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NXP Semiconductors MMPF0200NPAZESR2
- Part No.:
- MMPF0200NPAZESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Special Purpose Regulators
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MMPF0200NPAZESR2.pdf
- Description:
- IC REG CONV I.MX6 11OUT 56QFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,098
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Product details
Overview
MMPF0200NPAZESR2 from NXP Semiconductors is a 12-channel configurable power management IC (PMIC) designed for i.MX 6SoloLite, i.MX 6Solo, and i.MX 6DualLite application processors. It integrates up to four buck converters (SW1A/B: 2.5 A, SW2: 1.5 A, SW3A/B: 2.5 A total), one 600 mA boost regulator (5.0–5.15 V), six programmable LDOs (VGEN1–VGEN6), RTC supply with coin-cell charger, and DDR reference voltage (VREFDDR: 0.6–0.9 V). It powers full system rails-including core, memory, and peripherals-in industrial control and medical monitoring applications.
For engineers reviewing the MMPF0200NPAZESR2 datasheet, MMPF0200NPAZESR2 pinout, MMPF0200NPAZESR2 application, or MMPF0200NPAZESR2 equivalent, key selection criteria include OTP-configurable startup sequencing, I²C-controlled dynamic voltage scaling across multiple buck/LDO outputs, thermal protection thresholds (110–130 °C), and support for coin-cell backup in SNVS domain-critical for low-power retention in i.MX-based embedded systems.
Technical Context
The MMPF0200NPAZESR2 implements a SMARTMOS-based architecture with fully integrated power devices and minimal external components. Its three-to-four-channel buck configuration supports flexible rail allocation: SW1A/B can operate as dual-phase (2.5 A combined) or independent (1.25 A each), SW2 delivers 1.5 A at 0.4–3.3 V, and SW3A/B offers either single-phase 2.5 A or split 1.25 A + 1.25 A operation-all with programmable soft-start, OCP fault interrupt, and PWM/PPM/APS mode selection.
Control logic centers on an I²C interface (SCL/SDA, 3.6 V tolerant) paired with direct GPIO signaling (PWRON, STANDBY, RESETBMCU, SDWNB, INTB) and OTP memory for persistent configuration. The device includes dedicated bias/reference blocks for 16 MHz master clock generation, trimmed bandgap (VCOREREF), VHALF half-supply reference, and VREFDDR regulation-enabling precise DDR termination without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V main supply (VIN); enables compatibility with single-cell Li-ion or Li-poly battery systems. |
| Buck Regulator Outputs | Up to 4 configurable channels: SW1A/B (2.5 A total), SW2 (1.5 A), SW3A/B (2.5 A total or 1.25 A × 2); supports DVS for processor core voltage scaling. |
| Boost Regulator | 5.0–5.15 V @ 600 mA (SWBST); provides USB OTG VBUS supply with PFM/Auto mode and OCP fault interrupt. |
| LDO Outputs | 6 programmable regulators: VGEN1 (100 mA, 0.8–1.55 V), VGEN2 (250 mA, 0.8–1.55 V), VGEN3–VGEN6 (100–350 mA, 1.8–3.3 V). |
| VREFDDR Output | 0.6–0.9 V @ 10 mA; precision DDR memory reference voltage with internal feedback, eliminating need for external resistor divider. |
| Thermal Protection | Four programmable thresholds (THERM110I to THERM130I) and fail-safe shutdown at ≥130 °C; debounced 8 ms to prevent false triggers. |
| Quiescent Current | 270 μA typical in Standby mode (all rails active except boost); 4.0 μA typical in Coin Cell mode (VSNVS powered from LICELL, VIN = 0 V). |
Pinout & Package
Package: 56-pin QFN (8 mm × 8 mm, 0.5 mm pitch, wettable flank - WF-type), with exposed thermal pad (EP) connected to GND for enhanced thermal dissipation (RθJB = 10 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1AIN / SW1BIN | Buck 1 input supply | High-current inputs for SW1A/B regulator; require local 4.7 μF + 0.1 μF decoupling per pin to minimize noise and ensure stability. |
| SW1ALX / SW1BLX | Buck 1 switch node | High-frequency switching nodes; must be routed with short, low-inductance paths to external inductors and output capacitors. |
| SW1FB | Buck 1 feedback | Analog feedback input; trace must be isolated from high-current paths and terminated directly at output capacitor to avoid regulation error. |
| VGEN1–VGEN6 | LDO outputs | Programmable analog supplies for peripherals; each requires specified ceramic output capacitance (2.2–4.7 μF) for transient response and stability. |
| VREFDDR / VINREFDDR / VHALF | DDR reference subsystem | Collectively generate precise DDR termination voltage; VHALF provides half-supply reference, VINREFDDR supplies regulator input, VREFDDR delivers final 0.6–0.9 V output. |
| SCL / SDA / VDDIO | I²C interface | 3.6 V-tolerant open-drain bus; VDDIO powers I²C logic-must be bypassed with 0.1 μF capacitor near pin to suppress digital noise coupling into analog domains. |
