Monolithic Power Systems Inc. MP2013GQ-33-P
- Part No.:
- MP2013GQ-33-P
- Manufacturer:
- Monolithic Power Systems Inc.
- Package:
- 8-VDFN Exposed Pad
- Datasheet:
-
MP2013GQ-33-P.pdf
- Description:
- IC REG LINEAR 3.3V 150MA 8QFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,199
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MP2013GQ-33-P from Monolithic Power Systems is a fixed-output 3.3V, 150mA low-quiescent-current linear regulator with 2.5V–40V input range, 740mV dropout at full load, ±2% output accuracy, and thermal shutdown protection. It operates in industrial and automotive battery-powered systems where ultra-low standby power and high input voltage tolerance are required.
For engineers reviewing the MP2013GQ-33-P datasheet, MP2013GQ-33-P pinout, MP2013GQ-33-P application, or MP2013GQ-33-P equivalent, key selection criteria include quiescent current (4.4µA typ. at light load), dropout behavior under 150mA, FB pin bias current (0.98–1.52µA), thermal shutdown threshold (150°C), and QFN8 package thermal resistance (θJA = 48°C/W).
Technical Context
The MP2013GQ-33-P uses a PMOS pass transistor architecture enabling low dropout and reverse-voltage blocking via its intrinsic body diode-though external diode protection is recommended when output may exceed input. Its feedback loop references a precision 1.215V internal bandgap, delivering 3.3V output via integrated resistor divider (R1_IN = 1.72MΩ, R2_IN = 1MΩ).
Thermal regulation is implemented via a dedicated junction sensor with 20°C hysteresis; current limiting activates at ~270mA peak to protect against overload. The device achieves stability with ≥0.47µF ceramic output capacitance and requires no ESR tuning-enabling compact, low-BOM-count designs for space-constrained embedded nodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.3V ±2% (3.234V–3.366V) - ensures reliable logic-level supply for 3.3V microcontrollers and sensors. |
| Quiescent Current | 4.4µA (typ.) at IOUT < 1mA, VIN = 4.3–40V - enables multi-year battery life in always-on IoT endpoints. |
| Dropout Voltage | 740mV (typ.) at 150mA load - allows operation down to VIN = 4.04V while sustaining full rated output. |
| Input Voltage Range | 2.5V to 40V - supports direct connection to 12V/24V automotive batteries and industrial 24–36V rails without pre-regulation. |
| Thermal Shutdown | 150°C activation with 20°C hysteresis - prevents permanent damage during sustained overload or poor PCB heatsinking. |
| Package Thermal Resistance | θJA = 48°C/W (QFN8, 4-layer PCB) - enables 2.08W max continuous dissipation at 25°C ambient, supporting >100mA at 12VIN–3.3VOUT. |
| Output Capacitor Requirement | ≥0.47µF ceramic (X5R/X7R) - eliminates need for electrolytic or tantalum capacitors, reducing size and improving reliability. |
Pinout & Package
MP2013GQ-33-P is housed in a thermally enhanced QFN8 (3mm × 3mm, 0.65mm pitch) package with exposed thermal pad. The pad must be soldered to a solid ground plane for optimal thermal performance and electrical stability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IN1) | Main input voltage supply | Accepts 2.5–40V; connects directly to primary power rail; decoupling capacitor must be placed adjacent. |
| 2 (IN2) | Internal logic supply | Must be tied to IN1; powers control circuitry independently of pass element-ensures stable regulation even near dropout. |
| 3, 6, 7 (NC) | No-connect terminals | May be left floating or grounded to improve thermal conduction; no electrical function. |
| 4 (GND) | Analog and power ground reference | Low-impedance return path for load current and feedback network; must connect to same ground plane as exposed pad. |
| 5 (FB) | Feedback input | Internally biased to 1.215V; unused in fixed-3.3V version but must remain unconnected (not shorted or loaded). |
| 8 (OUT) | Regulated output | Delivers stable 3.3V; requires only ≥0.47µF ceramic capacitor to ground for stability-no ESR constraints. |
