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NXP Semiconductors MMPF0200NPAEP
- Part No.:
- MMPF0200NPAEP
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0200NPAEP.pdf
- Description:
- IC REG CONV I.MX6 11OUT 56HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:270
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Product details
Overview
MMPF0200NPAEP from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed for i.MX 6SoloLite/Solo/DualLite application processors. It integrates up to four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one 5.0–5.15 V/600 mA boost regulator, six programmable LDOs (VGEN1–VGEN6), RTC supply with coin-cell charger, and DDR reference voltage (VREFDDR: 0.6–0.9 V). It powers full system rails including processor cores, memory, and peripherals in industrial tablets and embedded control systems.
For engineers reviewing the MMPF0200NPAEP datasheet, MMPF0200NPAEP pinout, MMPF0200NPAEP application, or MMPF0200NPAEP equivalent, this page delivers verified specifications, I²C-programmable sequencing, thermal protection thresholds (110–130 °C), OTP-based configuration flexibility, and confirmed compatibility with i.MX 6 family reference designs - all critical for low-power, multi-rail embedded power architecture validation.
Technical Context
The MMPF0200NPAEP implements a SMARTMOS-based architecture with fully integrated power devices and minimal external components. Its three-to-four configurable buck regulators support dynamic voltage scaling (DVS) across PWM, PFM, and APS modes, while the SW3 stage offers single-phase (2.5 A) or dual-output (1.25 A + 1.25 A) operation - enabling flexible rail allocation for core, IO, and memory domains.
Control is delivered via I²C interface (SCL/SDA, 3.6 V tolerant) with OTP memory storing startup sequence, timing, and voltage settings. Power logic includes dedicated signals (PWRON, STANDBY, RESETBMCU, SDWNB) for processor handshaking, thermal interrupt generation (THERM110I–THERM130I), and coin-cell backup with integrated charger - ensuring continuous SNVS domain operation during main supply interruption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V - supports Li-ion/Li-poly battery input without external pre-regulation |
| SW1A/B Output | 0.3–1.875 V / 2.5 A - supplies i.MX 6 processor core with DVS capability |
| SW2 Output | 0.4–3.3 V / 1.5 A - powers memory interfaces or peripheral subsystems |
| VREFDDR Output | 0.6–0.9 V / 10 mA - provides precision DDR termination reference compliant with JEDEC standards |
| VSNVS Output | 1.0–3.0 V / 400 µA - selectable LDO/bypass mode for secure non-volatile storage and RTC backup |
| Thermal Protection | Four thresholds: 110/120/125/130 °C with 2–4 °C hysteresis - enables staged thermal management before shutdown |
| Quiescent Current (Standby) | 270–525 µA - ensures ultra-low power retention for industrial applications operating at -40 to 85 °C |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) compatible - enables real-time rail monitoring and reconfiguration |
Pinout & Package
Package: 56-pin QFN 8×8 mm, 0.5 mm pitch, E-type (full-lead) with exposed thermal pad (EP) tied to GND for enhanced thermal dissipation (RθJB = 10 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1AIN / SW1BIN | Buck 1 input supply | Accepts 4.8 V max input; requires local 4.7 µF + 0.1 µF decoupling for stable regulation |
| SW1ALX / SW1BLX | Buck 1 switch node | High-frequency switching nodes requiring tight layout to minimize EMI and losses |
| VGEN1–VGEN6 | LDO outputs | Programmable voltage rails (e.g., VGEN4: 1.8–3.3 V / 350 mA) for audio, camera, or USB PHY |
| SCL / SDA | I²C control interface | Open-drain digital interface (3.6 V tolerant) for register read/write and fault status polling |
| PWRON / STANDBY | Processor control inputs | Enable system-level power state transitions (ON → STANDBY → OFF) with debounced timing |
| INTB / RESETBMCU | Interrupt & reset outputs | Open-drain signals (3.6 V max) for thermal fault, OCP, or power-good assertion to host processor |
| LICELL / VSNVS | Coin-cell interface | Supports 1.8–3.3 V coin cell; charges via internal circuitry and supplies SNVS domain when VIN is absent |
