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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Special Purpose Regulators

NXP Semiconductors MMPF0200F6AEPR2

Name: MMPF0200F6AEPR2
Brand: NXP Semiconductors
SKU: MMPF0200F6AEPR2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MMPF0200F6AEPR2

Manufacturer:: NXP Semiconductors

Category:: Special Purpose Regulators

Package:: 56-VFQFN Exposed Pad

Datasheet:: MMPF0200F6AEPR2.pdf

Description:: IC REG CONV I.MX6 11OUT 56HVQFN

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Product details

Overview

MMPF0200F6AEPR2 from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite application processors. It integrates four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one 5.0–5.15 V/600 mA boost regulator, six programmable LDOs (VGEN1–VGEN6), RTC supply with coin-cell charger, and DDR reference voltage (VREFDDR: 0.6–0.9 V). It powers full system rails including processor cores, memory, and peripherals in industrial tablets and embedded control systems.

For engineers reviewing the MMPF0200F6AEPR2 datasheet, MMPF0200F6AEPR2 pinout, MMPF0200F6AEPR2 application, or MMPF0200F6AEPR2 equivalent, key selection criteria include OTP-programmed i.MX 6SX-SDB reference design compatibility, 56-pin QFN 8×8 mm wettable flank package, I²C-configurable sequencing, thermal protection thresholds (110–130 °C), and support for dynamic voltage scaling across core and I/O rails.

Technical Context

The MMPF0200F6AEPR2 implements a SMARTMOS-based architecture with fully integrated power devices and minimal external components. Its three-to-four configurable buck channels support flexible rail partitioning: SW1A/B operates as dual-phase (2.5 A) or independent outputs (1.25 A each), SW3A/B supports single-phase 2.5 A or split 1.25 A + 1.25 A operation, and SW2 delivers 1.5 A at 0.4–3.3 V. All buck regulators support PWM, PFM, and APS modes with programmable soft-start, current limit, and switching frequency.

Control logic centers on an I²C interface (SCL/SDA, 3.6 V tolerant) with OTP memory for persistent configuration, plus parallel GPIOs (PWRON, STANDBY, RESETBMCU, SDWNB, INTB) for direct processor handshaking. The device includes dedicated bias/reference blocks for 16 MHz master clock generation, trimmed bandgap (VCOREREF: 1.5 V), VHALF for VREFDDR, and thermal monitoring with four interrupt thresholds (THERM110I–THERM130I) and fail-safe shutdown at 130–150 °C.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	2.8–4.5 V main supply (VIN); supports brown-out detection and seamless coin-cell backup via LICELL (1.8–3.3 V)
Buck Regulator Outputs	Up to 4 independent rails: SW1A/B (0.3–1.875 V, 2.5 A), SW2 (0.4–3.3 V, 1.5 A), SW3A/B (0.4–3.3 V, 2.5 A total or split)
Boost Regulator	SWBST: 5.0–5.15 V output, 600 mA capability, USB OTG compliant with PFM/Auto mode and OCP fault interrupt
LDO Outputs	Six programmable LDOs: VGEN1 (0.8–1.55 V, 100 mA), VGEN2 (0.8–1.55 V, 250 mA), VGEN3–VGEN6 (1.8–3.3 V, 100–350 mA)
VREFDDR & VSNVS	VREFDDR: 0.6–0.9 V, 10 mA DDR termination reference; VSNVS: 1.0–3.0 V, 400 µA SNVS/SRTC supply with coin-cell charging
Thermal Protection	Four user-accessible thresholds (110/120/125/130 °C) with hysteresis; fail-safe shutdown at 130–150 °C, debounced 8 ms
Package & Environment	56-pin QFN 8×8 mm, 0.5 mm pitch, wettable flank (WF-type), -40 to 105 °C extended industrial operating range

Pinout & Package

Package: 56-pin QFN 8×8 mm, 0.5 mm pitch, wettable flank (WF-type), exposed thermal pad (EP) tied to GNDREF for thermal dissipation.