| Exposed Pad | Thermal and electrical ground | Must be soldered to ≥100mm² copper area connected to GND; accounts for >80% of heat dissipation in QFN8 package. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low quiescent current | 4.4µA typical at light load - extends shelf life and runtime in battery-backed real-time clocks and remote sensors. |
| Wide input voltage range | 2.5V to 40V - eliminates need for upstream buck converter in 12V/24V automotive and industrial power domains. |
| Low-ESR ceramic capacitor support | Stable with ≥0.47µF X5R/X7R - reduces BOM count, footprint, and failure risk versus electrolytic/tantalum alternatives. |
| Integrated thermal and current protection | 150°C shutdown + 270mA peak limit - enables robust operation in unventilated enclosures without external monitoring circuitry. |
| Precision fixed 3.3V output | ±2% accuracy over -40°C to +125°C - meets tight supply tolerance requirements for ARM Cortex-M, CAN transceivers, and ADC references. |
Applications
| Automotive Body Control Module | Industrial Wireless Sensor Node |
|---|---|
|
Use Scenario: Powering CAN transceiver, microcontroller, and LIN interface in door module with 12V battery input subject to load dump transients. IC Role / Device Role / Timing Role: Primary 3.3V LDO supplying digital logic and communication peripherals; handles input up to 40V during ISO 7637-2 pulse 5a. Use Value: Eliminates need for discrete TVS + pre-regulator stage; 740mV dropout ensures continued operation during cranking (VBAT ≥ 6.5V). |
Use Scenario: Long-life battery-powered vibration sensor node transmitting data via LoRaWAN every 15 minutes. IC Role / Device Role / Timing Role: Always-on 3.3V supply for MCU, accelerometer, and RF SoC; quiescent current dominates total system leakage. Use Value: 4.4µA IQ enables >10-year operation on a single CR123A cell (2.4Ah capacity, 10% self-discharge/year). |
| Medical Portable Infusion Pump | Railway Onboard Telematics Unit |
|
Use Scenario: Providing clean 3.3V rail to microcontroller, display driver, and motor control IC in Class II medical device powered by rechargeable Li-ion pack. IC Role / Device Role / Timing Role: Safety-critical power stage with thermal shutdown and current limiting to prevent overheating in sealed enclosure. Use Value: ±2% output accuracy ensures consistent ADC reference and motor PWM timing; 125°C max junction rating supports extended operation in warm environments. |
Use Scenario: Powering GPS receiver, cellular modem, and ARM processor in EN 50155-compliant train telemetry unit operating from 72–110V DC traction bus via intermediate 24V supply. IC Role / Device Role / Timing Role: Final-stage point-of-load regulator converting 24V to 3.3V for sensitive digital subsystems. Use Value: 48°C/W θJA enables full 150mA load without heatsink in wide-temperature (-40°C to +70°C ambient) railway cabinet. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-quiescent-current linear regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI TPS7B6733QPWPRQ1 | Higher IQ (15µA typ.), wider temp range (–40°C to +150°C), AEC-Q100 qualified | Automotive-qualified; better suited for under-hood ECUs requiring extended temperature compliance | Select if AEC-Q100 qualification and 150°C ambient operation are mandatory; accept higher IQ penalty. |
| ON Semiconductor NCP1117ST33T3G | Higher dropout (1.1V @ 150mA), higher IQ (6mA), SOT-223 package (θJA ≈ 65°C/W) | Cost-optimized general-purpose LDO; lacks ultra-low-IQ and wide-VIN capability | Select only for non-battery, non-high-VIN applications where cost outweighs efficiency and thermal performance. |
Compared with TPS7B6733QPWPRQ1, MP2013GQ-33-P delivers 3.4× lower quiescent current and 360mV lower dropout-critical for battery longevity and low-input-voltage headroom-but lacks AEC-Q100 certification. Versus NCP1117ST33T3G, it offers superior thermal performance (48 vs. 65°C/W) and 1,350× lower IQ, enabling new classes of energy-harvesting and long-life deployments.
Availability
MP2013GQ-33-P is available at Aetrix Electronics and suitable for automotive body electronics, industrial wireless sensor networks, portable medical devices, and railway telematics requiring stable component supply across extended temperature and voltage ranges.
