Monolithic Power Systems Inc. MP3356DG-LF-P

Overview

MP3356DG-LF-P from Monolithic Power Systems is a high-voltage photo-flash charger IC with integrated 50V/0.5Ω power switch and IGBT driver, designed for xenon flash circuits in digital still cameras. It delivers 1.5A peak charging current, achieves ±2.5% output voltage accuracy at 300V, and operates from 2.8V–6V input. Its 10-pin 2×2 mm flip-chip QFN package supports compact DSC camera modules requiring fast, efficient flash capacitor charging.

For engineers reviewing the MP3356DG-LF-P datasheet, MP3356DG-LF-P pinout, MP3356DG-LF-P application, or MP3356DG-LF-P equivalent, key selection criteria include its 300V feedback threshold, 70µs max TON timer, <1µA shutdown current, integrated secondary feedback resistors, and dual-function architecture combining flyback charger control and IGBT gate drive.

Technical Context

The MP3356DG-LF-P implements a critical-conduction-mode (CRM) flyback controller with fixed 20µs TOFF below 20V output and boundary-mode operation above 20V to minimize charge time. It uses an internal 300:1 resistive divider and 1.2V reference to set 300V charge completion detection at the FB pin.

Its integrated IGBT driver provides matched 6Ω pull-up/pull-down on IGBTOUT with 40ns propagation delay and 130ns/180ns rise/fall times into 6800pF load. The SW node supports up to 50V with 0.5Ω RDS(ON), enabling low-turn-ratio transformers and reduced leakage-related losses.

Key Specifications

Pinout & Package

MP3356DG-LF-P is housed in a 10-pin, 2 mm × 2 mm flip-chip QFN package with exposed thermal pad (PGND-connected). The package supports high-density PCB layout and efficient thermal dissipation in space-constrained camera modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage photo-flash charger and IGBT driver applications.

Compared with MAX8632ETA+ and TPS61252DSGR, MP3356DG-LF-P uniquely integrates both precision 300V flyback charging and matched IGBT drive in a 2×2 mm package-reducing component count by 7+ parts and eliminating timing skew between charge completion and flash trigger.

Availability

MP3356DG-LF-P is available at Aetrix Electronics and suitable for digital still camera modules, optical film camera retrofits, compact portable imaging devices, and industrial inspection flash units requiring stable component supply and long-term production continuity.

Supply support for MP3356DG-LF-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with design centers in the US, China, and Taiwan.

The MP3356 belongs to MPS's photo-flash power management product line, engineered specifically for compact, battery-powered imaging systems requiring tightly regulated high-voltage flash charging and synchronized IGBT triggering.

FAQ

What is the function of the PG pin?

The PG (Power-Good) pin is an open-drain output that pulls low when the flash capacitor voltage reaches the 300V threshold detected at the FB pin. It serves as a hardware-ready signal to the system microcontroller, indicating that the flash is fully charged and ready for triggering. No external pull-up is required if the host processor has an internal weak pull-up; otherwise, a 10kΩ resistor to VIN is recommended.

Can MP3356DG-LF-P operate with input voltages below 2.8V?

No. The absolute minimum operating VIN is 2.8V per the Recommended Operating Conditions table. Below this, the internal UVLO circuit disables switching, and the device remains in shutdown. Attempting operation at 2.5V (the UVLO rising threshold) will not sustain regulation or deliver rated peak current due to insufficient headroom for internal bias generation and gate drive.

How does the FB pin achieve 300V tolerance without external components?

The FB pin incorporates an internal 300:1 resistive voltage divider referenced to AGND, allowing direct connection to the high-voltage secondary side of the flyback transformer. This eliminates external resistors while maintaining ±2.5% output accuracy. The internal structure withstands –60V to +350V, enabling robust operation even during transformer ringing or transient overshoot.

Is the IGBT driver compatible with all standard IGBTs?

The IGBTOUT pin is optimized for small-signal IGBTs with gate charge ≤150nC and VGE(th) ≤2.5V, such as the FGA25N120ANTD. Its 6Ω drive strength ensures full turn-on within 130ns into 6800pF, but larger IGBTs requiring >200nC gate charge may exhibit slower switching and increased losses. Always verify gate drive energy requirements against the 6Ω source/sink capability.

What thermal considerations apply to the 2×2 mm flip-chip QFN package?

The package has θJA = 80°C/W on a 4-layer PCB per JESD51-7. To maintain TJ ≤125°C at full load, the PGND thermal pad must be soldered to a ≥25 mm² copper pour connected to ≥2 internal ground planes. Without proper thermal land and vias, junction temperature can exceed 150°C within 100ms of full-load operation, triggering thermal shutdown.

Does MP3356DG-LF-P support programmable output voltage?

No. The output voltage is fixed at 300V by the internal 300:1 FB divider and 1.2V reference. There is no external resistor option or register-based adjustment. For variable-output flash chargers, consider the MPQ3362 or similar programmable alternatives - MP3356DG-LF-P is purpose-built for standardized 300V xenon flash systems.