NXP Semiconductors MMPF0200NPAEPR2
- Part No.:
- MMPF0200NPAEPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0200NPAEPR2.pdf
- Description:
- IC REG CONV I.MX6 11OUT 56HVQFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,039
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Product details
Overview
MMPF0200NPAEPR2 from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite application processors. It integrates up to four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one 5.0–5.15 V / 600 mA boost regulator, six programmable LDOs (VGEN1–VGEN6), RTC supply with coin-cell charger, DDR reference (VREFDDR: 0.6–0.9 V), and I²C-controlled dynamic voltage scaling - enabling full-system power delivery in tablets, industrial control, and medical monitoring.
For engineers reviewing the MMPF0200NPAEPR2 datasheet, MMPF0200NPAEPR2 pinout, MMPF0200NPAEPR2 application, or MMPF0200NPAEPR2 equivalent, key selection criteria include OTP-configurable startup sequencing, thermal protection thresholds (110–130 °C), quiescent current as low as 4.0 μA in coin-cell mode, and support for i.MX 6 processor-specific power states including Standby, Sleep, and Off modes with programmable rail enable/disable timing.
Technical Context
The MMPF0200NPAEPR2 implements a SMARTMOS-based architecture with fully integrated power devices and minimal external components. Its three-to-four-buck topology supports flexible configuration: SW1A/B operates as dual-phase (2.5 A total) or independent outputs; SW3A/B can be single-phase (2.5 A) or split into two 1.25 A rails; SW2 delivers 1.5 A at 0.4–3.3 V. All bucks support PWM/PPM/APS modes, programmable soft-start, OCP with fault interrupt, and DVS for processor core voltage adaptation.
Control is implemented via I²C interface (SCL/SDA, 3.6 V tolerant) with OTP memory storing boot configuration, startup sequence, voltage levels, and timing. The device includes dedicated logic interfaces (PWRON, STANDBY, RESETBMCU, SDWNB, INTB), thermal monitoring (THERM110I–THERM130I interrupts), and bias/reference generation (16 MHz RC oscillator, 32 kHz clock, VCOREREF, VHALF). VSNVS provides selectable 1.0–3.0 V output from VIN or coin cell, with integrated charging circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V main supply (VIN); supports brown-out detection and UVLO recovery |
| Buck Regulator Count | Configurable 3–4 independent outputs: SW1A/B (2.5 A), SW2 (1.5 A), SW3A/B (2.5 A total or 1.25 A × 2) |
| Boost Output | 5.0–5.15 V @ 600 mA; supports USB OTG functionality with PFM/Auto mode |
| LDO Count & Range | Six programmable LDOs: VGEN1 (0.8–1.55 V, 100 mA), VGEN2 (0.8–1.55 V, 250 mA), VGEN3–VGEN6 (1.8–3.3 V, 100–350 mA) |
| VREFDDR Output | 0.6–0.9 V @ 10 mA; precision DDR termination reference with VINREFDDR input and VHALF half-supply bias |
| Quiescent Current | 4.0 μA (coin-cell mode, 25 °C); 270 μA (Standby mode, all rails active except boost) |
| Thermal Protection | Four programmable thresholds: THERM110I (100–120 °C), THERM120I (110–130 °C), THERM125I (115–135 °C), THERM130I (120–140 °C); shutdown at ≥140 °C |
Pinout & Package
Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch), EP suffix (E-type), wettable flank not applicable - this is the consumer-grade variant with exposed thermal pad (EP) tied to GNDREF for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB (Pin 1) | Open-drain interrupt output | Signals PMIC events (thermal fault, OCP, startup completion) to host processor; requires external pull-up |
| PWRON (Pin 56) | Digital input | Active-low power-on request from processor; initiates boot sequence when asserted |
| STANDBY (Pin 4) | Digital input | Enables low-power standby state; triggers rail reconfiguration and clock gating per OTP settings |
| RESETBMCU (Pin 3) | Open-drain reset output | Drives processor reset line; configurable as Power Good signal for system-level sequencing |
| SCL/SDA (Pins 54/53) | I²C interface | Standard-mode (100 kHz) and fast-mode (400 kHz) communication for register read/write and runtime reconfiguration |
| VIN (Pin 50) | Main power input | Primary 2.8–4.5 V supply feeding all regulators; bypassed with ≥4.7 μF ceramic + 0.1 μF decoupling |
