Diodes Incorporated MMSZ5252BS-7

Overview

MMSZ5252BS-7 from Diodes Incorporated is a surface-mount 24 V Zener diode in SOD-323 package, rated for 200 mW power dissipation, with nominal Zener voltage 24 V (22.8–25.2 V), test current 5.2 mA, and maximum Zener impedance 33 Ω at I_ZT; used for precision voltage regulation and overvoltage protection in low-power analog signal conditioning circuits.

For engineers reviewing the MMSZ5252BS-7 datasheet, MMSZ5252BS-7 pinout, MMSZ5252BS-7 application, or MMSZ5252BS-7 equivalent, key selection criteria include Zener voltage tolerance, dynamic impedance at specified test current, reverse leakage at VR = 18 V, thermal resistance (625 °C/W), and SOD-323 footprint compatibility with automated PCB assembly.

Technical Context

This Zener diode operates in reverse breakdown mode to maintain stable reference voltage under varying load and temperature conditions. Its planar die construction ensures consistent breakdown characteristics and low leakage (<0.1 µA at VR = 18 V).

Designed for general-purpose voltage regulation in space-constrained applications, it delivers 24 V reference with ±5% tolerance and exhibits 33 Ω dynamic impedance at 5.2 mA test current, enabling predictable clamping behavior in feedback networks and sensor biasing circuits.

Key Specifications

Pinout & Package

Package: SOD-323 - ultra-small plastic surface-mount case (2.3–2.7 mm length, 1.2–1.4 mm width), cathode indicated by band, compatible with reflow soldering and automated pick-and-place.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener regulation applications.

Compared with BZX584C24LT1G and MMBZ5252BS, MMSZ5252BS-7 offers optimal balance of miniaturization (SOD-323), thermal performance (625 °C/W on FR-4), and leakage-limited precision (0.1 µA), making it preferred for high-density, low-quiescent-current applications where footprint and long-term stability are prioritized over surge margin.

Availability

MMSZ5252BS-7 is available at Aetrix Electronics and suitable for industrial sensor signal conditioning, USB-C power delivery reference, automotive body control modules, and medical wearable battery monitoring requiring stable component supply and full RoHS/Green compliance.

Supply support for MMSZ5252BS-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The MMSZ52xxBS series belongs to Diodes' general-purpose Zener diode product line, engineered specifically for cost-sensitive, high-volume applications demanding reliable voltage reference and clamping in compact surface-mount packages.

FAQ

What is the maximum reverse voltage (V_R) at which leakage remains ≤0.1 µA?

The datasheet specifies 0.1 µA maximum reverse leakage current at V_R = 18 V. This value is measured under standard test conditions (T_A = +25°C) and reflects the device's ability to maintain high-impedance blocking behavior well below its 24 V nominal Zener voltage, supporting low-power reference applications.

Can MMSZ5252BS-7 be used in place of a 24 V Zener with tighter tolerance?

No - its guaranteed Zener voltage range is 22.8 V to 25.2 V (±5%), and no tighter binning or screening is offered for this part number. For ±1% or ±2% tolerance, consider Diodes' BZX84C24LT1G (±5%) or higher-precision references like REF5025 (2.5 V, 0.05% initial accuracy), not Zener-based alternatives.

Is the SOD-323 package compatible with standard reflow profiles?

Yes - the device is qualified for Pb-free reflow per J-STD-020D, with Moisture Sensitivity Level 1, meaning it may be stored indefinitely at ≤30°C/60% RH and processed using standard IPC/JEDEC profiles without pre-baking or special handling.

How does thermal resistance change with PCB copper area?

R_θJA = 625 °C/W is measured on a standard FR-4 board with Diodes' recommended pad layout (AP02001). Increasing copper area (e.g., thermal vias + internal planes) can reduce R_θJA by up to 30%; however, the datasheet does not provide empirical curves - thermal simulation or empirical testing is required for custom layouts.