Pin/Terminal	Circuit Role	Design Meaning
1 INTB	Digital interrupt output	Open-drain signal to processor indicating fault or status event; requires external pull-up
3 RESETBMCU	Digital reset/power-good output	Open-drain reset to MCU; configurable as Power Good when not used for reset
55 SCL / 53 SDA	I²C control interface	3.6 V-tolerant bidirectional bus; enables full register read/write and OTP configuration
50 VIN / 48 GNDREF / 32 SW3VSSSNS	Main power input & ground references	VIN supplies all regulators; GNDREF and SWxVSSSNS pins provide dedicated low-noise ground returns per regulator
49 VCORE / 51 VCOREDIG / 52 VCOREREF	Analog/digital core supplies	VCORE (3.6 V) and VCOREDIG (1.5 V) power processor analog/digital domains; VCOREREF (1.5 V) is trimmed bandgap reference
31 VREFDDR / 29 VHALF / 30 VINREFDDR	DDR reference subsystem	VHALF provides half-supply for VREFDDR regulation; VINREFDDR supplies VREFDDR input; VREFDDR (0.6–0.9 V) drives DDR termination

Key Features

Feature	Design Value
Configurable Buck Architecture	Three-to-four independent buck outputs with SW1A/B and SW3A/B supporting dual-phase or split-rail operation for optimal current sharing or rail count expansion
OTP-Based Startup Sequencing	One-Time Programmable memory stores pre-verified power-up/down sequences and timing; F6 variant is factory-programmed for i.MX6SX-SDB reference design
Multi-Mode Regulation	Each buck supports PWM (fixed-frequency), PFM (light-load efficiency), and APS (adaptive phase shift) modes-enabling >90% efficiency across 10 µA–2.5 A load range
Integrated Coin-Cell Management	LICELL pin accepts 1.8–3.3 V coin cell; internal charger maintains VSNVS (1.0–3.0 V) during main supply loss, preserving RTC and secure non-volatile state
Thermal Intelligence	Four programmable interrupt thresholds (110–130 °C) feed real-time die temperature data to host processor; fail-safe shutdown prevents permanent damage above 130–150 °C
DDR Reference Accuracy	VREFDDR output regulated to ±1% over temperature and line/load, with dedicated VHALF and VINREFDDR pins minimizing noise coupling into DDR termination networks

Applications

i.MX 6-Based Industrial Tablets	Automotive Infotainment Head Units
Use Scenario: Powering i.MX 6DualLite SoC, LPDDR2 memory, MIPI camera, HDMI display, and USB peripherals in sealed, fanless tablet enclosures. IC Role / Device Role / Timing Role: Primary PMIC managing core voltage (VCOREDIG), memory I/O (VGEN4), DDR termination (VREFDDR), and always-on SNVS domain (VSNVS). Use Value: OTP-programmed F6 configuration ensures deterministic startup sequence matching i.MX6SX-SDB reference design, reducing validation time by eliminating custom firmware development.	Use Scenario: Supplying cluster/HUD processor, audio codec, CAN transceiver, and rear-seat infotainment in automotive cabin environments (-40 to 105 °C). IC Role / Device Role / Timing Role: Central power hub delivering regulated rails to multiple sub-systems while maintaining fail-safe RTC backup via LICELL during ignition cycling. Use Value: Extended industrial temperature rating (-40 to 105 °C) and thermal interrupt reporting enable robust operation under under-hood thermal stress without derating.
Medical Patient Monitoring Devices	Smart Home Energy Gateways
Use Scenario: Powering ECG/SpO₂ sensor front-end, ARM Cortex-A9 application processor, Wi-Fi module, and OLED display in battery-backed portable medical equipment. IC Role / Device Role / Timing Role: Dual-role power manager providing high-efficiency buck conversion for active operation and ultra-low-quiescent coin-cell mode (<7 µA) for long-term standby. Use Value: Coin-cell current of 4.0–7.0 µA (typ/max) at 25 °C enables multi-year battery life in sleep mode without compromising fast wake-up latency.	Use Scenario: Managing power for Zigbee/Z-Wave radio, ARM-based gateway SoC, Ethernet PHY, and local storage in residential energy management hubs. IC Role / Device Role / Timing Role: System-level PMIC coordinating power states across heterogeneous peripherals using I²C-controlled sequencing and individual rail enable/disable. Use Value: Six independent LDOs (VGEN1–VGEN6) allow isolated, noise-sensitive analog rails (e.g., RF bias) and digital I/O rails to be powered from optimized sources-reducing cross-talk and EMI.

i.MX 6-Based Industrial Tablets

Automotive Infotainment Head Units

Use Scenario: Powering i.MX 6DualLite SoC, LPDDR2 memory, MIPI camera, HDMI display, and USB peripherals in sealed, fanless tablet enclosures.