| EP (Exposed Pad) | Thermal/Ground plane | Must be connected to inner/outer ground planes via multiple vias to maintain TJ ≤ 125 °C under full load |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | Enables precise voltage ramp timing and inter-rail phasing without firmware intervention - critical for i.MX 6 core/boot ROM requirements |
| Dynamic voltage scaling (DVS) | Real-time adjustment of SW1A/B and SW2 output voltages via I²C to match processor performance states (e.g., ARM Cortex-A9 frequency scaling) |
| VSNVS dual-source LDO/switch | Delivers 1.0–3.0 V to SNVS domain from either main VIN or coin cell; maintains RTC and secure memory during main power loss |
| Integrated coin-cell charger | Charges Li/MnO₂ coin cells (1.8–3.3 V) with current limiting and end-of-charge detection - eliminates need for external charging IC |
| Thermal interrupt hierarchy | Four independent temperature alerts (110/120/125/130 °C) allow staged system response (e.g., throttle CPU before shutdown) |
| VREFDDR precision reference | 0.6–0.9 V output with ±1% accuracy over temp ensures stable DDR3/DDR4 termination, reducing signal integrity risk in high-speed memory interfaces |
Applications
| Tablet Power Management | Industrial HMI Control Panel |
|---|---|
Use Scenario: Portable tablet with i.MX 6DualLite SoC, dual-display interface, MIPI camera, and USB OTG. IC Role / Device Role / Timing Role: Central PMIC supplying core (VCOREDIG/VCORE), DDR (VREFDDR), I/O (VGEN1–VGEN6), and OTG (SWBST) rails with synchronized startup and DVS coordination. Use Value: Single-chip solution reduces BOM count by 12+ discrete regulators; OTP-programmed sequence ensures reliable boot across battery voltage range (3.0–4.2 V). | Use Scenario: Ruggedized human-machine interface panel operating in -40 to 85 °C ambient with isolated CAN/Ethernet connectivity. IC Role / Device Role / Timing Role: Primary power controller delivering regulated supplies to i.MX 6Solo processor, display backlight driver, CAN transceiver, and isolated Ethernet PHY. Use Value: Coin-cell backup (LICELL → VSNVS) preserves RTC and secure boot keys during mains failure; thermal interrupts trigger fan control before derating. |
| Medical Patient Monitor | Home Energy Gateway |
Use Scenario: Battery-powered bedside monitor with ECG front-end, OLED display, Wi-Fi, and Bluetooth LE. IC Role / Device Role / Timing Role: Configured with SW1A/B for Cortex-A9 core (0.9–1.2 V), SW2 for DDR (1.5 V), VGEN4 for audio codec (3.3 V), and VREFDDR for memory interface. Use Value: Ultra-low 4.0 μA coin-cell mode extends backup runtime >30 days; programmable soft-start prevents inrush-induced sensor noise during wake-up. | Use Scenario: Smart home energy gateway with i.MX 6SoloLite, Zigbee/Thread radio, and local storage (eMMC/NAND). IC Role / Device Role / Timing Role: Powers processor, wireless SoCs, and flash memory with independent rail control - VGEN2 drives Zigbee RF section, VGEN5 powers NAND I/O. Use Value: Six LDOs eliminate need for external low-noise regulators near sensitive RF/analog blocks; I²C runtime tuning adapts to varying load profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PF0100A0B0ES | 3-channel buck + 4 LDOs; no boost, no VREFDDR, no coin-cell charger; smaller 40-pin QFN | Limited to simpler i.MX 6 designs without DDR termination or OTG; lacks SNVS backup capability | Select when system requires only core + I/O rails and cost/size constraints preclude 56-pin package |
| RT5782AZSP | 4-buck + 3-LDO PMIC; 5 V boost; no OTP, no VREFDDR, no coin-cell support; 40-pin QFN | Requires external sequencing logic and DDR reference IC; suitable for non-i.MX platforms with standard I²C configuration | Choose for non-NXP SoC designs where OTP boot flexibility is unnecessary and thermal budget allows higher RθJA |
Compared with PF0100A0B0ES and RT5782AZSP, the MMPF0200NPAEPR2 uniquely integrates DDR reference, coin-cell charging, and OTP-programmable sequencing - making it the only drop-in solution for i.MX 6Solo/DualLite systems requiring guaranteed boot reliability, memory interface stability, and long-term RTC retention.
