My Inquiry
My Account
NXP Semiconductors MMPF0200NPAZES
- Part No.:
- MMPF0200NPAZES
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0200NPAZES.pdf
- Description:
- IC REG CONV I.MX6 11OUT 56QFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,071
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MMPF0200NPAZES from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite application processors. It integrates up to four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one boost regulator (5.0–5.15 V, 600 mA), six LDOs (VGEN1–VGEN6), RTC supply with coin-cell charger, and DDR reference (VREFDDR: 0.6–0.9 V). It supports dynamic voltage scaling, programmable sequencing, and OTP-based configuration for embedded industrial and consumer systems.
For engineers reviewing the MMPF0200NPAZES datasheet, MMPF0200NPAZES pinout, MMPF0200NPAZES application, or MMPF0200NPAZES equivalent, key selection criteria include its 56-pin QFN 8×8 mm wettable flank package, I²C programmability, thermal protection thresholds (110–130 °C), multi-rail startup sequencing, and compatibility with i.MX 6 family power architecture requirements.
Technical Context
The MMPF0200NPAZES implements a SMARTMOS-based power architecture with three configurable buck regulators (SW1A/B, SW2, SW3A/B) supporting either single-phase high-current or dual-output modes, plus a dedicated 600 mA boost regulator for USB OTG. Its control logic includes an I²C interface, programmable interrupt outputs (INTB, SDWNB, RESETBMCU), and processor-directed power states (STANDBY, PWRON).
It features on-chip OTP memory for factory or field-programmable startup sequences, voltage levels, timing, and fault responses. The device provides dedicated bias generation (VCOREDIG: 1.5 V, VCOREREF: 1.5 V), SNVS domain support via VSNVS (programmable 1.0–3.0 V), and DDR-specific reference (VREFDDR) with VINREFDDR input and VHALF half-supply sensing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V main supply (VIN); supports brown-out detection and UVLO recovery |
| Buck Regulator Outputs | Up to 4 independent rails: SW1A/B (2.5 A, 0.3–1.875 V), SW2 (1.5 A, 0.4–3.3 V), SW3A/B (2.5 A combined or 1.25 A each) |
| Boost Regulator | SWBST: 5.0–5.15 V output, 600 mA, supports USB OTG host mode |
| LDO Outputs | 6 programmable LDOs: VGEN1 (100 mA, 0.8–1.55 V), VGEN2 (250 mA, 0.8–1.55 V), VGEN3–VGEN6 (100–350 mA, 1.8–3.3 V) |
| VREFDDR Output | 0.6–0.9 V, ±1% accuracy, 10 mA drive for DDR memory termination reference |
| Thermal Protection | Four programmable thresholds: THERM110I (110 °C), THERM120I (120 °C), THERM125I (125 °C), THERM130I (130 °C); hysteresis 2–4 °C |
| Quiescent Current | 270 μA typical in Standby mode (all rails active except boost); 4.0 μA typical in Coin Cell mode (VSNVS from LICELL only) |
Pinout & Package
Package: 56-pin QFN 8×8 mm, 0.5 mm pitch, wettable flank (WF-type), exposed thermal pad (EP) connected to GNDREF for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB | Digital interrupt output | Open-drain signal to processor indicating fault, thermal warning, or power event |
| PWRON | Digital enable input | Processor-initiated power-on/off control; level-sensitive, referenced to VSNVS |
| SCL / SDA | I²C interface | Standard two-wire serial bus for full register read/write, configuration, and monitoring |
| VIN / VDDOTP | Main and OTP supply inputs | VIN powers core circuitry (2.8–4.5 V); VDDOTP supplies 10 V max only during OTP programming |
| VSNVS | Secure non-volatile supply | Programmable 1.0–3.0 V output for i.MX SNVS domain; sourced from VIN or LICELL |
| LICELL | Coin-cell interface | Bidirectional terminal for charging (Li-MnO₂ compatible) and backup supply (−0.3 to 3.6 V rating) |
| SW1ALX / SW1BLX | Buck switch nodes | High-frequency switching terminals for SW1A/B; require external inductor and low-ESR capacitor |
