Monolithic Power Systems Inc. MP3356DG-LF-Z

Overview

MP3356DG-LF-Z from Monolithic Power Systems is a high-voltage photo-flash charger IC with integrated 50V/0.5Ω power switch and IGBT driver, designed for xenon flash charging in digital still cameras. It delivers 1.5A peak current, achieves ±2.5% output voltage accuracy at 300V via internal 300:1 feedback divider, and operates from 2.8V–6V input. Its 10-pin 2×2 mm flip-chip QFN package supports compact DSC camera modules requiring fast, efficient flash capacitor charging.

For engineers reviewing the MP3356DG-LF-Z datasheet, MP3356DG-LF-Z pinout, MP3356DG-LF-Z application, or MP3356DG-LF-Z equivalent, key selection criteria include photoflash charge time under 3.6V input, IGBT gate drive timing (40ns propagation delay), 300V FB trip threshold, shutdown current <1µA, and thermal shutdown at 150°C with 15°C hysteresis.

Technical Context

The MP3356DG-LF-Z implements a critical conduction mode flyback controller with fixed 20µs minimum off-time below 20V output and boundary-mode operation above 20V to minimize charge time. Its internal 300:1 resistive divider references a 1.2V bandgap to set 300V charge completion at the FB pin.

It integrates dual functional blocks: a high-efficiency DC-DC charger with 50V/0.5Ω internal MOSFET and an IGBT driver with matched 6Ω pull-up/pull-down on IGBTOUT, enabling direct gate control of external xenon flash IGBTs with 130ns rise and 180ns fall times into 6800pF load.

Key Specifications

Pinout & Package

MP3356DG-LF-Z uses a 10-pin, 2 mm × 2 mm flip-chip QFN package with exposed thermal pad (PGND-connected). Pin 1 is IGBTIN; pins 9–10 are VIN; pin 5 is FB; pin 6 is EN; pin 4 is PG; pin 3 is SW; pins 7 and 8 are PGND and AGND respectively.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage photo-flash charger and IGBT driver applications.

Compared with MAX8632ETA+ and LT3495EDD, MP3356DG-LF-Z uniquely integrates both 50V/1.5A switching and matched IGBT drive in a 2×2 mm package, eliminating two external ICs and enabling faster, more accurate 300V flash charging with minimal board area.

Availability

MP3356DG-LF-Z is available at Aetrix Electronics and suitable for digital still cameras, optical film cameras, portable medical imaging devices, and industrial machine vision strobes requiring stable component supply and guaranteed long-term availability.

Supply support for MP3356DG-LF-Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, headquartered in Kirkland, Washington, with global design and support operations.

The MP3356 belongs to MPS's high-voltage flash charger product line, engineered specifically for compact, battery-powered imaging systems demanding precise 300V xenon flash control with integrated power switching and IGBT drive.

FAQ

What is the maximum output voltage the MP3356DG-LF-Z can regulate?

The MP3356DG-LF-Z regulates output voltage to 300V ±2.5% via its internal 300:1 feedback divider and 1.2V reference. The FB pin supports up to 350V input, but the regulated charge voltage is fixed at 300V unless external resistor scaling is applied - which voids the specified accuracy and is not recommended per datasheet guidance.

Can the MP3356DG-LF-Z drive IGBTs other than those specified for xenon flash?

Yes - the IGBT driver delivers 6Ω pull-up/pull-down strength with 40ns propagation delay and 130ns/180ns rise/fall times into 6800pF, making it suitable for small-signal IGBTs in pulsed-power applications up to 400V collector-emitter voltage, provided gate charge requirements stay within 100nC and layout minimizes parasitic inductance.

How does the MP3356DG-LF-Z manage charge time across varying input voltages?

It uses adaptive timing: fixed 20µs minimum off-time below 20V output to limit inrush, then transitions to boundary conduction mode above 20V. This reduces average charge time from ~3.2s at 2.8V to ~1.9s at 6V for a 47µF capacitor charged to 300V, as verified in typical performance curves.

Is the 2×2 mm flip-chip QFN package lead-free and RoHS-compliant?

Yes - the "-LF-Z" suffix denotes lead-free (Pb-free) terminations and RoHS-compliant packaging per EU Directive 2011/65/EU. The package uses NiPdAu surface finish and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) when sealed per standard tape-and-reel packaging.

What happens when the FB pin voltage exceeds 350V?

The absolute maximum rating for FB is –60V to +350V. Exceeding +350V risks permanent damage to the internal feedback comparator and resistor divider. In normal operation, the FB voltage is clamped by the flash capacitor and transformer secondary; external Zener protection is unnecessary if transformer turns ratio and output diode ratings are correctly selected per datasheet guidelines.

Does the MP3356DG-LF-Z require external compensation components?

No - the MP3356DG-LF-Z uses internal compensation optimized for critical conduction mode flyback operation with typical transformer parameters. No external RC networks or compensation pins are provided; stability is ensured across 2.8V–6V input and 300V output when using the recommended 9.8µH primary inductance and 1:8 turns ratio.

How is thermal performance managed in the 2×2 mm flip-chip package?

The package features an exposed thermal pad connected to PGND, achieving θJA = 80°C/W on a 4-layer PCB per JESD51-7. Internal thermal shutdown activates at 150°C with 15°C hysteresis, allowing safe recovery after flash bursts without external heatsinking in handheld form factors.