IC Role / Device Role / Timing Role: Primary PMIC managing core voltage (VCOREDIG), memory I/O (VGEN4), DDR termination (VREFDDR), and always-on SNVS domain (VSNVS).

Use Value: OTP-programmed F6 configuration ensures deterministic startup sequence matching i.MX6SX-SDB reference design, reducing validation time by eliminating custom firmware development.

Use Scenario: Supplying cluster/HUD processor, audio codec, CAN transceiver, and rear-seat infotainment in automotive cabin environments (-40 to 105 °C).

IC Role / Device Role / Timing Role: Central power hub delivering regulated rails to multiple sub-systems while maintaining fail-safe RTC backup via LICELL during ignition cycling.

Use Value: Extended industrial temperature rating (-40 to 105 °C) and thermal interrupt reporting enable robust operation under under-hood thermal stress without derating.

Medical Patient Monitoring Devices

Smart Home Energy Gateways

Use Scenario: Powering ECG/SpO₂ sensor front-end, ARM Cortex-A9 application processor, Wi-Fi module, and OLED display in battery-backed portable medical equipment.

IC Role / Device Role / Timing Role: Dual-role power manager providing high-efficiency buck conversion for active operation and ultra-low-quiescent coin-cell mode (<7 µA) for long-term standby.

Use Value: Coin-cell current of 4.0–7.0 µA (typ/max) at 25 °C enables multi-year battery life in sleep mode without compromising fast wake-up latency.

Use Scenario: Managing power for Zigbee/Z-Wave radio, ARM-based gateway SoC, Ethernet PHY, and local storage in residential energy management hubs.

IC Role / Device Role / Timing Role: System-level PMIC coordinating power states across heterogeneous peripherals using I²C-controlled sequencing and individual rail enable/disable.

Use Value: Six independent LDOs (VGEN1–VGEN6) allow isolated, noise-sensitive analog rails (e.g., RF bias) and digital I/O rails to be powered from optimized sources-reducing cross-talk and EMI.

Equivalent & Alternatives

The following parts are listed as comparable options for similar power management applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MMPF0200F4AEP	Pre-programmed for i.MX 6Dual/Quad reference designs; lacks i.MX 6SX-SDB OTP mapping; identical 56-QFN EP package and electrical specs	Targets i.MX 6Dual/Quad platforms instead of i.MX 6SoloLite/Solo/DualLite; no native support for i.MX6SX-SDB power sequence	Select only if migrating from i.MX 6Dual/Quad hardware; requires revalidation of startup timing and rail dependencies
PF0100A0BNES	Legacy NXP PMIC with 3 buck + 5 LDOs; no boost regulator, no VREFDDR, no coin-cell charger; 48-QFN package	Designed for earlier i.MX 5x series; lacks DDR reference, OTG support, and modern thermal protection granularity	Use only for cost-sensitive legacy upgrades where DDR termination and USB OTG are unnecessary; PCB redesign required due to pin count and package mismatch

Compared with MMPF0200F4AEP and PF0100A0BNES, the MMPF0200F6AEPR2 uniquely combines i.MX6SX-SDB OTP configuration, integrated VREFDDR, and 600 mA boost for USB OTG-making it the only drop-in solution for new i.MX 6SoloLite/Solo/DualLite designs requiring full DDR3/LPDDR2 support and peripheral power flexibility.

Availability

MMPF0200F6AEPR2 is available at Aetrix Electronics and suitable for industrial tablets, automotive infotainment head units, and medical patient monitors requiring stable component supply, extended temperature operation (-40 to 105 °C), and pre-validated i.MX 6 reference design compatibility.

Supply support for MMPF0200F6AEPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.

The PF0200 product line was engineered specifically to deliver complete, reference-design-validated power solutions for NXP's i.MX 6 family of application processors-emphasizing configurability, thermal resilience, and seamless integration with SNVS/RTC domains.

