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Monolithic Power Systems Inc. MP20073DH-LF-Z

Part No.:
MP20073DH-LF-Z
Manufacturer:
Monolithic Power Systems Inc.
Category:
Special Purpose Regulators
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Datasheet:
AetrixMP20073DH-LF-Z.pdf
Description:
IC REG CONV DDR 1OUT 8MSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,133

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Product details

Overview

MP20073DH-LF-Z from Monolithic Power Systems is a 2A sink/source DDR memory termination regulator with integrated VTT and buffered VTTREF outputs, designed for DDR2/DDR3 systems requiring precise VDDQ/2 tracking (±30mV), Kelvin sensing (VTTSEN), and fast transient response using only 20µF ceramic output capacitance. It operates from 1.3V–6.0V VDDQ input and supports ACPI-compliant notebook memory supplies.

For engineers reviewing the MP20073DH-LF-Z datasheet, MP20073DH-LF-Z pinout, MP20073DH-LF-Z application, or MP20073DH-LF-Z equivalent, key selection criteria include VTT accuracy under load (±30mV at 2A), thermal shutdown threshold (150°C), VDRV bias voltage requirement (3.3V), and MSOP-8E exposed-pad package thermal resistance (θJA = 80°C/W).

Technical Context

The MP20073DH-LF-Z implements a linear LDO architecture with dual regulation paths: one for VTT (2A sink/source) and another for VTTREF (buffered VREF/2). Its control logic is powered by VDRV (3.3V), enabling independent startup sequencing from VDDQ UVLO detection (0.9V–1.3V threshold).

Kelvin sensing via VTTSEN ensures accurate remote VTT regulation at the DDR memory termination point, while internal soft-start limits inrush current to ≤1.0A during power-up. Overcurrent protection activates at 3.0A (sink/source), derating to 1.0A if VTT drops below one-third of target voltage.

Key Specifications

ParameterValue and Actual Design Meaning
VDDQ Input Range1.3V to 6.0V - Enables direct connection to DDR2/DDR3 VDDQ rails without external level-shifting.
VTT Output Accuracy±30mV at 2A sink/source - Ensures DDR bus signal integrity within JEDEC VTT tolerance bands.
VTTREF Accuracy±15mV to ±18mV at 10mA - Provides stable reference for DDR memory input comparators.
Output Capacitance20µF (2×10µF ceramic) - Minimizes board area and eliminates need for high-ESR bulk capacitors.
Thermal Shutdown150°C with 25°C hysteresis - Prevents permanent damage during sustained high-current transients.
VDRV Supply3.3V (3V–5V range) - Powers internal logic independently of VDDQ, enabling robust enable sequencing.
Enable ThresholdVEN_H ≥ 1.4V, VEN_L ≤ 0.5V - Compatible with standard CMOS logic levels for system-level power management.

Pinout & Package

The MP20073DH-LF-Z is housed in an 8-pin MSOP with exposed thermal pad (MSOP8E), optimized for thermal performance in space-constrained DDR memory subsystems. The exposed pad must be soldered to PCB ground plane using ≥10 vias (0.3mm drill) for θJC = 12°C/W.

Pin/TerminalCircuit RoleDesign Meaning
1 DDQVDDQ input supply railConnects directly to DDR memory VDDQ; requires 10µF ceramic bypass to GND for transient current sourcing.
2 VTTMain termination output2A sink/source LDO output; connects to DDR memory VTT bus; regulated via Kelvin feedback on VTTSEN.
3 GND / Exposed PadPower and thermal groundMust connect exposed pad and pin 3 to same low-impedance ground plane for thermal dissipation and noise control.
4 VTTSENKelvin sense inputRemote feedback point; connects directly to VTT local bypass capacitor to eliminate trace IR drop error.
5 VDRVBias voltage supply3.3V supply for internal logic; decoupled with 1–4.7µF ceramic capacitor near pin.
6 REFVREF input for dividerAccepts DDR VREF (1.5V or 1.8V); internal resistor network generates precise VTTREF = VREF/2.
7 ENEnable control inputActive-high logic input; enables VTT regulator when pulled ≥1.4V; disables output and reduces quiescent current to 0.2µA.
8 VTTREFBuffered VREF/2 output10mA capable reference for DDR memory input comparators; requires 1µF ceramic bypass to analog ground.