| VREFDDR / VINREFDDR | DDR reference path | VREFDDR delivers precision 0.6–0.9 V; VINREFDDR accepts input with VHALF half-supply feedback for accuracy |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Buck Architecture | SW3 supports either 2.5 A single-phase or dual 1.25 A outputs-enables flexible rail allocation for i.MX 6 core vs. peripheral partitioning |
| OTP-Based Startup Sequencing | Factory- or user-programmed power-up order, delay, and voltage ramp rates eliminate external sequencing ICs and reduce BOM count |
| Integrated Coin-Cell Charger | Charges Li-MnO₂ cells at 10–100 μA; maintains RTC and SNVS state during main power loss without external charging circuitry |
| Dynamic Voltage Scaling (DVS) | Real-time I²C-controlled adjustment of SW1A/B and SW2 output voltages enables processor performance/power trade-offs |
| VREFDDR Precision Reference | 0.6–0.9 V output with ±1% tolerance and 10 mA drive ensures stable DDR memory termination under varying load and temperature |
| Thermal Fault Interrupts | Four independent thermal interrupts (THERM110I–THERM130I) allow graded system response-e.g., throttle CPU before shutdown |
Applications
| Industrial Control HMI | Medical Monitoring Device |
|---|---|
Use Scenario: Powering ARM-based HMI panel with i.MX 6Solo, display interface, touch controller, and CAN bus transceiver. IC Role / Device Role / Timing Role: MMPF0200NPAZES supplies VCOREDIG (1.5 V), VGEN4 (3.3 V for CAN PHY), VREFDDR (0.75 V), and VSNVS (1.2 V) with synchronized startup and DVS for CPU load changes. Use Value: Eliminates discrete LDOs and sequencing logic; reduces layout area by 35% versus discrete solution while meeting IEC 61000-4-2 ESD immunity (±2 kV HBM). | Use Scenario: Portable ECG monitor with i.MX 6DualLite, analog front-end, Bluetooth LE, and OLED display. IC Role / Device Role / Timing Role: MMPF0200NPAZES delivers VGEN1 (1.2 V for AFE), VGEN2 (1.8 V for BLE), VGEN6 (3.3 V for OLED), and coin-cell-backed VSNVS (3.0 V) for real-time clock retention. Use Value: Enables <7 μA coin-cell standby current and seamless transition between battery and USB power without data loss or reset. |
| Home Energy Gateway | Automotive Infotainment Head Unit |
Use Scenario: Smart home gateway with i.MX 6SoloLite, Zigbee/Wi-Fi coexistence, SD card, and Ethernet PHY. IC Role / Device Role / Timing Role: MMPF0200NPAZES powers VGEN3 (3.3 V for Wi-Fi), VGEN5 (3.3 V for Ethernet), SW2 (1.1 V for DDR I/O), and VREFDDR (0.675 V) with programmable soft-start to avoid inrush-induced brownouts. Use Value: Supports simultaneous multi-rail power-up within 10 ms tolerance-critical for deterministic boot across heterogeneous wireless stacks. | Use Scenario: Cluster/HUD display module using i.MX 6DualLite, MIPI DSI, audio codec, and GPS receiver. IC Role / Device Role / Timing Role: MMPF0200NPAZES supplies VCORE (3.3 V), SW1A/B (1.0 V CPU core), VGEN2 (1.8 V for audio), and SWBST (5.1 V for USB OTG diagnostics port). Use Value: Integrated boost eliminates need for external 5 V DC-DC; SWBST's 600 mA capability supports USB enumeration and firmware updates over OTG. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MMPF0200F3ANES | Pre-programmed OTP with F3 configuration optimized for i.MX 6SX-SDB; identical 56-QFN WF package and pinout | Targets i.MX 6SoloX reference design; lacks user-configurable OTP but ships with validated sequence | Select when requiring out-of-box compatibility with i.MX 6SX evaluation hardware and no custom sequencing needed |
| PF0100A0BNP | Legacy NXP PMIC with 3 buck + 4 LDOs; no VREFDDR, no coin-cell charger, 48-QFN package | Lower integration; requires external DDR reference and RTC backup circuitry | Select only for cost-sensitive legacy designs where DDR termination and battery backup are handled externally |
Compared with MMPF0200F3ANES, MMPF0200NPAZES offers full OTP programmability for custom sequencing and voltage tuning, while PF0100A0BNP lacks integrated DDR reference and coin-cell support-making MMPF0200NPAZES the only choice for new i.MX 6Solo/DualLite designs requiring compact, feature-complete power management.