| EP | Thermal ground pad | Must be connected to inner/external GND planes via multiple vias to maintain TJ ≤ 125 °C |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Buck Architecture | Three-to-four independent buck outputs (SW1A/B, SW2, SW3A/B) with selectable phasing and current sharing for optimal efficiency vs. rail count trade-off |
| OTP-Based Startup Sequencing | One-Time Programmable memory stores precise power-up order, delay timing, and voltage ramp rates - eliminating external configuration hardware |
| DDR Reference Precision | VREFDDR output trimmed to ±1% over temperature - meets JEDEC DDR3/DDR4 VTT tracking requirements without external feedback |
| Multi-Mode Low-Power Operation | Four distinct states (Off/Sleep/Standby/Coin Cell) with quiescent currents from 4.0 µA to 525 µA - extends battery life in always-on edge devices |
| Integrated Coin-Cell Management | Charger + LDO/bypass VSNVS block ensures uninterrupted RTC and secure memory operation during main supply failure - no external charging IC required |
| Robust Thermal Protection | Four independently configurable thermal interrupts (110–130 °C) with hysteresis - enables predictive throttling and graceful system degradation before shutdown |
Applications
| Industrial Tablet Power System | i.MX 6-Based Medical Monitor |
|---|---|
|
Use Scenario: Powering i.MX 6DualLite SoC, LPDDR2 memory, MIPI display, and USB OTG in a fanless, sealed enclosure. IC Role / Device Role / Timing Role: Central PMIC managing core (VCOREDIG), memory (VREFDDR), IO (VGEN4), and OTG (SWBST) rails with synchronized startup and DVS coordination. Use Value: Reduces BOM by integrating 12 rails into single QFN package; eliminates discrete LDOs and external sequencers while meeting IEC 60601 leakage limits via controlled standby current (≤525 µA). |
Use Scenario: Providing regulated, low-noise power to ECG front-end ADC, touch controller, and wireless BLE module in battery-powered patient monitor. IC Role / Device Role / Timing Role: Supplies VGEN2 (250 mA @ 1.2 V) for analog sensor interface, VGEN5 (100 mA @ 3.3 V) for BLE radio, and VSNVS (3.0 V) for RTC backup during battery swap. Use Value: Ensures <10 µV RMS noise on VGEN2 rail for 24-bit ECG accuracy; coin-cell autonomy >72 hours via 4.0 µA coin-cell mode current; thermal interrupts prevent overheating in confined chassis. |
| Home Energy Gateway | Automotive Infotainment Cluster |
|
Use Scenario: Managing power for Zigbee/Wi-Fi SoC, LCD backlight driver, and smart meter interface in residential energy hub. IC Role / Device Role / Timing Role: Delivers VGEN3 (100 mA @ 3.3 V) for RF transceiver, VGEN6 (200 mA @ 3.3 V) for backlight LED driver, and SWBST (5.1 V @ 600 mA) for USB-C PD negotiation. Use Value: Boost regulator's OTG support enables field firmware updates via USB; programmable soft-start prevents inrush current tripping upstream PoE injectors. |
Use Scenario: Powering i.MX 6Solo processor, HDMI transmitter, and CAN transceiver in automotive dashboard display unit. IC Role / Device Role / Timing Role: Generates VCORE (3.6 V), VGEN1 (1.1 V for GPU), and VREFDDR (0.75 V) with automotive-grade thermal response (105 °C extended temp support in F0ANES variant). Use Value: Matches i.MX 6Solo's automotive qualification path; VREFDDR precision ensures HDMI compliance; thermal interrupts trigger display dimming before critical junction temperature (125 °C) is reached. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMPF0200F6AEP | Pre-programmed OTP for i.MX6SX-SDB reference design; fixed startup sequence and rail voltages | Targeted for i.MX 6SoloX evaluation; lacks field-programmability of MMPF0200NPAEP | Select when using i.MX 6SoloX and requiring validated, out-of-box power configuration |
| MMPF0200F0ANES | Same functionality with WF-type (wettable flank) QFN and -40 to 105 °C rating; OTP pre-programmed as F0 | Qualified for extended industrial environments; not consumer-grade like MMPF0200NPAEP | Choose for high-reliability applications requiring automotive-adjacent thermal robustness and solder inspection capability |
Compared with MMPF0200NPAEP, MMPF0200F6AEP offers plug-and-play integration with i.MX 6SoloX but forfeits customization, while MMPF0200F0ANES trades consumer qualification for extended temperature range and wettable flank packaging - making MMPF0200NPAEP optimal for cost-sensitive, field-configurable i.MX 6SoloLite/DualLite designs.