Key Features

FeatureDesign Value
Integrated VTT + VTTREF regulationEliminates need for separate reference buffer IC and reduces BOM count in DDR2/DDR3 modules.
Kelvin sensing (VTTSEN)Compensates for PCB trace resistance between regulator and DDR memory, maintaining ±30mV accuracy at load.
Low-output-capacitance operationStable with only 20µF total ceramic capacitance - avoids large tantalum or electrolytic capacitors and saves board space.
VDDQ UVLO protectionShuts down VTT when VDDQ falls below 0.9V (rising edge), preventing erroneous termination during power ramp-down.
Thermal shutdown with hysteresis150°C trip with 25°C hysteresis ensures safe recovery without oscillation during thermal overload conditions.

Applications

Notebook DDR2/DDR3 Memory TerminationACPI-Compliant DDR Memory Subsystem

Use Scenario: Notebook motherboard supplying DDR2/DDR3 memory with dynamic VDDQ scaling and strict power budget constraints.

IC Role / Device Role / Timing Role: Dual-function termination regulator providing VTT and VTTREF with synchronized startup and shutdown per ACPI S3/S4 states.

Use Value: Reduces component count by integrating VTT LDO and VREF/2 buffer, while Kelvin sensing maintains signal integrity across temperature and load variation.

Use Scenario: Industrial embedded system requiring reliable DDR memory termination across -40°C to +85°C ambient range.

IC Role / Device Role / Timing Role: Precision linear regulator delivering stable VTT and VTTREF with ±30mV accuracy at full 2A load, supporting JEDEC-compliant DDR timing margins.

Use Value: Enables single-chip termination solution with built-in UVLO, OCL, and thermal shutdown - eliminating discrete protection circuitry.

Low-Cost DDR Memory ModuleSpace-Constrained DDR3 Memory Interface

Use Scenario: Cost-sensitive consumer electronics platform using DDR3 memory with minimal external components.

IC Role / Device Role / Timing Role: High-integration termination IC reducing bill-of-materials by replacing discrete LDO + reference + sense resistors.

Use Value: Achieves full DDR3 termination compliance using only two 10µF ceramic capacitors and no external compensation network.

Use Scenario: Ultra-thin laptop design where PCB real estate is limited and thermal management is critical.

IC Role / Device Role / Timing Role: MSOP-8E exposed-pad regulator delivering 2A VTT with θJA = 80°C/W, enabling compact layout with direct thermal coupling to ground plane.

Use Value: Exposed thermal pad and low-ESR ceramic capacitor support allow full 2A operation without heatsink or airflow dependency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR memory termination regulator applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPS51200DRCR3A sink/source capability; requires 47µF output capacitance; no integrated VTTREF buffer.Supports higher-current DDR3L/DDR4 systems but needs external reference buffering and larger output caps.Select when >2A sink/source headroom is required and board space allows larger capacitance.
RT8202MZQW1.5A max sink/source; ±40mV VTT accuracy; no Kelvin sensing; VTTREF accuracy ±25mV.Suitable for cost-optimized DDR2 designs with relaxed accuracy requirements and simpler layout.Select for legacy DDR2 platforms where ±40mV VTT tolerance is acceptable and Kelvin sensing is unnecessary.

Compared with TPS51200DRCR and RT8202MZQW, the MP20073DH-LF-Z delivers tighter VTT/VTTREF accuracy (±30mV/±15mV), integrated Kelvin sensing, and lower output capacitance requirement (20µF), making it optimal for space-constrained DDR2/DDR3 notebooks demanding JEDEC-compliant termination stability.

Availability

MP20073DH-LF-Z is available at Aetrix Electronics and suitable for notebook DDR2/DDR3 memory termination, ACPI-compliant memory subsystems, and space-constrained DDR3 interface designs requiring stable component supply and long-term lifecycle support.

Supply support for MP20073DH-LF-Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with core expertise in DC/DC conversion, LED drivers, and memory interface power solutions.

The MP20073 belongs to MPS's DDR memory power management product line, engineered specifically for low-cost, high-density DDR2/DDR3 termination with minimal external components and robust thermal performance in portable computing platforms.

