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Diodes Incorporated MMST5551-7
- Part No.:
- MMST5551-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Bipolar Transistors
- Package:
- -
- Datasheet:
-
MMST5551-7.pdf
- Description:
- TRANS NPN 160V 0.2A SC70-3
- Quantity:
- Payment:
- Shipping:
Inventory:1,060
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Product details
Overview
MMST5551-7 from Diodes Incorporated is a 160V NPN small-signal transistor in SOT323 package, designed for low-power amplification and switching applications. It delivers VCEO = 160 V, IC = 200 mA, hFE = 80–250 (at IC = 1–50 mA), fT ≥ 100 MHz, and VCE(sat) ≤ 0.20 V at IC = 50 mA. It is used in compact signal conditioning stages of industrial sensor interfaces and portable battery-powered logic drivers.
For engineers reviewing the MMST5551-7 datasheet, MMST5551-7 pinout, MMST5551-7 application, or MMST5551-7 equivalent, key selection criteria include its 160V breakdown rating, ultra-small SOT323 footprint, JEDEC-qualified reliability, and complementary pairing with MMST5401 for push-pull configurations in space-constrained analog front-ends.
Technical Context
This NPN bipolar junction transistor uses epitaxial planar die construction to ensure stable gain and low leakage across temperature. Its 160V VCEO and 180V VCBO support operation in medium-voltage bias networks, while fT ≥ 100 MHz enables use in audio-frequency amplifiers and digital switching up to ~30 MHz.
The device operates over –55°C to +150°C and meets JEDEC high-reliability standards. Its 200 mW power dissipation and 625°C/W RθJA are specified on minimum-pad FR4 layouts, making thermal design predictable in low-power PCBs without heatsinking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 160 V - Maximum collector-emitter voltage before breakdown; supports rail-to-rail signal swing in 12–48V industrial control circuits. |
| IC | 200 mA - Continuous collector current limit; sufficient for driving LEDs, small relays, or logic-level interface buffers. |
| hFE | 80–250 - DC current gain range at 1–50 mA; enables predictable base drive sizing in linear amplifier and saturated switch designs. |
| fT | 100–300 MHz - Transition frequency; ensures usable gain in audio preamps and RF detector stages up to 30 MHz. |
| VCE(sat) | ≤ 0.20 V at IC = 50 mA - Low saturation voltage minimizes conduction loss and self-heating in switching applications. |
| ESD HBM | 4,000 V - Human Body Model robustness; reduces risk of handling damage during manual assembly or prototyping. |
Pinout & Package
Package: SOT323 - ultra-small surface-mount plastic package (2.15 mm × 2.10 mm × 0.95 mm), weight ≈ 0.006 g, UL 94V-0 rated, moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Emitter) | E | Current sink terminal; connects to ground or low-impedance return path in common-emitter configurations. |
| 2 (Base) | B | Control input; requires ~1.0 V forward bias and precise current limiting (e.g., via series resistor) to achieve target IC. |
| 3 (Collector) | C | Current source terminal; ties to load or supply rail; handles full switched current and voltage stress in active/saturation modes. |
Key Features
| Feature | Design Value |
|---|---|
| Epitaxial planar die | Ensures consistent hFE distribution and low leakage (ICBO ≤ 50 nA) across production lots and temperature extremes. |
| Ultra-small SOT323 footprint | Enables placement in dense PCB layouts-e.g., within 3 mm² area-without sacrificing thermal or electrical performance. |
| Complementary PNP pairing | Directly mates with MMST5401 for matched push-pull output stages in Class-A/B amplifiers and differential switches. |
| JEDEC-qualified reliability | Validated per AEC-Q101-equivalent stress tests; suitable for industrial equipment requiring long-term stability under thermal cycling. |
Applications
| Industrial Sensor Signal Conditioning | Portable Logic-Level Translation |
|---|---|
Use Scenario: Amplifying low-amplitude analog outputs (e.g., 10–100 mV) from RTD or thermistor bridges in programmable logic controllers. IC Role / Device Role / Timing Role: NPN common-emitter amplifier configured for fixed-gain DC-coupled amplification with minimal offset drift. Use Value: High hFE consistency and low VCE(sat) maintain linearity and reduce self-heating error in uncooled enclosures. |
Use Scenario: Level-shifting 1.8V/3.3V microcontroller GPIO signals to drive 5V or 12V peripheral enable lines in handheld test instruments. IC Role / Device Role / Timing Role: Saturated switch operating in cutoff/saturation with <1 µs turn-on/turn-off times at IC ≤ 50 mA. Use Value: 160V VCEO provides margin against transient spikes on higher-voltage rails, improving system robustness. |
| Low-Power Audio Preamp Stage | Automotive Cabin Control Interface |
Use Scenario: First-stage amplification of microphone signals in battery-powered voice recorders or intercom units. IC Role / Device Role / Timing Role: Linear amplifier biased at IC = 1–10 mA with emitter degeneration for distortion control. Use Value: fT ≥ 100 MHz and NF ≤ 8.0 dB ensure clean gain up to 20 kHz with minimal added noise in low-supply systems. |