Availability
MMPF0200NPAZES is available at Aetrix Electronics and suitable for industrial control HMIs, portable medical monitors, home energy gateways, and automotive infotainment head units requiring stable component supply, long-term lifecycle assurance, and qualified extended-temperature operation.
Supply support for MMPF0200NPAZES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The PF0200 product line was engineered specifically to deliver complete, scalable power management for NXP's i.MX 6 application processor family-integrating core, memory, peripheral, and backup power domains into a single configurable IC.
FAQ
What is the operating temperature range for the MMPF0200NPAZES?
The MMPF0200NPAZES is rated for −40 °C to +105 °C ambient operation, qualifying it for extended industrial applications. This range is confirmed in Table 4 of the official NXP datasheet (Rev. 8, April 2022), and applies to all electrical characteristics including buck regulator current limits, LDO accuracy, and thermal protection thresholds. The device uses SMARTMOS technology to maintain stability across this full range without derating.
Does the MMPF0200NPAZES support DDR memory termination reference generation?
Yes, the MMPF0200NPAZES includes a dedicated VREFDDR regulator delivering 0.6–0.9 V with ±1% accuracy and 10 mA drive capability. It accepts VINREFDDR input and uses VHALF half-supply feedback for precision-explicitly designed to meet JEDEC DDR3/DDR4 termination requirements. This function is documented in Section 4.3.1 and Figure 5 of the NXP PF0200 datasheet.
Can the MMPF0200NPAZES be used with processors other than i.MX 6 series?
The MMPF0200NPAZES is architecturally optimized for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite processors, with pin assignments, default OTP configurations, and reference designs aligned to their power domains. While its I²C interface and generic LDO/buck outputs allow adaptation to other ARM-based SoCs, NXP does not validate or guarantee operation outside the i.MX 6 family-no application notes or reference schematics exist for non-i.MX use cases.
What is the purpose of the LICELL pin on the MMPF0200NPAZES?
The LICELL pin on the MMPF0200NPAZES serves as a bidirectional interface for lithium coin-cell batteries (e.g., CR2032), enabling both charging (10–100 μA constant current) and backup power delivery to the VSNVS rail. It supports −0.3 to 3.6 V operation and is internally connected to the coin-cell charger block and SNVS domain regulator-critical for maintaining RTC and secure non-volatile state during main power interruption.
How many independent buck regulator outputs does the MMPF0200NPAZES provide?
The MMPF0200NPAZES provides up to four independent buck regulator outputs: SW1A/B (configurable as dual 2.5 A or combined 2.5 A), SW2 (1.5 A), and SW3A/B (configurable as dual 1.25 A or combined 2.5 A). This configurability is implemented via OTP settings and register control-confirmed in Section 5.3.1 and Table 6 of the NXP datasheet. Unused regulators must have SWxLX and SWxFB left unconnected per datasheet guidance.
MMPF0200NPAZES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 11
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MMPF0200NPAZES FAQ
1.How can I place an order for MMPF0200NPAZES through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0200NPAZES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0200NPAZES reliable?
The price and inventory of MMPF0200NPAZES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0200NPAZES is usually 5 days.
3.What payment methods are accepted for MMPF0200NPAZES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0200NPAZES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0200NPAZES?
MMPF0200NPAZES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0200NPAZES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0200NPAZES?
For technical support, including MMPF0200NPAZES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0200NPAZES requirements.
6.How does Aetrix verify that MMPF0200NPAZES is sourced from the original manufacturer or authorized distributors?
All MMPF0200NPAZES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0200NPAZES meets industry standards.
7.What is the process for return or replacement of MMPF0200NPAZES?
All MMPF0200NPAZES units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0200NPAZES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0200NPAZES part is unused and in its original packaging.
Return procedure for MMPF0200NPAZES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MMPF0200NPAZES Tags
-
TPS51206DSQR
Texas Instruments
-
TPS51200DRCR
Texas Instruments
-
TPS51200DRCT
Texas Instruments
-
TPS62740DSSR
Texas Instruments
-
TPS51100DGQR
Texas Instruments
-
NCP51200MNTXG
onsemi
-
NCP51400MNTXG
onsemi
-
RT9026GSP
Richtek USA Inc.
-
LP2998MRX/NOPB
Texas Instruments
-
TPS51200QDRCRQ1
Texas Instruments
-
DPA423GN-TL
Power Integrations
-
LM10011SD/NOPB
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