FAQ

What is the minimum VDDQ voltage required to enable the MP20073DH-LF-Z?

The MP20073DH-LF-Z features VDDQ undervoltage lockout (UVLO) with an upper threshold of 0.9V (rising edge) and hysteresis of 55mV. Operation begins only when VDDQ exceeds 0.9V and the EN pin is high. Below this threshold, the VTT regulator shuts down to prevent unstable termination.

Can the MP20073DH-LF-Z operate with DDR3L (1.35V) VDDQ?

Yes - the MP20073DH-LF-Z supports VDDQ input from 1.3V to 6.0V, fully covering DDR3L's 1.35V nominal rail. Its 1.3V minimum input enables direct connection without intermediate regulation, reducing power loss and component count in low-voltage DDR memory systems.

How does Kelvin sensing improve VTT regulation accuracy?

Kelvin sensing uses dedicated VTTSEN and GND pins to measure VTT voltage directly at the DDR memory termination point, eliminating errors caused by PCB trace resistance between the regulator output and load. This ensures ±30mV accuracy at full 2A load, meeting JEDEC DDR2/DDR3 VTT tolerance specifications.

What is the purpose of the VDRV pin, and what voltage must it receive?

VDRV supplies power to the MP20073DH-LF-Z's internal control logic and must be set to 3.3V (3.0V–5.0V range). It operates independently of VDDQ, allowing reliable enable sequencing even during VDDQ ramp-up/down. A 1–4.7µF ceramic capacitor placed close to VDRV ensures stable bias under dynamic load conditions.

Does the MP20073DH-LF-Z support both DDR2 and DDR3 VREF voltages?

Yes - the MP20073DH-LF-Z accepts VREF inputs of 1.5V (DDR2) or 1.8V (DDR3) on the REF pin and internally generates VTTREF = VREF/2 with ±15mV to ±18mV accuracy. This dual-voltage compatibility enables single-design reuse across DDR2 and DDR3 memory interfaces.

What thermal design practices are required for continuous 2A operation?

For continuous 2A operation, the MSOP8E exposed pad must be soldered to a solid PCB ground plane using ≥10 thermal vias (0.3mm drill). Use 1 oz or 2 oz copper layers, and ensure the thermal pad occupies ≥80% of the package footprint. With proper layout, θJA remains ≤80°C/W, limiting junction temperature rise to <120°C at TA = 85°C.

Is the MP20073DH-LF-Z RoHS compliant and lead-free?

Yes - the "-LF" suffix in MP20073DH-LF-Z indicates RoHS-compliant, lead-free packaging per EU Directive 2011/65/EU. All MPS products meet RoHS requirements, and green status documentation is available on the Monolithic Power Systems website under Products > Quality Assurance.

MP20073DH-LF-Z Specifications

Product attributes
Attribute value
Manufacturer:
Monolithic Power Systems Inc.
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Converter, DDR
Voltage - Input:
1.3V ~ 6V
Number of Outputs:
1
Voltage - Output:
3.3V
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-MSOP-EP

MP20073DH-LF-Z FAQ

1.How can I place an order for MP20073DH-LF-Z through Aetrix?

Please submit a Request for Quotation (RFQ) for MP20073DH-LF-Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MP20073DH-LF-Z reliable?

The price and inventory of MP20073DH-LF-Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP20073DH-LF-Z is usually 5 days.

3.What payment methods are accepted for MP20073DH-LF-Z?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP20073DH-LF-Z transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MP20073DH-LF-Z?

MP20073DH-LF-Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MP20073DH-LF-Z order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MP20073DH-LF-Z?

For technical support, including MP20073DH-LF-Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP20073DH-LF-Z requirements.

6.How does Aetrix verify that MP20073DH-LF-Z is sourced from the original manufacturer or authorized distributors?

All MP20073DH-LF-Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP20073DH-LF-Z meets industry standards.

7.What is the process for return or replacement of MP20073DH-LF-Z?

All MP20073DH-LF-Z units undergo pre-shipment inspection (PSI). If there is an issue with MP20073DH-LF-Z, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MP20073DH-LF-Z part is unused and in its original packaging.

Return procedure for MP20073DH-LF-Z:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MP20073DH-LF-Z Tags

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