Use Scenario: Driving LED status indicators and small solenoid actuators in HVAC control modules inside automotive cabins. IC Role / Device Role / Timing Role: General-purpose switching element controlled by CAN/LIN bus microcontrollers with discrete I/O. Use Value: AEC-Q101-aligned qualification and –55°C to +150°C operation guarantee functionality across cabin temperature extremes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NPN small-signal transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BC847BW,115 | Lower VCEO = 45 V; hFE = 110–220; same SOT323 package and marking layout. | Suitable only for ≤30 V systems; not recommended where 160V isolation or transient margin is required. | Select when cost optimization is critical and voltage stress remains below 30 V. |
| MMBT5551 | Same electrical specs but in SOT23 package (larger footprint, higher RθJA = 650°C/W); identical die. | Preferred where board rework or hand-soldering is needed; less suitable for ultra-dense layouts. | Choose for easier assembly or legacy SOT23-compatible footprints without sacrificing performance. |
Compared with BC847BW and MMBT5551, MMST5551-7 uniquely combines 160V capability with SOT323 miniaturization and JEDEC reliability-making it optimal for next-gen space- and voltage-constrained industrial and automotive signal nodes.
Availability
MMST5551-7 is available at Aetrix Electronics and suitable for industrial sensor interfaces, portable logic translators, low-power audio preamplifiers, and automotive cabin control modules requiring stable component supply and long-term manufacturability.
Supply support for MMST5551-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
The MMST5551 belongs to Diodes' small-signal transistor product line, engineered for precision amplification and reliable switching in compact, high-reliability electronic systems-from factory automation to automotive infotainment.
FAQ
What is the maximum operating temperature for MMST5551-7?
The MMST5551-7 is rated for junction and storage temperatures from –55°C to +150°C. Its thermal resistance RθJA = 625°C/W is specified on a standard 1 oz copper FR4 PCB with minimum pad layout, enabling direct thermal modeling for ambient temperatures up to +85°C in typical 200 mW operation.
Is MMST5551-7 suitable for automotive applications?
MMST5551-7 is JEDEC-qualified for high reliability and shares process and testing alignment with AEC-Q101. While the standard part is not automotive-grade certified, Diodes offers Q-suffix variants (e.g., MMST5551Q-7-F) that meet AEC-Q101, PPAP, and IATF 16949 requirements for qualified automotive use.
How does the SOT323 package affect soldering and thermal performance?
The SOT323 package has a 0.006 g mass and 2.15 mm × 2.10 mm footprint, requiring precise stencil aperture and reflow profiling. Its RθJA = 625°C/W assumes minimum recommended copper pads on single-sided FR4; adding thermal vias or internal planes can reduce this by up to 30% in production layouts.
What is the relationship between MMST5551-7 and MMST5401?
MMST5551-7 (NPN) and MMST5401 (PNP) are complementary transistor pairs sharing identical SOT323 packaging, thermal characteristics, and gain matching. They are explicitly intended for use together in Class-B output stages, differential amplifiers, and push-pull switch configurations where matched VCEO, hFE, and switching speed are critical.
MMST5551-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- *
- Package/Case:
- -
- Packaging:
- Cut Tape (CT)
- Product Status:
- Active
- Transistor Type:
- -
- Current - Collector (Ic) (Max):
- -
- Voltage - Collector Emitter Breakdown (Max):
- -
- Vce Saturation (Max) @ Ib, Ic:
- -
- Current - Collector Cutoff (Max):
- -
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- -
- Power - Max:
- -
- Frequency - Transition:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
MMST5551-7 FAQ
1.How can I place an order for MMST5551-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for MMST5551-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MMST5551-7 reliable?
The price and inventory of MMST5551-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MMST5551-7 is usually 5 days.
3.What payment methods are accepted for MMST5551-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MMST5551-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MMST5551-7?
MMST5551-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MMST5551-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MMST5551-7?
For technical support, including MMST5551-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MMST5551-7 requirements.
6.How does Aetrix verify that MMST5551-7 is sourced from the original manufacturer or authorized distributors?
All MMST5551-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MMST5551-7 meets industry standards.
7.What is the process for return or replacement of MMST5551-7?
All MMST5551-7 units undergo pre-shipment inspection (PSI). If there is an issue with MMST5551-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MMST5551-7 part is unused and in its original packaging.
Return procedure for MMST5551-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MMST5551-7 Tags
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MMBT3906LT1G
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MMBT3904-7-F
Diodes Incorporated
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Diodes Incorporated
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BC847B,215
Nexperia USA Inc.
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