Availability
MMPF0200NPAEPR2 is available at Aetrix Electronics and suitable for tablets, industrial HMI control panels, and medical patient monitors requiring stable component supply across extended temperature ranges (-40 to 85 °C) and long product lifecycles.
Supply support for MMPF0200NPAEPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF0200 product line was engineered specifically to address the complex, multi-rail, low-quiescent-power requirements of NXP's i.MX 6 family - delivering tightly coupled power sequencing, DDR reference accuracy, and robust thermal management in a single die.
FAQ
What is the primary application processor family supported by the MMPF0200NPAEPR2?
The MMPF0200NPAEPR2 is explicitly designed for NXP's i.MX 6 series, including i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite processors. Its OTP configuration, rail voltage ranges (e.g., VCOREDIG at 1.5 V, VREFDDR at 0.6–0.9 V), and I²C register map align directly with i.MX 6 boot ROM requirements and power state transitions. The MMPF0200NPAEPR2 is validated with NXP reference designs like i.MX6SX-SDB and supports full system-level power sequencing out of the box.
Does the MMPF0200NPAEPR2 include built-in DDR memory reference voltage generation?
Yes, the MMPF0200NPAEPR2 integrates a dedicated DDR voltage reference block (VREFDDR) that delivers 0.6–0.9 V at up to 10 mA with ±1% accuracy over temperature. It uses VINREFDDR as input and VHALF as half-supply bias to ensure stability. This eliminates the need for an external DDR termination IC in i.MX 6-based designs using DDR3 or LPDDR2 memory, and is a distinguishing feature versus alternatives like RT5782AZSP which lack VREFDDR.
How does the MMPF0200NPAEPR2 handle power loss and maintain RTC functionality?
The MMPF0200NPAEPR2 maintains RTC operation during main power loss via its VSNVS rail and integrated coin-cell charger. When VIN drops below UVLO, VSNVS automatically switches to LICELL input (1.8–3.3 V), delivering 1.0–3.0 V to the i.MX 6's SNVS domain. The LICELL pin supports charging of Li/MnO₂ coin cells with current limiting and end-of-charge detection - ensuring continuous RTC timekeeping and secure key storage without external circuitry.
What thermal protection features are implemented in the MMPF0200NPAEPR2?
The MMPF0200NPAEPR2 implements four programmable thermal interrupt thresholds (THERM110I to THERM130I) at 110–130 °C with 2–4 °C hysteresis, plus a hard thermal shutdown at ≥140 °C. These interrupts are reported via INTB and readable in INTSENSE0 register. The device also features debounced thermal protection (8 ms) to prevent false trips from transient spikes. This layered approach enables staged system responses - such as throttling SW1A/B before initiating full shutdown - critical for industrial and medical applications.
Is the MMPF0200NPAEPR2 pin-compatible with other PF0200 variants like MMPF0200F6AEP?
Yes, all PF0200 variants - including MMPF0200NPAEPR2, MMPF0200F6AEP, and MMPF0200F0ANES - share identical 56-pin QFN (8×8 mm) mechanical and electrical pinouts. Differences lie solely in OTP programming (NP = unprogrammed; F0/F3/F4/F6 = pre-programmed for specific i.MX 6 configurations) and qualification tier (Consumer vs. Extended Industrial temperature grade). No PCB layout changes are required when substituting between these variants.
MMPF0200NPAEPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 11
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-HVQFN (8x8)
MMPF0200NPAEPR2 FAQ
1.How can I place an order for MMPF0200NPAEPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0200NPAEPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0200NPAEPR2 reliable?
The price and inventory of MMPF0200NPAEPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0200NPAEPR2 is usually 5 days.
3.What payment methods are accepted for MMPF0200NPAEPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0200NPAEPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0200NPAEPR2?
MMPF0200NPAEPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0200NPAEPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0200NPAEPR2?
For technical support, including MMPF0200NPAEPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0200NPAEPR2 requirements.
6.How does Aetrix verify that MMPF0200NPAEPR2 is sourced from the original manufacturer or authorized distributors?
All MMPF0200NPAEPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0200NPAEPR2 meets industry standards.
7.What is the process for return or replacement of MMPF0200NPAEPR2?
All MMPF0200NPAEPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0200NPAEPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0200NPAEPR2 part is unused and in its original packaging.
Return procedure for MMPF0200NPAEPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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