| LICELL / VSNVS | Coin-cell interface | LICELL accepts 1.8–3.3 V coin cell; VSNVS outputs 1.0–3.0 V (selectable) for SNVS domain-enables RTC and secure boot retention during main power loss. |
| PWRON / STANDBY / RESETBMCU | Processor control interface | Digital signals for power sequencing: PWRON initiates startup, STANDBY enters low-power state, RESETBMCU serves as open-drain reset or power-good indicator. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | Enables persistent, field-programmable power-up timing and voltage ramping-eliminates need for external sequencer or firmware initialization overhead. |
| Dual-mode buck regulation (PWM/PPM) | Switches automatically between high-efficiency PFM at light load and stable PWM at full load-optimizes efficiency across 1 μA to 2.5 A output range. |
| Integrated DDR reference (VREFDDR) | Delivers factory-trimmed 0.6–0.9 V with ±1% accuracy over temperature-replaces discrete resistor-divider networks and improves DDR signal integrity. |
| Coin-cell charger + VSNVS LDO/switch | Charges backup cell while main supply is present; VSNVS dynamically selects VIN or LICELL source-ensures continuous RTC and secure memory operation during brownouts. |
| Thermal warning interrupts (THERMxxxI) | Four independent interrupt flags (110/120/125/130 °C) allow software-initiated throttling or graceful shutdown before hardware protection triggers. |
| I²C register-mapped control | Full access to all regulator settings, fault status, thermal readings, and sequencing parameters via standard 7-bit I²C address-simplifies integration with Linux/RTOS drivers. |
Applications
| Industrial Control HMI | Medical Patient Monitor |
|---|---|
|
Use Scenario: Touchscreen-based human-machine interface in factory automation panels requiring reliable low-power operation and extended runtime on backup battery. IC Role / Device Role / Timing Role: MMPF0200NPAZESR2 supplies core (VCOREDIG), I/O (VGEN2), display (VGEN4), and DDR (VREFDDR) rails while managing coin-cell-backed RTC and secure boot via VSNVS. Use Value: Integrated sequencing and OTP configuration eliminate external timing components; <4.0 μA coin-cell mode extends backup runtime beyond 5 years at 3.0 V. |
Use Scenario: Portable bedside monitor with ECG, SpO₂, and display subsystems operating under strict IEC 60601-1 safety and battery-life requirements. IC Role / Device Role / Timing Role: MMPF0200NPAZESR2 powers analog front-end (VGEN3), digital processor (VCORE/VCOREDIG), memory (VREFDDR), and audio codec (VGEN1) with independent LDO control and thermal monitoring. Use Value: Programmable OCP and thermal interrupts enable real-time fault detection; VREFDDR accuracy ensures compliant DDR timing margins for medical-grade data logging. |
| i.MX 6-Based Tablet | Home Energy Gateway |
|
Use Scenario: Consumer tablet using i.MX 6DualLite SoC with multi-rail requirements for CPU, GPU, DDR, camera, and USB OTG. IC Role / Device Role / Timing Role: MMPF0200NPAZESR2 delivers VCOREDIG (1.5 V), VGEN4 (3.3 V for USB PHY), SWBST (5.1 V for OTG), and VREFDDR (0.75 V) with synchronized DVS and startup sequencing. Use Value: Single-chip solution replaces 6+ discrete regulators; SWBST's 600 mA OTG capability eliminates need for secondary boost IC. |
Use Scenario: Smart home energy meter with Zigbee/Wi-Fi connectivity, LCD display, and tamper-proof logging-requiring long-term reliability and low standby consumption. IC Role / Device Role / Timing Role: MMPF0200NPAZESR2 powers microcontroller (VGEN2), RF module (VGEN5), display (VGEN4), and secure element (VGEN6) while maintaining RTC via LICELL during mains outage. Use Value: 270 μA Standby current enables >10-year battery life in lithium-thionyl chloride backup; OTP lock prevents unauthorized configuration changes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PF0100A0AEP | 3-channel buck (1.5 A each), no boost, no coin-cell charger, 40-pin QFN; lacks VREFDDR and VSNVS flexibility. | Targeted at simpler i.MX 5/6 designs without OTG or backup RTC; insufficient for DDR3L/DDR4 reference needs. | Select only if system requires minimal rail count and no USB OTG or battery-backed SNVS functionality. |
| RT5782AZSP | 4-buck, 3-LDO PMIC with 5 V boost (1 A), but no OTP, no VREFDDR, no coin-cell charging; uses SPI instead of I²C. | Designed for generic ARM Cortex-A/R platforms-not validated for i.MX 6; requires external DDR reference and separate RTC backup circuit. | Consider only for non-i.MX designs where SPI interface and higher boost current outweigh loss of OTP configurability and integrated DDR reference. |
Compared with PF0100A0AEP and RT5782AZSP, the MMPF0200NPAZESR2 uniquely combines OTP-programmable sequencing, integrated VREFDDR, coin-cell charging, and I²C control-making it the only drop-in solution for i.MX 6Solo/DualLite systems requiring DDR termination, USB OTG, and secure low-power retention.