Availability
MMPF0200NPAEP is available at Aetrix Electronics and suitable for industrial tablets, medical monitors, and home energy gateways requiring stable component supply, long-term lifecycle support, and guaranteed traceability for ISO 13485 and IEC 62304 compliance.
Supply support for MMPF0200NPAEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF0200 product line was engineered specifically to deliver integrated, configurable power solutions for NXP's i.MX 6 family - reducing system complexity, improving power efficiency, and accelerating time-to-market for embedded Linux and Android platforms.
FAQ
What is the primary target processor platform for the MMPF0200NPAEP?
The MMPF0200NPAEP is explicitly designed for NXP's i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite application processors. It supports full power sequencing, dynamic voltage scaling, and DDR reference generation required by these SoCs - with reference designs and pre-validated configurations available directly from NXP. The MMPF0200NPAEP integrates all necessary rails to replace discrete power solutions in i.MX 6-based systems.
Does the MMPF0200NPAEP include OTP memory, and how is it used?
Yes, the MMPF0200NPAEP contains One-Time Programmable (OTP) memory used to store startup configuration, including power-up sequence order, voltage levels, timing delays, and regulator enable states. As an "NP" (non-programmed) variant, the MMPF0200NPAEP allows customers to customize and burn their own configuration - unlike pre-programmed variants such as MMPF0200F6AEP. This enables field-specific optimization without hardware changes.
How does the MMPF0200NPAEP support DDR memory termination?
The MMPF0200NPAEP provides a dedicated VREFDDR output (0.6–0.9 V, ±1% tolerance) with 10 mA drive capability, specifically engineered to meet JEDEC DDR3/DDR4 VTT reference requirements. It derives its accuracy from an internal trimmed bandgap and supports external VHALF and VINREFDDR inputs for improved tracking - eliminating need for external resistive dividers or op-amp buffers in DDR memory subsystems.
What thermal protection features does the MMPF0200NPAEP offer?
The MMPF0200NPAEP features four programmable thermal interrupt thresholds (110 °C, 120 °C, 125 °C, and 130 °C), each with 2–4 °C hysteresis, plus a hard thermal shutdown at 130–150 °C. These interrupts (THERM110I–THERM130I) are reported via I²C register INTSENSE0 and can trigger system-level responses - such as CPU throttling or display dimming - before catastrophic thermal failure occurs in the MMPF0200NPAEP or host SoC.
Can the MMPF0200NPAEP operate from a coin cell alone?
Yes, the MMPF0200NPAEP supports true coin-cell-only operation in its Coin Cell mode, drawing only 4.0–7.0 µA typical current at 25 °C. In this mode, VSNVS is sourced from LICELL (1.8–3.3 V), while all other regulators are disabled - sustaining RTC, secure non-volatile storage, and wake-up logic indefinitely. The integrated coin-cell charger maintains battery health when main supply (VIN) is present.
MMPF0200NPAEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 11
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-HVQFN (8x8)
MMPF0200NPAEP FAQ
1.How can I place an order for MMPF0200NPAEP through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0200NPAEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0200NPAEP reliable?
The price and inventory of MMPF0200NPAEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0200NPAEP is usually 5 days.
3.What payment methods are accepted for MMPF0200NPAEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0200NPAEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0200NPAEP?
MMPF0200NPAEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0200NPAEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0200NPAEP?
For technical support, including MMPF0200NPAEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0200NPAEP requirements.
6.How does Aetrix verify that MMPF0200NPAEP is sourced from the original manufacturer or authorized distributors?
All MMPF0200NPAEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0200NPAEP meets industry standards.
7.What is the process for return or replacement of MMPF0200NPAEP?
All MMPF0200NPAEP units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0200NPAEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0200NPAEP part is unused and in its original packaging.
Return procedure for MMPF0200NPAEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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