Supply support for MP2013GQ-33-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with design centers in the US, China, and Taiwan, and global manufacturing partnerships.
The MP2013 series was developed specifically for ultra-low-power, high-input-voltage linear regulation in battery-backed and automotive systems-emphasizing quiescent current minimization, thermal resilience, and minimal external component count.
FAQ
What is the maximum continuous output current for MP2013GQ-33-P at 25°C ambient?
The MP2013GQ-33-P is rated for 150mA continuous output current. At 25°C ambient with proper PCB thermal design (4-layer board, ≥100mm² GND copper under exposed pad), it can sustain this load with junction temperature below 125°C. Derating is required above 25°C ambient per θJA = 48°C/W.
Can MP2013GQ-33-P be used with input voltages below 2.5V?
No. The absolute minimum input voltage is 2.5V per datasheet specifications. Operation below this level is not guaranteed and may result in loss of regulation, increased dropout, or undefined behavior. For sub-2.5V inputs, consider a different regulator family such as MPS MP2004x series.
Is an external feedforward capacitor required for stable operation?
No. The MP2013GQ-33-P is stable with only a ≥0.47µF ceramic output capacitor and does not require a feedforward capacitor. That capacitor is optional and used solely to reduce output noise in high-resolution ADC applications-not for stability.
How should the exposed thermal pad be connected on the PCB?
The exposed pad must be soldered to a solid, low-impedance ground plane covering ≥100mm². It must be electrically and thermally connected to the GND pin (Pin 4) through multiple vias (≥4, 0.3mm diameter) to an inner-layer ground plane. Floating or undersized pads cause thermal runaway and premature shutdown.
Does MP2013GQ-33-P provide reverse-voltage protection?
No. The internal PMOS pass transistor has a body diode that conducts from OUT to IN when VOUT > VIN. This can cause destructive reverse current if the output is held high (e.g., by a backup battery) while input is disconnected or grounded. An external Schottky diode in series with IN is required for reverse-voltage protection.
What is the FB pin current specification for MP2013GQ-33-P?
The FB pin input current is specified as 0.98–1.52µA (typ./max) at VFB = 1.3V and VIN = 6V. In the fixed-3.3V version, FB is internally connected to the divider and must remain unconnected-no external loading is permitted.
Can MP2013GQ-33-P replace MP2013GQ-50 in a 5V design?
No. MP2013GQ-33-P is factory-trimmed for 3.3V output and cannot be reconfigured. The internal feedback divider (1.72MΩ/1MΩ) sets 3.3V precisely; substituting it for a 5V part would underpower downstream 5V logic and violate voltage tolerances. Use MP2013GQ-50 for 5V applications.
MP2013GQ-33-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- -
- Package/Case:
- 8-VDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 40V
- Voltage - Output (Min/Fixed):
- 3.3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.85V @ 150mA
- Current - Output:
- 150mA
- Current - Quiescent (Iq):
- 10 µA
- Current - Supply (Max):
- 50 µA
- PSRR:
- 58dB ~ 41dB (100Hz ~ 1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-QFN (3x3)
MP2013GQ-33-P FAQ
1.How can I place an order for MP2013GQ-33-P through Aetrix?
Please submit a Request for Quotation (RFQ) for MP2013GQ-33-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP2013GQ-33-P reliable?
The price and inventory of MP2013GQ-33-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP2013GQ-33-P is usually 5 days.
3.What payment methods are accepted for MP2013GQ-33-P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP2013GQ-33-P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP2013GQ-33-P?
MP2013GQ-33-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP2013GQ-33-P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP2013GQ-33-P?
For technical support, including MP2013GQ-33-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP2013GQ-33-P requirements.
6.How does Aetrix verify that MP2013GQ-33-P is sourced from the original manufacturer or authorized distributors?
All MP2013GQ-33-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP2013GQ-33-P meets industry standards.
7.What is the process for return or replacement of MP2013GQ-33-P?
All MP2013GQ-33-P units undergo pre-shipment inspection (PSI). If there is an issue with MP2013GQ-33-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP2013GQ-33-P part is unused and in its original packaging.
Return procedure for MP2013GQ-33-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MP2013GQ-33-P Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

