coin-cell backup via the LICELL pin (pin 42) and VSNVS output (pin 43), enabling continuous RTC and SNVS operation during main power loss. When VIN drops below UVLO, the device automatically switches VSNVS to LICELL supply and activates its integrated charger - applying regulated current to recharge the coin cell when VIN is restored. Quiescent current in Coin Cell mode is specified at 4.0–7.0 µA, supporting >1-year retention on a standard CR2032 battery.
What thermal protection features are implemented in the MMPF0200F6AEP?
The MMPF0200F6AEP incorporates four programmable thermal interrupt thresholds (THERM110I, THERM120I, THERM125I, THERM130I) with 2–4 °C hysteresis and 8 ms debouncing. These generate dedicated interrupt signals to the host processor and are readable via the INTSENSE0 register. Critical thermal shutdown activates at 130–150 °C (depending on process corner), protecting the die from permanent damage. All thresholds are calibrated and verified across -40 to 105 °C ambient range per the Extended Industrial qualification tier.
Is the MMPF0200F6AEP pin-compatible with other PF0200 variants?
Yes, all PF0200 variants - including MMPF0200F6AEP, MMPF0200F0AEP, and MMPF0200NPAEP - share identical 56-pin QFN (8×8 mm, 0.5 mm pitch) packaging and pinout. Mechanical and electrical pin compatibility is guaranteed across E-type (AEP) and WF-type (ANES) packages. However, OTP programming, thermal qualification tier (-40 to 85 °C vs. -40 to 105 °C), and pre-loaded reference design alignment differ - so while PCB layout is reusable, system-level validation must account for these functional distinctions in the MMPF0200F6AEP.
MMPF0200F6AEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 11
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-HVQFN (8x8)
MMPF0200F6AEP FAQ
1.How can I place an order for MMPF0200F6AEP through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0200F6AEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0200F6AEP reliable?
The price and inventory of MMPF0200F6AEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0200F6AEP is usually 5 days.
3.What payment methods are accepted for MMPF0200F6AEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0200F6AEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0200F6AEP?
MMPF0200F6AEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0200F6AEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0200F6AEP?
For technical support, including MMPF0200F6AEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0200F6AEP requirements.
6.How does Aetrix verify that MMPF0200F6AEP is sourced from the original manufacturer or authorized distributors?
All MMPF0200F6AEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0200F6AEP meets industry standards.
7.What is the process for return or replacement of MMPF0200F6AEP?
All MMPF0200F6AEP units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0200F6AEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0200F6AEP part is unused and in its original packaging.
Return procedure for MMPF0200F6AEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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