FAQ

What is the operating temperature range for the MMPF0200F6AEPR2?

The MMPF0200F6AEPR2 is rated for an extended industrial operating ambient temperature range of -40 °C to +105 °C, validated per JEDEC standards. This range applies to the WF-type QFN package (wettable flank) and supports deployment in automotive cabin, industrial control, and medical environments where thermal stress exceeds consumer-grade limits. The device incorporates thermal interrupts (THERM110I–THERM130I) and fail-safe shutdown above 130 °C to ensure reliability within this envelope. MMPF0200F6AEPR2 performance remains stable across the full range without derating.

Does the MMPF0200F6AEPR2 support DDR memory termination?

Yes, the MMPF0200F6AEPR2 includes a dedicated DDR voltage reference block with VREFDDR (0.6–0.9 V, ±1% accuracy), VHALF (half-supply reference), and VINREFDDR (input supply) pins. This subsystem is electrically isolated from other regulators to minimize noise coupling and meets JEDEC DDR3/LPDDR2 termination requirements. The VREFDDR output drives DDR memory VTT termination networks directly, eliminating the need for external reference ICs or discrete resistor dividers in i.MX 6-based designs.

How does the coin-cell backup function work on the MMPF0200F6AEPR2?

The MMPF0200F6AEPR2 uses the LICELL pin to accept a 1.8–3.3 V coin cell, which powers the VSNVS rail (1.0–3.0 V, 400 µA) during main supply (VIN) loss. An integrated charger maintains VSNVS voltage and preserves RTC time, secure non-volatile storage, and SNVS domain state. In coin-cell mode, quiescent current is only 4.0–7.0 µA (typ/max), enabling multi-year battery life. The MMPF0200F6AEPR2 automatically switches between VIN and LICELL sources without host intervention.

Is the MMPF0200F6AEPR2 pin-compatible with other PF0200 variants?

Yes, all PF0200 variants-including MMPF0200F6AEPR2-share identical 56-pin QFN 8×8 mm wettable flank (WF-type) packaging and pinout. Mechanical and electrical pin compatibility is guaranteed across F0, F3, F4, and F6 pre-programmed versions, as well as NP (non-programmed) variants. This allows hardware reuse across different i.MX 6 processor families, with only OTP configuration differing between variants. No PCB layout change is needed when substituting MMPF0200F6AEPR2 for another PF0200 WF-type part.

What interfaces does the MMPF0200F6AEPR2 use for configuration and control?

The MMPF0200F6AEPR2 uses a standard I²C interface (pins 53 SDA and 54 SCL, 3.6 V tolerant) for full register read/write access, OTP programming, and runtime parameter adjustment. It also supports parallel GPIO control via PWRON (power-on trigger), STANDBY (low-power entry), RESETBMCU (processor reset), SDWNB (shutdown warning), and INTB (interrupt notification). These signals enable direct hardware handshaking with i.MX processors without requiring software drivers for basic power sequencing.

MMPF0200F6AEPR2 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 56-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Applications:: Converter, i.MX6

Voltage - Input:: 2.8V ~ 4.5V

Number of Outputs:: 11

Voltage - Output:: Multiple

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-HVQFN (8x8)

MMPF0200F6AEPR2 FAQ

1.How can I place an order for MMPF0200F6AEPR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MMPF0200F6AEPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MMPF0200F6AEPR2 reliable?

The price and inventory of MMPF0200F6AEPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0200F6AEPR2 is usually 5 days.

3.What payment methods are accepted for MMPF0200F6AEPR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0200F6AEPR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MMPF0200F6AEPR2?

MMPF0200F6AEPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MMPF0200F6AEPR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MMPF0200F6AEPR2?

For technical support, including MMPF0200F6AEPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0200F6AEPR2 requirements.

6.How does Aetrix verify that MMPF0200F6AEPR2 is sourced from the original manufacturer or authorized distributors?

All MMPF0200F6AEPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0200F6AEPR2 meets industry standards.

7.What is the process for return or replacement of MMPF0200F6AEPR2?

All MMPF0200F6AEPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0200F6AEPR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MMPF0200F6AEPR2 part is unused and in its original packaging.

Return procedure for MMPF0200F6AEPR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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