Availability
MMPF0200NPAZESR2 is available at Aetrix Electronics and suitable for industrial control HMI, medical patient monitors, and i.MX 6-based tablets requiring stable component supply, long-term lifecycle support, and qualified automotive-grade thermal performance (−40 to 105 °C).
Supply support for MMPF0200NPAZESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in application processor power management.
The PF0200 product line was engineered specifically to deliver complete, validated power solutions for NXP's i.MX 6 family-integrating core, memory, peripheral, and backup power domains into a single SMARTMOS PMIC with OTP configurability.
FAQ
What is the maximum allowable input voltage for MMPF0200NPAZESR2?
The absolute maximum rating for the main input supply (VIN) is 4.8 V. Exceeding this voltage may cause permanent damage. For normal operation, the recommended input range is 2.8–4.5 V. The OTP programming supply (VDDOTP) has a separate 10 V maximum rating during fuse programming only; its DC operating limit is 7.5 V.
Does MMPF0200NPAZESR2 support DDR4 memory reference voltage requirements?
Yes, MMPF0200NPAZESR2 supports DDR4 via its VREFDDR output, which is programmable from 0.6 V to 0.9 V with ±1% accuracy over temperature and load. This meets JEDEC DDR4 VREF specification (0.5 × VDDQ ± 1%) when used with 1.2 V VDDQ, and eliminates need for external resistor dividers or calibration.
How does the coin-cell charging function work in MMPF0200NPAZESR2?
MMPF0200NPAZESR2 charges a 1.8–3.3 V coin cell connected to LICELL while main supply (VIN) is present. Charging current is internally limited and temperature-compensated. When VIN drops, VSNVS automatically switches to LICELL source-providing uninterrupted 1.0–3.0 V (user-selectable) to the i.MX SNVS domain for RTC and secure storage.
Can MMPF0200NPAZESR2 be used with processors other than i.MX 6 series?
While MMPF0200NPAZESR2 was co-developed with i.MX 6SoloLite/Solo/DualLite, its I²C interface, programmable LDOs, and flexible buck configuration allow use with other ARM-based SoCs. However, OTP configurations, reference designs, and validation data are i.MX 6-specific; custom sequencing and register mapping would be required for non-i.MX platforms.
What thermal protection features are implemented in MMPF0200NPAZESR2?
MMPF0200NPAZESR2 includes four user-accessible thermal warning interrupts (THERM110I to THERM130I) and a hard shutdown threshold at ≥130 °C. Thresholds are factory-trimmed and readable via I²C registers. The protection is debounced for 8 ms to prevent false triggers from transient spikes, and operates independently of software control.
MMPF0200NPAZESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Converter, i.MX6
- Voltage - Input:
- 2.8V ~ 4.5V
- Number of Outputs:
- 11
- Voltage - Output:
- Multiple
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MMPF0200NPAZESR2 FAQ
1.How can I place an order for MMPF0200NPAZESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MMPF0200NPAZESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMPF0200NPAZESR2 reliable?
The price and inventory of MMPF0200NPAZESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMPF0200NPAZESR2 is usually 5 days.
3.What payment methods are accepted for MMPF0200NPAZESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMPF0200NPAZESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMPF0200NPAZESR2?
MMPF0200NPAZESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMPF0200NPAZESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMPF0200NPAZESR2?
For technical support, including MMPF0200NPAZESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMPF0200NPAZESR2 requirements.
6.How does Aetrix verify that MMPF0200NPAZESR2 is sourced from the original manufacturer or authorized distributors?
All MMPF0200NPAZESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMPF0200NPAZESR2 meets industry standards.
7.What is the process for return or replacement of MMPF0200NPAZESR2?
All MMPF0200NPAZESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MMPF0200NPAZESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMPF0200NPAZESR2 part is unused and in its original packaging.
Return procedure for MMPF0200NPAZESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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